PAA110PLTR

PAA110L 400V, 150mA Dual Single-Pole Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage Load Current On-Resistance (max) Ratings 400 150 25 Units VP mArms / mADC  Features • • • • • • • • Current Limiting 3750Vrms Input/Output Isolation Low Drive Power Requirements 100% Solid State No EMI/RFI Generation Small 8-Pin DIP Package Flammability Rating UL 94 V-0 Surface Mount and Tape Reel Versions Available. Applications • • • • • • • • • • Telecommunications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Description PAA110L is a dual 400V, 150mA, 25 1-Form-A (normally open) relay. This performance leader provides high peak load voltage handling capability and improved peak load current handling. Integrated current-limiting circuitry limits current to 280mA at room temperature. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # PAA110L PAA110PL PAA110PLTR PAA110LS PAA110LSTR Description 8-Pin DIP (50/Tube) 8-Pin SOIC (Flatpack) (50/Tube) 8-Pin SOIC (Flatpack) (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-PAA110L-R09 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PAA110L Absolute Maximum Ratings @25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 400 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @25ºC Parameter Output Characteristics Blocking Voltage Load Current 1 Continuous Current Limiting On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 400 - - VP IL=150mA VL=400V IL ICL RON ILEAK 190 - 235 18 - 150 280 25 1 IF=0mA, V=50V, f=1MHz ton toff COUT - 0.3 0.058 25 1 0.5 - IL=150mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously load current must be derated in order not to exceed the package power dissipation value. 2 Measurement taken within one second of on-time. www.ixysic.com mArms / mADC  A ms pF R09 INTEGRATED CIRCUITS DIVISION PAA110L PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 15 10 5 0 0 1.364 0.15 0.21 0.27 0.33 0.39 Turn-On Time (ms) Device Count (N) 10 5 0 5 0.045 0.052 0.059 0.066 Turn-Off Time (ms) 0.073 Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mADC) 35 30 20 15 10 5 25 20 15 10 5 0 1.85 2.15 2.45 LED Current (mA) 10 0.45 25 15 1.55 15 Typical IF for Switch Dropout (N=50) 20 1.25 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=150mADC) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 Typical Turn-Off Time (N=50, IF=5mA, IL=150mADC) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=150mADC) 0 2.75 0.95 1.25 1.55 1.85 2.15 LED Current (mA) 2.45 17.5 18.5 19.5 20.5 21.5 On-Resistance (:) 22.5 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 448 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 0.06 0.25 0.20 0.15 0.10 0.05 1.1 -50 -25 0 25 50 Temperature (ºC) 75 100 0.05 0.04 0.03 0.02 0.01 0 0 1.0 Typical Turn-Off Time vs. LED Forward Current (IL=150mADC) 0.07 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 0.30 1.7 488 Typical Turn-On Time vs. LED Forward Current (IL=150mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 464 472 456 480 Blocking Voltage (VP) 0 5 10 15 20 25 30 35 40 Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PAA110L PERFORMANCE DATA* 1.25 Turn-Off Time (ms) I F =5mA 1.00 I F =10mA 0.75 I F =20mA 0.50 0.25 0 -40 -20 0 20 40 60 Temperature (ºC) 80 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 100 4.0 LED Current (mA) LED Current (mA) 2.5 2.0 1.5 1.0 0.5 0 20 40 60 Temperature (ºC) 80 -20 0 20 40 60 Temperature (ºC) 80 Typical IF for Switch Dropout vs. Temperature (IL=150mADC) 2.5 2.0 1.5 1.0 Maximum Load Current vs. Temperature I F =20mA I F =10mA I F =5mA 100 -20 0 20 40 60 Temperature (ºC) 80 50 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 100 Typical Load Current vs. Load Voltage (IF=5mA) 50 0 -50 Typical Leakage vs. Temperature Measured Across Pins 5&6 or 7&8 490 0.035 485 0.030 480 475 470 465 460 455 0.025 0.020 0.015 0.010 0.005 450 445 0 80 -150 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5 Load Voltage (V) 100 Leakage (PA) Blocking Voltage (VP) 150 20 40 60 Temperature (ºC) 100 Typical Blocking Voltage vs. Temperature 200 0 -100 -40 250 -20 150 3.0 100 10 -40 0 -40 15 100 0.5 0 Load Current (mA) -20 3.5 3.0 20 0 4.0 3.5 25 5 -40 Typical IF for Switch Operation vs. Temperature (IL=150mADC) Typical On-Resistance vs. Temperature (IL=150mADC, IF=5mA) 30 Load Current (mA) Turn-On Time (ms) 1.50 Typical Turn-Off Time vs. Temperature (IL=150mADC, IF=5mA) On-Resistance (:) Typical Turn-On Time vs. Temperature (IL=150mADC) -40 350 -20 0 20 40 60 Temperature (ºC) 80 100 80 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Current Limiting vs. Temperature (IF=5mA) Current (mA) 300 250 200 150 100 50 0 -40 -20 0 20 40 60 Temperature (ºC) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION PAA110L Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PAA110LS MSL 1 PAA110PL MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PAA110LS PAA110PL 250ºC 245ºC 30 seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PAA110L Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PAA110L Mechanical Dimensions PAA110L 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) PAA110PL 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) PCB Land Pattern 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 8.70 (0.3425) 1.55 (0.0610) 0.203 ± 0.013 (0.008 ± 0.0005) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) PAA110LS PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 6 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION PAA110L PAA110PLTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm PAA110LSTR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PAA110L-R09 © Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/4/2021