PAA193S

PAA193 600V, 100mA Dual Single-Pole Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 600 100 50 Units VP mArms / mADC  Features • • • • • • • 5000Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Version Available Description The PAA193 is a dual normally open (1-Form-A) solid state relay that uses optically coupled relay technology to provide an enhanced 5000Vrms input to output isolation barrier. The efficient MOSFET switches use IXYS Integrated Circuits' patented OptoMOS architecture. Highly efficient infrared LEDs provide the optically coupled control. Dual OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications. The dual relays save board space by incorporating two relays in a single 8-pin package. Approvals Applications • • • • • • • • • Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # PAA193 PAA193S PAA193STR Description 8-Lead DIP (50/tube) 8-Lead Surface Mount (50/tube) 8-Lead Surface Mount (1000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PAA193-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PAA193 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 600 5 50 1 150 800 5000 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output Conditions Symbol Min Typ Max Units IL=1A VDRM 600 - - VP t=10ms IL=100mA VL=600VP IL ILPK RON ILEAK - - 100 ±350 50 10 mArms / mADC mAP  µA IF=0mA, VL=50V, f=1MHz ton toff COUT - 50 5 5 - IL=100mA IF=5mA VR=5V IF VF IR 0.9 - 1.36 - 5 1.5 10 mA V µA VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously, then load current must be derated in order not to exceed the package power dissipation value. 2 Measurement taken within one second of on-time. 2 www.ixysic.com ms pF R05 INTEGRATED CIRCUITS DIVISION PAA193 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 15 10 10 0 0 Device Count (N) 10 5 0 0.68 0.72 0.76 0.80 0.88 Turn-On Time (ms) 0.65 0.91 1.17 1.43 LED Current (mA) 1.69 10 0.20 0.22 0.24 0.26 0.28 Turn-Off Time (ms) 0.30 Typical On-Resistance Distribution (N=50, IL=120mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0.39 15 0.92 Typical IF for Switch Dropout (N=50, IL=120mADC) 25 15 20 0 0.64 Typical IF for Switch Operation (N=50, IL=120mADC) 25 5 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 20 Device Count (N) 15 5 25 30 20 5 1.364 35 Device Count (N) Device Count (N) Device Count (N) 25 20 Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 0 1.95 0.39 0.65 0.91 1.17 1.43 LED Current (mA) 1.69 34.3 1.95 34.6 34.9 35.2 35.5 35.8 On-Resistance (:) 36.1 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 777 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 807 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=50mADC) 0.7 0.6 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 1.7 787 792 797 802 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=50mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 782 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PAA193 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 IF=5mA IF=10mA -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical IF for Switch Operation vs. Temperature (IL=50mADC) 3.0 1.5 1.0 80 60 20 -20 0 20 40 60 Temperature (ºC) 80 100 -40 0 -40 -20 0 20 40 60 Temperature (ºC) 80 Typical Load Current vs. Load Voltage (IF=5mA) 150 0 20 40 60 Temperature (ºC) 80 Maximum Load Current vs. Temperature (IF=5mA) -50 -100 -6 -4 -2 0 2 Output Voltage Drop (V) 4 6 140 120 Single Pole Operation 100 80 Two Pole Operation 60 40 0 -40 -20 0 20 40 60 80 Temperature (ºC) Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 0.030 Load Current (A) Leakage (PA) 0.035 0.025 0.020 0.015 0.010 0.005 -20 0 20 20 40 60 Temperature (ºC) 80 -20 0 20 40 60 Temperature (ºC) 80 100 100 120 80 100 900 850 800 750 700 650 600 -40 -20 0 20 40 60 Temperature (ºC) Energy Rating Curve 0.040 0 -40 30 950 20 -150 40 Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) Load Current (mA) 0 100 50 -40 100 160 50 80 0 -20 180 100 20 40 60 Temperature (ºC) 10 -40 100 0 60 1.0 0 -20 Typical On-Resistance vs. Temperature (IF=5mA, IL=50mADC Instantaneous) 80 1.5 0.5 Single Pole Operating 40 2.0 0.5 Two Poles Operating 100 On-Resistance (:) LED Current (mA) LED Current (mA) 120 2.5 2.0 Typical On-Resistance vs. Temperature (IF=5mA, IL=100mADC) 140 Typical IF for Switch Dropout vs. Temperature (IL=50mADC) 3.0 2.5 Load Current (mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -40 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=50mADC) On-Resistance (:) Typical Turn-On Time vs. Temperature (IL=50mADC) Turn-Off Time (ms) Turn-On Time (ms) PERFORMANCE DATA* 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PAA193 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PAA193S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PAA193S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PAA193 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PAA193 Mechanical Dimensions PAA193 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) PAA193S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 6 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PAA193 PAA193STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PAA193-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/4/2021