PLB190

PLB190 400V, 130mA Single-Pole Normally Closed Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 400 130 25 Units VP mArms / mADC  Features • • • • • • • • • 5000Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays FCC Compatible VDE Compatible No EMI/RFI Generation Small 6-Pin Package Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Version Available Description The PLB190 is a single-pole, normally closed (1-Form-B) solid state relay that uses optically coupled relay technology to provide an enhanced 5000Vrms isolation barrier between the input and output of the relay. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Dial Pulsing • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security Systems • Industrial Controls Part Number PLB190 PLB190S PLB190STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1,000/Reel) Pin Configuration DC-Only Configuration AC/DC Configuration + Control - Control NC 1 6 2 5 3 4 + Control Load - Control Do Not Use NC Load 1 6 2 5 3 4 + Load - Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-PLB190-R05 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION PLB190 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output (60 sec.) Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 400 5 50 1 150 800 5000 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Parameter Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 400 - - VP IF=0mA IL IF=0mA, t=10ms ILPK - - 130 250 ±400 mArms / mADC mADC mA - 25 10 1  ILEAK - IF=2mA, VL=50V, f=1MHz ton toff COUT - 11 1 2.5 - IL=130mA IF=5mA VR=5V IF IF VF IR 0.2 0.9 - 0.38 0.35 1.36 - 2 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF IF=0mA, IL=130mA IF=0mA, IL=250mA IF=2mA, VL=400V IF=5 mA, VL=10V RON 1 Measurement taken within 1 second of on-time. 2 For high temperature operation (>60ºC), a minimum LED drive current of 4mA is recommended. www.ixysic.com A ms pF R05 INTEGRATED CIRCUITS DIVISION PLB190 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 20 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 20 20 15 10 Device Count (N) Device Count (N) Device Count (N) 25 15 10 5 15 10 5 5 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical LED Current to Operate (N=50, IL=100mA) 0.838 0.920 1.002 1.084 1.166 1.248 1.330 1.412 Turn-On Time (ms) Turn-Off Time (ms) Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA) 25 Device Count (N) 20 0.714 0.716 0.718 0.720 0.722 0.724 0.726 0.728 15 10 5 20 15 10 5 10 5 13.3 13.5 13.8 14.0 14.3 On-Resistance (:) 460 465 14.5 Typical Turn-On Time vs. LED Forward Current (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature LED Forward Voltage Drop (V) 15 0 13.0 0.29 0.32 0.35 0.38 0.41 0.44 0.47 0.50 LED Current (mA) 735 1.8 1.4 1.3 1.2 Turn-Off Time (ms) Turn-On Time (Ps) IF=10mA IF=5mA IF=2mA 1.5 730 725 720 715 710 -25 0 25 50 Temperature (ºC) 75 LED Current to Operate vs. Temperature (IL=75mA) 0.65 Turn-On Time (Ps) 0.50 0.45 0.40 0 20 40 60 Temperature (ºC) 80 100 3 2 0 Typical Turn-On Time vs. Temperature (IL=75mA) 50 Typical Turn-Off Time vs. Temperature (IL=75mA) 4.5 700 600 500 300 -40 10 20 30 40 LED Forward Current (mA) 5.0 IF=5mA 400 -20 4 50 800 0.55 0.35 -40 10 20 30 40 LED Forward Current (mA) 900 0.60 5 0 0 100 0 20 40 60 Temperature (ºC) 80 4.0 IF=2mA 3.5 3.0 2.5 2.0 IF=5mA 1.5 IF=2mA -20 Turn-Off Time (ms) -50 495 1 1.1 1.0 470 475 480 485 490 Blocking Voltage (VP) Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 6 1.7 1.6 Typical Blocking Voltage Distribution (N=50, IF=2mA) 20 0 0 LED Current (mA) 25 Device Count (N) 1.364 Device Count (N) 0 0 0 100 1.0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLB190 PERFORMANCE DATA* 0.15 17 16 15 14 7.0 0.14 0.13 0.05 0.00 -0.05 -0.10 13 12 -40 Maximum Load Current vs. Temperature - AC/DC Configuration (IF=0mA) 0.10 18 Load Current (A) On Resistance (:) 19 Typical Load Current vs. Load Voltage AC/DC Configuration (IF=0mA) Load Current (A) 20 On-Resistance vs. Temperature AC/DC Configuration (IF=0mA, IL=75mA) -20 0 20 40 60 Temperature (ºC) 80 100 0.25 -0.5 0.0 0.5 1.0 Load Voltage (V) 1.5 Typical Load Current vs. Load Voltage DC-Only Configuration (IF=0mA) 5.0 4.5 4.0 0.20 0.15 0.10 0.05 3.5 20 40 60 Temperature (ºC) 80 100 0.22 0.20 0.18 0.16 0.14 0.12 0 20 40 60 Temperature (ºC) 80 100 Typical Blocking Voltage vs. Temperature (IF=5mA) 350 475 300 470 250 465 460 455 450 0.2 0.4 0.6 0.8 Load Voltage (V) 1.0 1.2 Typical Leakage vs. Temperature Measured Across Pins 4&6 (IF=5mA, VL=400V) 200 150 100 -20 0 20 40 60 Temperature (ºC) 80 0 -40 100 -20 0 20 40 60 Temperature (ºC) 80 100 Output Capacitance vs. Load Voltage (IF=5mA, f=1MHz) 140 50 445 0.10 -40 Output Capacitance (pF) -20 0.00 0.0 Leakage (nA) Blocking Voltage (VP) 0 Maximum Load Current vs. Temperature - DC Configuration (IF=0mA) 0.26 Load Current (A) Load Current (mA) On-Resistance (:) 5.5 440 -40 -20 0.24 6.0 480 0.10 0.08 -40 2.0 6.5 3.0 -40 0.11 0.09 -0.15 -2.0 -1.5 -1.0 On-Resistance vs. Temperature DC-Only Configuration (IF=0mA, IL=100mA) 0.12 120 100 80 60 40 20 0 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 50 100 150 Load Voltage (V) 200 Energy Rating Curve Load Current (A) 1.0 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLB190 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLB190S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PLB190S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PLB190 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLB190 Mechanical Dimensions PLB190 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) PLB190S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLB190 PLB190STR Tape & Reel 330.2 Dia (13.00 Dia) P1 = 12.00 (0.472) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PLB190-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 12/23/2021