PAA132

PAA132 60V, 600mA Dual Single-Pole Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current Input Control Current On-Resistance (max) Rating 60 600 2 1 Units VP mArms / mADC mA  Features • • • • • • Low Input Control Current: 2mA 3750Vrms Input/Output Isolation Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 8-Pin Package Surface Mount Tape & Reel Version Available Applications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls • Automotive Description The PAA132 Solid State Relay has two independent, single-pole, normally open (1-Form-A), relays in a single 8-pin package. It employs optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. By incorporating two independent, single-pole relays into a single 8-pin package, the PAA132 saves board space by providing a more compact design solution than two discrete single-pole relays in a variety of applications. Approvals • UL Recognized Component: File # E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # PAA132 PAA132S PAA132STR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PAA132-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PAA132 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 60 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance Input to Output 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 60 - - VP t≤10ms IL=600mA VL=60VP IL ILPK RON ILEAK - 0.85 - 600 ±2 1 1 mArms / mADC AP  VL=50V, f=1MHz ton toff COUT - 25 5 2 - ms ms pF IL = 600mA IF = 10mA VR = 5V IF IF VF IR 0.2 0.9 - 1.36 - 2 1.5 10 mA mA V A - CI/O - 3 - pF IF = 5mA, VL = 10V A If both poles operate, then the load current must be derated so that the package power dissipation value is not exceeded. Measurement taken within one second of on-time. 2 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PAA132 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) Device Count (N) 25 20 15 10 5 20 15 10 5 0 0 1.364 0.75 20 15 10 5 0 0.80 0.85 0.90 0.95 1.00 Turn-On Time (ms) 0.41 0.43 0.45 0.47 0.49 LED Current (mA) 10 5 0.29 Typical IF for Switch Dropout (N=50, IL=600mA) 0.31 0.33 0.35 0.37 0.39 Turn-Off Time (ms) 0.41 Typical On-Resistance Distribution (N=50, IF=5mA, IL=600mA) 35 30 15 10 5 25 20 15 10 5 0 0.39 15 1.05 Device Count (N) 20 Device Count (N) Device Count (N) Typical IF for Switch Operation (N=50, IL=600mA) 25 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 25 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 0 0.51 0.39 0.41 0.43 0.45 0.47 0.49 LED Current (mA) 0.83 0.51 0.84 0.85 0.86 0.87 0.88 On-Resistance (:) 0.89 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 69.0 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=80mA) 0.7 0.6 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 1.7 72.0 Typical Turn-On Time vs. LED Forward Current (IL=80mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 69.5 70.0 70.5 71.0 71.5 Blocking Voltage (VP) 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PAA132 PERFORMANCE DATA* I F = 5mA Turn-Off Time (ms) I F = 10mA -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 -40 Typical IF for Switch Operation vs. Temperature (IL=300mA) 1.2 1.2 0.6 0.4 0 -20 0 60 20 40 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) 80 Blocking Voltage (VP) 0.54 One Pole Operating 0.42 Two Poles Operating 0.24 0.18 0 20 40 60 80 Temperature (ºC) 0.7 -40 Typical IF for Switch Dropout vs. Temperature (IL=300mA) 600 0.4 100 0 20 40 60 Temperature (ºC) 80 100 Typical Load Current vs. Load Voltage (IF=2mA) 400 200 0 -200 -20 0 20 40 60 Temperature (ºC) 80 -600 -0.6 100 72 0.016 70 0.014 68 66 64 62 -0.4 -0.2 0 0.2 Load Voltage (V) 0.4 0.6 Typical Leakage vs. Temperature Measured Across Pins 5&6, 7&8 (VP=60V) 0.012 0.010 0.008 0.006 0.004 60 0.002 -40 120 -20 -400 58 -20 0.8 Typical Blocking Voltage vs. Temperature 0.60 0.12 -40 0.9 0.6 0.6 -40 1.0 100 0.8 100 Maximum Load Current vs. Temperature (IF=2mA) 0.66 Load Current (A) -20 0 -40 0.30 IF = 5mA 0.2 0.2 0.36 IF = 10mA Load Current (mA) 0.8 0.48 1.1 1.0 LED Current (mA) LED Current (mA) 1.0 Typical On-Resistance vs. Temperature (IF=2mA, IL=600mA) 1.2 Leakage (PA) Turn-On Time (ms) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Typical Turn-Off Time vs. Temperature (IL=80mA) On-Resistance (:) Typical Turn-On Time vs. Temperature (IL=80mA) -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Load Current (A) Energy Rating Curve 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PAA132 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PAA132S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PAA132S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PAA132 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PAA132 Mechanical Dimensions PAA132 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) PAA132S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 6 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PAA132 PAA132STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PAA132-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/4/2021