PLA191

PLA191 400V, 250mA Single-Pole, Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage Load Current On-Resistance (max) Ratings 400 250 8 Description Units VP mArms / mADC  PLA191 is a single-pole, normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 5000Vrms of enhanced input to output isolation. Features • • • • • • • • 5000Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays FCC Compatible VDE Compatible No EMI/RFI Generation Small 6-Pin Package Flammability Rating UL 94 V-0 Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebooks, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls Part # PLA191 PLA191S PLA191STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control - Control NC 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control - Control NC 1 6 2 5 3 4 + Load - Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PLA191-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PLA191 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 400 5 50 1 150 800 5000 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameters Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 400 - - VP - - 250 350 ±500 mArms / mADC mADC mAP - 8 3 1  ILEAK - A IF=0mA, VL=50V, f=1MHz ton toff COUT - 65 3 1 - ms ms pF IL=150mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF t=10ms IL=150mA IL=250mA VL=400V IF=5mA, VL=10V IL ILPK RON Measurement taken within 1 second of on-time. www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLA191 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 1.364 15 10 5 0.39 Device Count (N) 15 10 5 0 0.65 0.91 1.17 1.43 Turn-On Time (ms) 3.3 2.1 2.7 3.9 LED Forward Current (mA) 10 5 0.018 0.030 0.042 0.054 0.066 Turn-Off Time (ms) 0.078 Typical On-Resistance Distribution (N=50, IF=5mA, IL=250mADC) 35 30 20 15 10 5 25 20 15 10 5 0 1.5 15 1.69 Typical IF for Switch Dropout (N=50, IL=250mADC) 25 20 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=250mADC) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=250mADC) 25 Device Count (N) Device Count (N) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=250mADC) 0 4.5 0.9 3.3 1.5 2.1 2.7 LED Forward Current (mA) 3.9 5.03 5.38 5.73 6.08 6.43 On-Resistance (:) 6.78 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 430 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 1.7 490 Typical Turn-On Time vs. LED Forward Current (IL=250mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 454 466 442 478 Blocking Voltage (VP) 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 Typical Turn-Off Time vs. LED Forward Current (IL=250mADC) 0.050 0.045 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA191 PERFORMANCE DATA* Typical Turn-On Time vs. Temperature (IL=250mADC) 0.07 IF=5mA IF=10mA IF=20mA 1.5 1.0 0.5 0.04 0.03 0.02 0 20 40 60 Temperature (ºC) 80 0 -40 100 Typical IF for Switch Operation vs. Temperature (IL=250mADC) LED Current (mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 Temperature (ºC) 80 Typical IF for Switch Dropout vs. Temperature (IL=250mADC) -20 0 20 40 60 Temperature (ºC) 80 100 IF=20mA IF=10mA IF=5mA 150 Blocking Voltage (VP) 300 -20 0 20 40 60 80 Temperature (ºC) 250 200 150 100 50 0 -50 -100 -150 -200 -250 -2.0 -1.5 100 20 40 60 Temperature (ºC) 80 100 1.5 2.0 Typical Load Current vs. Load Voltage (IF=5mA) -1.0 -0.5 0 0.5 1.0 Load Voltage (V) 0.10 475 470 465 460 0.08 0.06 0.04 455 445 -40 120 0 0.12 480 0.02 450 100 -40 -20 Typical Leakage vs. Temperature Measured across Pins 4&6 485 350 200 10 9 8 7 6 5 4 3 2 1 0 Typical Blocking Voltage vs. Temperature Maximum Load Current vs. Temperature 250 Typical On-Resistance vs. Temperature (IF=5mA, IL=250mADC) -40 100 Load Current (mA) -20 Leakage (PA) -40 LED Current (mA) 0.05 0.01 0 Load Current (mA) On-Resistance (:) 2.0 0.06 Turn-Off Time (ms) Turn-On Time (ms) 2.5 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=250mADC) -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLA191 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA191S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PLA191S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PLA191 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA191 Mechanical Dimensions PLA191S PCB Land Pattern 0.635±0.127 (0.025±0.005) 8.382±0.381 (0.330±0.015) 2.54±0.127 (0.100±0.005) 9.524±0.508 (0.375±0.020) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 7.620±0.254 (0.300±0.010) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) Pin 1 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) Dimensions mm (inches) PLA191STR Tape & Reel 330.2 Dia (13.00 Dia) P1 = 12.00 (0.472) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment 6 Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLA191 PLA191 8.382±0.381 (0.330±0.015) 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) PCB Hole Pattern 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) Pin 1 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PLA191-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/10/2021