XAA117STR

XAA117 60V, 150mA Dual Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Ratings 60 150 16 1 Units VP mArms / mADC  mA The optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Features • • • • • • • • Description The XAA117 is a dual, single-pole, normally open (1-Form-A) Solid State Relay with two independently controlled, optically coupled MOSFET switches that feature 3750Vrms of input to output isolation. Low Input Control Current: 1mA 3750Vrms Input/Output Isolation Low Drive Power Requirements FCC Compatible VDE Compatible No EMI/RFI Generation Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Versions Available This dual single-pole OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-Pin package. Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Applications • Security • Passive Infrared Detectors (PIR) • Data Signaling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Ordering Information Part # XAA117 XAA117S XAA117STR XAA117P XAA117PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin Flat Pack (50/Tube) 8-Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-XAA117-R04 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION XAA117 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 60 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 60 - - VP t =10ms IL=150mA VL=60VP IL ILPK RON ILEAK - 7 - 150 ±400 16 1 mArms / mADC mA  IF=0mA, VL=50V, f=1MHz ton toff COUT - 0.1 0.5 25 5 5 - IL=150mA IF=5mA VR=5V IF VF IR 0.05 0.9 - 1.36 - 1 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value. 2 Measurement taken within one second of on-time. www.ixysic.com µA ms pF R04 INTEGRATED CIRCUITS DIVISION XAA117 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 15 10 5 0 0 1.364 15 10 5 85 90 95 Turn-On Time (Ps) 100 105 0.35 0.40 0.45 0.50 0.55 0.60 Turn-Off Time (ms) 0.65 Typical Blocking Voltage Distribution (N=50) 35 30 Device Count (N) 15 10 5 15 10 5 25 20 15 10 5 0 0 0 0.05 0.06 0.07 0.08 0.09 0.10 LED Current (mA) 0.11 6.9 6.8 1200 1.8 1.7 7.0 7.1 7.2 On-Resistance (:) 84 7.4 7.3 Typical Turn-On Time vs. LED Forward Current (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature Turn-On Time (Ps) 1000 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 800 600 400 200 1.1 0 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 86 87 88 89 Blocking Voltage (VP) 90 480 475 470 465 460 0 Typical IF to Operate vs. Temperature (IL=100mA) 85 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 485 Turn-Off Time (Ps) LED Forward Voltage Drop (V) 80 Typical On-Resistance Distribution (N=50, IL=100mA) 20 20 0.18 20 0 75 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=100mA) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 5 10 15 LED Forward Current (mA) 0 20 Typical Turn-On Time vs. Temperature (IL=50mA) 600 5 10 15 LED Forward Current (mA) 20 Typical Turn-Off Time vs. Temperature (IL=50mA) 800 IF=1mA 0.14 0.12 0.10 0.08 -40 700 500 Turn-Off Time (Ps) Turn-On Time (Ps) IF (mA) 0.16 400 300 200 IF=5mA 0 20 40 60 Temperature (ºC) 80 100 0 -40 IF=1mA & IF=5mA 500 400 300 100 -20 600 -20 0 20 40 60 Temperature (ºC) 80 100 200 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION XAA117 PERFORMANCE DATA* Typical Load Current vs. Load Voltage (IF=1mA) Typical On-Resistance vs. Temperature (IF=5mA, IL=50mA) 12 8 7 Load Current (mA) Current (mA) 0.0 -0.1 6 -0.2 5 -40 -0.3 -1.5 -20 0 20 40 60 Temperature (ºC) 80 100 -0.5 0.0 0.5 Voltage (V) 1.0 1.5 Leakage (nA) 88 86 8 6 4 2 -20 0 20 40 60 Temperature (ºC) 80 100 110 Both Poles 100 90 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 10 90 120 -40 12 92 130 70 -1.0 Typical Leakage vs. Temperature Measured Across Pins 5&6 or 7&8 94 Single Pole 140 80 Load Current (A) On-Resistence (:) 9 0.1 Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) 150 0.2 10 84 -40 160 0.3 11 Maximum Load Current vs. Temperature (IF=2mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION XAA117 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification XAA117S / XAA117P MSL1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles XAA117S XAA117P 250ºC 260ºC 30 seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device XAA117 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION XAA117 Mechanical Dimensions XAA117 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) XAA117S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) XAA117P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION XAA117 XAA117STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm XAA117PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-XAA117-R04 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 12/23/2021