PLA140

PLA140 400V, 250mA Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 400 250 8 Units VP mArms / mADC  Features • • • • • • • • • • Low On-Resistance, High Current Handling Low Drive Power Requirements 3750Vrms Input/Output Isolation Greater Reliability than Electromechanical Relays VDE Compatible FCC Compatible No EMI/RFI Generation Flammability Rating UL 94 V-0 Small 6-Pin Package Surface Mount Tape & Reel Version Available Description The PLA140 is a single-pole normally open (1-Form-A) Solid State Relay that uses optically coupled MOSFET technology to provide 3750Vrms of input-to-output isolation. MOSFET output switches, which use IXYS Integrated Circuits' patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The PLA140’s combination of low on-resistance and high load current handling makes it suitable for a variety of industrial applications. Because Solid State Relays like the PLA140 have no moving parts, they offer faster, bounce-free switching in a more compact surface mount or though hole package than traditional electromechanical relays. Applications Approvals • Telecommunications • Telecomm Switching • Hook Switch • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls • Automotive • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part Number PLA140 PLA140S PLA140STR Pin Configuration Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1,000/Reel) Switching Characteristics of Normally Open Devices Form-A AC/DC Configuration + Control – Control Do Not Use 1 6 2 5 3 4 IF Load Do Not Use 90% Load + Control – Control Do Not Use DS-PLA140-R10 1 6 2 5 3 4 10% ILOAD DC Only Configuration ton + Load toff – Load www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION PLA140 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 400 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 400 - - VP IF=5mA IL IF=5mA , t=10ms ILPK - - 250 350 ±500 mArms / mADC mADC mAP 5.5 1.5 - 8 3 1  ILEAK - IF=0mA , VL=50V, f=1MHz ton toff COUT - 0.4 0.19 18 3 1 - IL=250mA IF=5mA VR=5V IF IF VF IR 0.2 0.9 - 0.46 0.44 1.36 - 5 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF IF=5mA , IL=250mA IF=5mA , IL=350mA VL=400VP IF=5mA, VL=10V RON µA ms pF Measurement taken within one second of on-time. www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION PLA140 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 Typical IF for Switch Operation (IL=250mA) 20 Typical On-Resistance Distribution (N=50, IF=5mA, IL=250mA) 20 20 15 10 Device Count (N) Device Count (N) Device Count (N) 25 15 10 5 15 10 5 5 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 20 15 10 5 20 20 15 10 5 0 0.13 0.15 0.17 0.19 0.21 0.23 0.25 0.27 Turn-Off Time (ms) Typical LED Forward Voltage Drop vs. Temperature Typical Turn-On Time vs. LED Forward Current (IL=100mA) 1.6 1.7 1.4 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 4.9 5.0 5.1 5.2 On-Resistance (:) 5.3 5.4 Typical Blocking Voltage Distribution (N=50, IF=0mA) 15 10 5 442 1.2 1.0 0.8 0.6 0.4 448 454 460 466 472 478 Blocking Voltage (VP) 484 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 0.26 Turn-Off Time (ms) 1.8 4.8 0 0 0.675 0.750 0.825 0.900 0.975 1.050 1.125 1.200 Turn-On Time (ms) Turn-On Time (ms) 0.24 0.22 0.20 0.18 0.2 1.1 0.0 1.0 -50 0.60 -25 0 25 50 Temperature (ºC) 75 Typical IF for Switch Operation vs. Temperature (IL=100mA) 1.4 10 20 30 LED Current (mA) 40 50 0 Typical Turn-On Time vs. Temperature (IF=5mA, IL=100mA) 0.26 1.3 Turn-On Time (ms) 0.58 0.56 0.54 0.52 0.50 0.48 0.46 0.44 -40 0.16 0 100 Turn-Off Time (ms) LED Forward Voltage Drop (V) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 25 Device Count (N) Device Count (N) 25 4.7 0.28 0.34 0.40 0.46 0.52 0.58 0.64 0.70 LED Current (mA) 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Device Count (N) 1.364 LED Current (mA) 0 0 0 1.2 1.1 1.0 0.9 0.8 0.7 0 20 40 60 Temperature (ºC) 80 100 0.5 -40 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mA) 0.24 0.22 0.20 0.18 0.16 0.6 -20 10 -20 0 20 40 60 Temperature (ºC) 80 100 0.14 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R10 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA140 PERFORMANCE DATA* 0.3 8 0.2 7 6 5 0.1 0.0 -0.1 -0.2 3 -40 -0.3 -1.5 -20 0 20 40 60 Temperature (ºC) 80 100 275 225 200 175 150 125 100 -1.0 -0.5 0.0 0.5 Load Voltage (V) 1.0 1.5 -40 Typical Load Current vs. Load Voltage DC-Only Configuration (IF=5mA) 0.35 350 2.0 0.30 325 1.6 1.4 0.20 0.15 0.10 1.2 0.05 1.0 -40 0.00 -20 0 20 40 60 Temperature (ºC) 80 Load Current (mA) 1.8 80 500 70 Leakage Current (nA) 510 490 480 470 460 450 440 -40 -20 0 20 40 60 Temperature (ºC) 80 100 20 40 60 Temperature (ºC) 80 100 300 275 250 225 200 175 0.0 100 0 375 0.1 0.2 0.3 0.4 Load Voltage (V) 0.5 150 -40 0.6 Typical Leakage vs. Temperature Measured Across Pins 4&6 (VL=400V) -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s Energy Rating Curve 1.2 60 Load Current (A) Load Current (A) 0.40 2.2 0.25 -20 Maximum Load Current vs. Temperature - DC-Only Configuration (IF=5mA) 2.4 Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) Maximum Load Current vs. Temperature - AC/DC Configuration (IF=5mA) 250 4 Typical On-Resistance vs. Temperature DC-Only Configuration (IF=5mA, IL=100mA) On-Resistance (:) Typical Load Current vs. Load Voltage AC/DC Configuration (IF=5mA) Load Current (mA) 9 Load Current (A) On-Resistance (:) Typical On-Resistance vs. Temperature AC/DC Configuration (IF=5mA, IL=100mA) 50 40 30 20 1.0 0.8 0.6 0.4 10 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.2 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION PLA140 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA140S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PLA140S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PLA140 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R10 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA140 MECHANICAL DIMENSIONS PLA140 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) PLA140S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION PLA140 PLA140STR Tape & Reel 330.2 Dia (13.00 Dia) P1 = 12.00 (0.472) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PLA140-R10 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/4/2021