PLA194

PLA194 600V, 130mA Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage Load Current On-Resistance (max) Ratings 600 Units VP 130 35 mArms / mADC  Description The PLA194 is a single-pole, normally open (1-Form-A) solid state relay that uses optically coupled relay technology to provide an enhanced 5000Vrms isolation barrier between the input and the output of the relay. Features • • • • • • 5000Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 6-Pin Package Flammability Rating UL 94 V-0 Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Applications • • • • • • • • • Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment: Patient/Equipment Isolation Industrial Controls Part # PLA194 PLA194S PLA194STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control - Control NC 1 6 2 5 3 4 Load Do Not Use Load DC-Only Configuration + Control - Control NC 1 6 2 5 3 4 + Load - Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PLA194-R04 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PLA194 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 ESD Rating, Human Body Model Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature Min 8 5000 -40 -40 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Max 600 5 50 1 150 800 85 125 Units VP V mA A mW mW kV Vrms ºC ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameters Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration 1 Continuous, DC-Only Configuration Peak On-Resistance 2 AC/DC Configuration DC-Only Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units IL=1A VDRM 600 - - VP IL - - 130 200 ±400 mArms / mADC mADC mAP 26 - 35 18 1  ILEAK - IF=0mA, VL=50V, f=1MHz ton toff COUT - 0.85 0.46 5 3 2 - IL=130mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.44 1.36 - 2 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF t=10ms IL=130mA IL=200mA VL=600V IF=5mA, VL=10V ILPK RON 1 Load current derates linearly from 130mA @ 25ºC to 65mA @ 85ºC. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 60ºC), a minimum LED drive current of 3mA is recommended. 2 www.ixysic.com A ms pF R04 INTEGRATED CIRCUITS DIVISION PLA194 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 Typical Turn-On Time (N=50, IF=5mA, IL=130mA) 20 25 15 10 Device Count (N) Device Count (N) Device Count (N) 25 20 15 10 5 5 0 0 Typical IF for Switch Operation (N=50, IL=130mA) 25 15 10 5 0.35 0.40 0.45 0.50 LED Current (mA) 0.55 Typical Blocking Voltage Distribution (N=50) 10 5 15 10 5 0 680 Typical Turn-On Time vs. LED Forward Current (IL=70mA) 5 1.8 685 690 695 700 705 710 Blocking Voltage (VP) 715 Typical Turn-Off Time vs. LED Forward Current (IL=70mA) 0.55 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 4 Turn-Off Time (ms) Turn-On Time (ms) 1.7 3 2 1 0.53 0.51 0.49 0.47 1.1 0 -50 1.4 -25 0 25 50 Temperature (ºC) 75 100 Typical IF for Switch Operation vs. Temperature (IL=70mA) 10 1.0 0.8 0.6 0.4 20 30 LED Current (mA) 40 0 20 40 60 LED Forward Voltage (V) 80 100 10 800 2.5 IF=2mA 2.0 1.5 IF=5mA 1.0 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IL=70mA) 900 IF=5mA 700 600 IF=2mA 500 400 300 0.5 -20 0 50 Typical Turn-On Time vs. Temperature (IL=70mA) 3.0 1.2 0.2 -40 0.45 0 Turn-Off Time (Ps) 1.0 Turn-On Time (ms) LED Forward Voltage Drop (V) 20 25.50 25.75 26.00 26.25 26.50 26.75 27.00 On Resistance (:) 0.60 Typical LED Forward Voltage Drop vs. Temperature Forward Current (mA) 5 Typical On-Resistance Distribution (N=50, IF=2mA, IL=130mA) 0 0.30 10 0.34 0.37 0.40 0.43 0.46 0.49 0.52 0.55 Turn-Off Time (ms) 15 0 15 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 Turn-On Time (ms) 20 Device Count (N) Device Count (N) 20 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Device Count (N) 1.364 Typical Turn-Off Time (N=50, IF=5mA, IL=130mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 200 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA194 PERFORMANCE DATA* 25 20 140 220 130 200 Load Current (mA) Load Current (mA) On-Resistance (:) 35 30 120 110 100 90 80 0 20 40 60 Temperature (ºC) 80 100 0.00 -0.05 -0.10 -0.15 -3 -2 -1 0 1 Load Voltage (V) Output Capacitance (pF) 80 2 3 4 0 20 40 60 Temperature (ºC) 120 80 80 -40 100 100 725 700 675 650 625 600 -40 -20 0 20 40 60 Temperature (ºC) Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 80 100 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Leakage vs. Temperature (VL=600V) 80 60 40 20 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 1.0 70 Load Current (A) -4 -20 750 Blocking Voltage (VP) Load Current (A) 0.05 140 Typical Blocking Voltage vs. Temperature Typical Load Current vs. Load Voltage (IF=2mA) 0.10 160 Leakage Current (nA) 0.15 -20 60 -40 180 100 70 15 -40 Maximum Load Current vs. Temperature DC-Only Configuration (IF=2mA) Maximum Load Current vs. Temperature AC/DC Configuration (IF=2mA) Typical On-Resistance vs. Temperature (IF=2mA, IL=70mA) 60 50 40 30 20 0.8 0.6 0.4 0.2 10 0 1 10 100 Load Voltage (V) 1000 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION PLA194 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA194S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PLA194S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PLA194 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA194 Mechanical Dimensions PLA194 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) PLA194S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION PLA194 PLA194STR Tape & Reel 330.2 Dia (13.00 Dia) P1 = 12.00 (0.472) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PLA194-R04 ©Copyright 2021, Littelfuse, Inc. All rights reserved. Printed in USA. 11/10/2021