DX07S024XJ1R1100

版数 VER. SJ116123 9.39 年月日 D A T E CN NO. 　　　　　　　　変 更 内 容 　　　　　　　　DESCRIPTION 製　図 DR. 担　当 CHK. 査　閲 APPD. 承　認 APPD. A A12 5 6 15 1 0 1.4 4.4 0.8 3.34 TOP SURFACE OF BRACKET 0 0.8 (B12) 1.2 (B11) 2 (B10) 2.4 (B9) 2.8 (B8) 3.2 (B7) 4 (B6) 4.4 (B5) 4.8 (B4) 5.2 (B3) 6 (B2) 6.4 (B1) C 12-0.12 ±0.03 0.15 M A-B D 7 1.35 MOUNTING CONDITION (5 : 1) MATING BOTTOM FACE 0 0.85 (A1) 1.35 (A2) 1.85 (A3) 2.35 (A4) 2.85 (A5) 3.35 (A6) 3.85 (A7) 4.35 (A8) 4.85 (A9) 5.35 (A10) 5.85 (A11) 6.35 (A12) 6.5 max. A (10 : 1) TABLE 2. PIN DEFINE A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 PIN MATED CONDITION (5 : 1) 2.8 6.05 DCF-C-213H(12.08) 10 NOTE 1.COPLANARITY OF SMT TERMINAL IS 0.1 MAX NOTE 2.RECOMMENDED METAL MASK THICKNESS:120 um NOTE 3.THE SHELL LENGTH IS LESS THAN THE MINIMUM SPECIFIED BY THE USB STANDARD. AS SUCH IT CANNOT INDEPENDENTLY BE GUARANTEED TO MEET ALL TYPE C MECHANICAL REQUIREMENTS. THE SYSTEM IMPLEMENTER IS RESPONSIBLE FOR ACHIEVING PRODUCT RELIABILITY AND PASSING USB COMPLIANCE TESTING. REFERENCE THE USB TYPE C SPECIFICATION RELEASE 1.1,SECTION 3.2.1,NOTE7. NOTE 4.LOT NUMBER IS MARKED AS INDIDATED. (EX) 5 6 15 1 EQUIPMENT No. (NUMBER OR ALPHABET) DAY (TWO-DIGITS NUMBER) MONTH (NUN. TO SEP.:1 TO 9, OCT.:O, NOV.:X, DEC.:Y) YEAR (END OF DIGIT AT CHRISTIAN ERA) 40 50 60 70 80 90 100 GND SSRXp2 SSRXn2 VBUS SUB1 Dn1 Dp1 CC1 VBUS SSTXn1 SSTXp1 GND SIGNAL NAME B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 PIN GND SSTXp2 SSTXn2 VBUS CC2 Dp2 Dn2 SUB2 VBUS SSRXn1 SSRXp1 GND SIGNAL NAME TABLE 1 1 STAINLESS STEEL NICKEL PLATING PLATING THICKNESS:1μm Min. 9 LOCATOR 1 THERMOPLASTIC RESIN COLOR:BLACK HALOGEN-FREE 8 BRACKET 1 STAINLESS STEEL NICKEL PLATING PLATING THICKNESS:1μm Min. 7 SHELL 1 STAINLESS STEEL BLACK NICKEL PLATING PLATING THICKNESS:1μm Min. 6 GND PLATE 2 STAINLESS STEEL NICKEL PLATING PLATING THICKNESS:0.8μm Min. 5 GND MID PLATE 1 STAINLESS STEEL NICKEL PLATING PLATING THICKNESS:1μm Min. 4 INSULATOR 1 THERMOPLASTIC RESIN COLOR:BLACK HALOGEN-FREE 3 CONTACT C 6 COPPER ALLOY TABLE 1 2 CONTACT B 6 COPPER ALLOY TABLE 1 12 COPPER ALLOY TABLE 1 1 CONTACT A 符号 NO. 名　　　称 DESCRIPTION PLATING THICKNESS GOLD FLASH NICKEL:2μm MIN. CONTACT AREA OVER PLLADIUM-NICKEL PALLADIUM-NICKEL:0.75μm MIN. OVER NICKEL GOLD FLASH:0.05μm MIN. NICKEL:2μm MIN. SOLDER TALES GOLD FLASH OVER NICKEL GOLD FLASH:0.03μm MIN. S/W Z 10 REAR SHIELD 仕様書(SPECIFICATION) FINISH 12- 0.4 ±0.05 0.05 X Y 個　数 QTY. 材　　料 MATERIAL 第1版(ORIGINAL DATE) 16/JUN/2015 製図 DR. 一般公差(GENERAL TOLERANCE) 寸法(DIMENSION) ． ± 0.8 ． ± 0.4 ． ± 0.1 ． ± 角度(ANGLES) °± °’± 仕　上 FINISH 尺度(SCALE) M.SASAKI 承認 APPD. T.MASUMOTO DX07S024XJ1 ― DX07 日本航空電子工業株式会社 JAPAN AVIATION ELECTRONICS INDUSTRY,LTD. 図面番号(DRAWING NO.) 質量(MASS) 単位(UNIT)：㎜ シリーズ(SERIES) 5:1 名称(TITLE) 担当 CHK. 査閲 APPD. 備　　考 REMARKS SJ116123 JAE Connector DIV. Proprietary.Copyright(C) 2015, Japan Aviation Electronics Industry, LTD. A2 5.5 ±0.2 0.65 ±0.05 SIZE 1.15 0.75 ±0.025 6 (B2) 6.4 (B1) 6.65 ±0.1 B 3.35 30 0.75 ±0.025 0.65 12-0.2 ±0.05 0.1 M A-B C D 20 Z 0 0.91 ±0.15 1 0.95 ±0.05 Y 0.66 2 A A1 4 (B6) 4.4 (B5) 4.8 (B4) 5.2 (B3) 1.35 0.65 0 12-0.3 ±0.03 0.05 X Y Z 2 (B10) 2.4 (B9) 2.8 (B8) 3.2 (B7) 3 A2 0.8 (B12) 1.2 (B11) 9 0.85 (A1) 1.35 (A2) 1.85 (A3) 2.35 (A4) 2.85 (A5) 3.35 (A6) 3.85 (A7) 4.35 (A8) 4.85 (A9) 5.35 (A10) 5.85 (A11) 6.35 (A12) 1.4 2-1.2 ±0.05 0.3 M A-B 12-0.15 ±0.05 0.15 M A-B C APPLICABLE P.C.B DIMENSION(REF.) 適合基板寸法(参考） 0 8.2 Z 8.2 2-1.2 ±0.05 0.3 M A-B D Y Z 7.2 ±0.08 1 1 4-0.2 ±0.03 0.35 M A-B C X 2-1.1 ±0.05 B1 0.6 ±0.025 10 0.05 12-1.1 ±0.03 0.05 X Y B12 X 2-0.6 ±0.05 0 5 6.05 0 4 4.4 0.7 -0.3 (BOSS) 6 0.8 8 0 A12 0.7 -0.3 (ALL T/H) A1 6.9 1.6 (CENTER HEIGHT) +0.06 2.54 -0.02 +0.06 8.34 -0.02 2-2.1 ±0.05 A1 Z 2-0.6 ±0.05 0.05 X Y Z 2-1.6 ±0.05 0.1 X Y 7.2 ±0.05 2-1.6 ±0.05 0.1 X Y 9.65 2-1.1 ±0.05 2-2.1 ±0.05 Z 8.2 LOT NO.(NOTE.4) 0 2015/06/18 図面番号(DRAWING NO.) 1 版数 (VER.) 1