PAA110STR

PAA110 400V, 150mA Dual Single-Pole Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage Load Current On-Resistance (max) Ratings 400 150 22 Units VP mArms / mADC  Features • • • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays VDE Compatible FCC Compatible No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount and Tape Reel Versions Available Description PAA110 is a 400V, 150mA, 22 dual normally open (1-Form-A) optically isolated Solid State Relay. Its efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS architecture to provide 3750Vrms of input to output isolation. The optically coupled output is controlled by a highly efficient infrared LED This performance leader provides high peak load voltage handling capability and improved peak load current handling. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Ordering Information Part # PAA110 PAA110P PAA110PTR PAA110S PAA110STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PAA110-R07 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PAA110 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 400 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current 1 Continuous Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 400 - - VP t=10ms IL=150mA VL=400VP IL ILPK RON ILEAK - 15 - 150 ±400 22 1 mArms / mADC mAP  A IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 1 0.25 - IL=150mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously, then load current must be derated in order not to exceed the package power dissipation value. 1 Measurement taken within one second of on-time. www.ixysic.com ms pF R07 INTEGRATED CIRCUITS DIVISION PAA110 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 15 10 5 0 0 1.364 0.15 0.21 0.27 0.33 0.39 Turn-On Time (ms) Device Count (N) 10 5 0 5 0.05 0.07 0.09 0.11 0.13 Turn-Off Time (ms) 0.15 Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mADC) 35 30 20 15 10 5 25 20 15 10 5 0 1.35 1.65 1.95 LED Current (mA) 10 0.45 25 15 1.05 15 Typical IF for Switch Dropout (N=50) 20 0.75 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=150mADC) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 25 Device Count (N) 30 Typical Turn-Off Time (N=50, IF=5mA, IL=150mADC) Typical Turn-On Time (N=50, IF=5mA, IL=150mADC) 0 2.25 0.75 1.05 1.35 1.65 1.95 LED Current (mA) 2.25 13.1 13.7 14.3 14.9 15.5 On-Resistance (:) 16.1 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 441.5 450.5 459.5 468.5 477.5 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=150mADC) 0.35 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 0.30 0.25 0.20 0.15 0.10 1.0 -25 0 25 50 Temperature (ºC) 75 100 0.08 0.06 0.04 0 0 -50 0.10 0.02 0.05 1.1 Typical Turn-Off Time vs. LED Forward Current (IL=150mADC) 0.12 Turn-Off Time (ms) 0.40 1.7 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 1.8 486.5 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PAA110 PERFORMANCE DATA* Typical Turn-On Time vs. Temperature (IL=150mADC) 0.14 IF=5mA IF=10mA IF=20mA 0.75 0.50 0.25 0.10 0.08 0.06 0.04 0.02 -20 0 20 40 60 Temperature (ºC) 80 0 -40 100 Typical IF for Switch Operation vs. Temperature (IL=150mADC) 3.0 20 40 60 Temperature (ºC) 80 1.5 1.0 0.5 -20 0 20 40 60 Temperature (ºC) 80 2.0 1.5 1.0 5 0 -20 0 20 40 60 Temperature (ºC) 80 -150 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5 Load Voltage (V) 100 Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 0 Leakage (PA) 0.030 Blocking Voltage (VP) 0.035 475 50 470 465 460 455 -20 0 20 40 60 80 Temperature (ºC) 100 120 0.025 0.020 0.015 0.010 0.005 450 -40 100 -50 480 IF=20mA IF=10mA IF=5mA 80 50 250 100 20 40 60 Temperature (ºC) 100 300 150 0 Typical Load Current vs. Load Voltage (IF=5mA) Typical Blocking Voltage vs. Temperature Maximum Load Current vs. Temperature 200 -20 -100 -40 100 10 150 0 -40 15 -40 0.5 0 20 100 Load Current (mA) LED Current (mA) LED Current (mA) 0 2.5 2.0 Typical On-Resistance vs. Temperature (IF=5mA, IL=150mADC) 0 -20 Typical IF for Switch Dropout vs. Temperature (IL=150mADC) 3.0 2.5 Load Current (mA) On-Resistance (:) 1.00 0 -40 25 0.12 1.25 Turn-Off Time (ms) Turn-On Time (ms) 1.50 Typical Turn-Off Time vs. Temperature (IL=150mADC) -40 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION PAA110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PAA110S / PAA110P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PAA110S PAA110P 250ºC 260ºC 30 seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PAA110 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R07 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PAA110 Mechanical Dimensions PAA110 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) PAA110S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) PAA110P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION PAA110 PAA110PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm PAA110STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PAA110-R07 © Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/4/2021