VUO36-08NO8
3~
Rectifier
Standard Rectifier Module
VRRM =
800 V
I DAV =
27 A
I FSM =
550 A
3~ Rectifier Bridge
Part number
VUO36-08NO8
+
D1
D3
D5
D2
D4
D6
~
~
~
-
Features / Advantages:
Applications:
Package: FO-B
● Planar passivated chips
● Very low leakage current
● Very low forward voltage drop
● Improved thermal behaviour
● Diode for main rectification
● For three phase bridge configurations
● Supplies for DC power equipment
● Input rectifiers for PWM inverter
● Battery DC power supplies
● Field supply for DC motors
● Isolation Voltage: 3000 V~
● Industry standard outline
● RoHS compliant
● ¼“ fast-on terminals
● Easy to mount with one screw
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20191219d
VUO36-08NO8
Ratings
Rectifier
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
IR
reverse current
VF
forward voltage drop
I DAV
bridge output current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
total power dissipation
I FSM
max. forward surge current
I²t
CJ
value for fusing
junction capacitance
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
800
V
TVJ = 25°C
40
µA
TVJ = 150°C
1.5
mA
TVJ = 25°C
1.04
V
1.23
V
0.93
V
IF =
15 A
IF =
45 A
IF =
15 A
IF =
45 A
TVJ = 125 °C
1.18
V
T VJ = 150 °C
27
A
TVJ = 150 °C
0.76
V
9.1
mΩ
d=⅓
for power loss calculation only
thermal resistance case to heatsink
max. Unit
900
V
VR = 800 V
rectangular
R thCH
typ.
VR = 800 V
TC = 85 °C
Ptot
min.
7 K/W
1
K/W
TC = 25°C
17
W
t = 10 ms; (50 Hz), sine
TVJ = 45°C
550
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
595
A
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
470
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
505
A
t = 10 ms; (50 Hz), sine
TVJ = 45°C
1.52 kA²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
1.48 kA²s
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
1.11 kA²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
VR = 400 V; f = 1 MHz
TVJ = 25°C
1.06 kA²s
18
Data according to IEC 60747and per semiconductor unless otherwise specified
pF
20191219d
VUO36-08NO8
Package
Ratings
FO-B
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-40
max.
100
Unit
A
-40
150
°C
-40
125
°C
125
°C
20
Weight
MD
1.8
mounting torque
d Spp/App
creepage distance on surface | striking distance through air
d Spb/Apb
VISOL
typ.
t = 1 minute
2.2
Nm
terminal to terminal
9.0
7.0
mm
terminal to backside
10.0
10.0
mm
3000
V
2500
V
t = 1 second
isolation voltage
g
50/60 Hz, RMS; IISOL ≤ 1 mA
Logo
XXX XX-XXXXX
Part Number
yywwZ
Date Code/Location
Ordering
Standard
Ordering Number
VUO36-08NO8
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
VUO36-08NO8
* on die level
Delivery Mode
Box
Code No.
502548
T VJ = 150°C
Rectifier
V 0 max
threshold voltage
0.76
V
R0 max
slope resistance *
7.9
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Quantity
50
Data according to IEC 60747and per semiconductor unless otherwise specified
20191219d
VUO36-08NO8
Outlines FO-B
10 ±0.2
22.1 ±0.5
6.3 x 0.8
12 ±0.3
D
E
8 ±0.3
12 ±0.3
28.5 ±0.2
C
B
A
28.5 ±0.2
+
D1
D3
D5
D2
D4
D6
~
~
~
-
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20191219d
VUO36-08NO8
Rectifier
450
60
50
50 Hz
0.8 x V RRM
1600
VR = 0 V
400
1200
40
IFSM350
IF
30
[A]
[A] 300
20
10
400
0.8
200
10-3
1.2
10-2
10-1
Fig. 1 Forward current vs.
voltage drop per diode
Fig. 2 Surge overload current
vs. time per diode
10
2
Fig. 3 I t vs. time per diode
24
RthJA:
DC =
1
0.5
0.4
0.33
0.17
0.08
6
1
t [ms]
t [s]
10
[W]
100
VF [V]
8
TVJ = 150°C
250
TVJ = 25°C
0
0.4
Ptot
800
[A2s]
TVJ = 150°C
TVJ =
125°C
150°C
TVJ = 45°C
2
It
TVJ = 45°C
DC =
0.6 KW
20
0.8 KW
1
KW
2
KW
4
KW
8
KW
1
0.5
0.4
16
0.33
IF(AV)M
0.17
12
0.08
[A]
4
8
2
4
0
0
0
2
4
6
8
10 0
25
50
75
100
125
150
0
175
25
50
TA [°C]
IF(AV)M [A]
75
100 125 150
TC [°C]
Fig. 4 Power dissipation vs. forward current
and ambient temperature per diode
Fig. 5 Max. forward current vs.
case temperature per diode
8
6
Constants for ZthJC calculation:
ZthJC
4
[K/W]
2
0
1
10
100
1000
10000
i
Rth (K/W)
ti (s)
1
0.040
0.005
2
0.150
0.030
3
1.710
0.400
4
5.100
2.300
100000
t [ms]
Fig. 6 Transient thermal impedance junction to case vs. time per diode
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20191219d
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