XBB170PTR

XBB170 350V, 100mA Dual Single-Pole Normally Closed Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 100 50 Units VP mArms / mADC  Features • • • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount, Tape & Reel Versions Available Description XBB170 is a dual 350V, 100mA, 50, normally closed (1-Form-B) relay that features low on-resistance. Using optically coupled MOSFET technology, it provides 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications. The dual relay configuration saves board space by incorporating both relays in a single 8-pin package. Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Ordering Information Part # XBB170 XBB170P XBB170PTR XBB170S XBB170STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-XBB170-R06 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION XBB170 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - VP IF=0mA IF=0mA, t=10ms IL=100mA VL=350V IL ILPK RON ILEAK - 33 - 100 ±350 50 1 mArms / mADC mA  IF=5mA, VL=50V, f=1MHz ton toff COUT - 25 5 5 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value. 2 Measurement taken within one second of on-time. www.ixysic.com A ms pF R06 INTEGRATED CIRCUITS DIVISION XBB170 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 1.364 15 10 5 0.67 Device Count (N) 15 10 5 0 0.75 0.83 0.91 0.99 1.06 Turn-On Time (ms) 0.50 0.56 0.62 0.69 LED Current (mA) 0.75 15 10 5 0.14 0.17 0.19 0.22 Turn-Off (ms) 0.25 0.28 Typical On-Resistance Distribution (N=50, IL=100mADC) 20 15 10 5 0 0.81 0.44 Device Count (N) 5 25 20 25 10 0.11 0 0.44 15 1.14 Typical IF for Switch Dropout (N=50, IL=100mADC) 25 20 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=100mADC) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IL=100mADC) 25 Device Count (N) Device Count (N) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IL=100mADC) 0.50 0.56 0.62 0.69 LED Current (mA) 0.75 0.81 30.59 31.36 32.13 32.90 33.66 34.43 35.20 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=5mA) 20 15 10 5 0 424.0 429.3 434.5 439.7 444.9 450.1 455.4 Blocking Voltage (VP) 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 Typical Turn-On Time vs. LED Forward Current (IL=100mADC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION XBB170 1.8 1.2 1.0 IF=20mA 0.6 0.4 0 20 40 60 80 Temperature (ºC) 100 0 -40 120 2 1 0 -40 -20 0 20 40 60 80 Temperature (ºC) 4 3 2 -40 100 120 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 450 120 100 80 60 40 20 0 0 20 40 60 Temperature (ºC) 80 100 120 -20 0 20 40 60 80 Temperature (ºC) 100 120 20 40 60 80 Temperature (ºC) 100 120 -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 4 0.016 0.014 445 440 435 430 0.012 0.010 0.008 0.006 0.004 425 0.002 420 -40 0 Typical Leakage vs. Temperature Measured across Pins 4&6 Leakage (PA) Blocking Voltage (VP) 455 140 -20 Typical Blocking Voltage vs. Temperature (IF=5mADC) Maximum Load Current vs. Temperature 160 -20 Typical Load Current vs. Load Voltage 0 -40 20 100 120 20 40 60 80 Temperature (ºC) 1 0 30 Load Current (mA) 3 40 0 -20 5 4 50 10 Typical IF for Switch Dropout vs. Temperature (IL=100mADC) 6 LED Current (mA) LED Current (mA) IF=10mA 0.8 5 Load Current (mA) 60 1.4 0.2 -20 Typical On-Resistance vs. Temperature (IL=100mADC) 70 IF=5mA 1.6 Typical IF for Switch Operation vs. Temperature (IL=100mADC) 6 Typical Turn-Off Time vs. Temperature (IL=100mADC) On-Resistance (:) 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -40 Typical Turn-On Time vs. Temperature (IL=100mADC) Turn-Off Time (ms) Turn-On Time (ms) PERFORMANCE DATA* -40 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION XBB170 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification XBB170S / XBB170P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles XBB170S XBB170P 250ºC 260ºC 30 seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device XBB170 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION XBB170 Mechanical Dimensions XBB170 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) XBB170S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 (0.130 ± 0.002) 0.635 ± 0.127 (0.025 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) XBB170P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION XBB170 XBB170STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm XBB170PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-XBB170-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 12/23/2021