CJK01-327681220A20

产 品 规 格 书 SPECIFICATIONS FOR PRODUCT 产品类型 TYPE ： 3*8 产品规格 SPEC ： 32.768KHz/3*8/12.5PF/20PPM 产品型号 P/N ： CJK01-327681220A20 日期 DATE ： 2019/04/28 核准及签名 部门 R&D DEPT. APPR. SIGNATURED 拟制 审核 批准 频率器件事业部 ISSUE CHECK APPROVAL 王嘉诚 许秋菊 杨立新 2019/04/28 2019/04/28 2019/04/28 长 科 技 有 限 公 司 江 苏 晶 JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD 地址：中国江苏省南京江北新区产业技术研创园江淼路88号腾飞大厦C座13楼 Add: 13Th Floor, C Block,Tengfei Building,No.88 Jiangmiao Rd. Pukou District,Nanjing City,Jiangsu Province,China www.jscj-elec.com 1 rev1.0 JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD CJ308 Quartz Crystal CJK01-327681220A20 1. Scope: 1.1 This specification applies to the RoHS/SONY compliance quartz crystal unit with a frequency of 32.768KHz which will be used in crystal oscillator applications. 2. Construction: 2.1 Type of Quartz Resonator: CJ308 3. Electrical Characteristics 3.1 Mode of Vibration： +2°X-cut , Fundamental 3.2 Nominal frequency(F): 32.768KHz 3.3 Load Capacitance(CL): 12.5 PF 3.4 Frequency Tolerance at 25℃: ±20ppm 3.5 Series Resistance(Rr): 40 KΩ Max 3.6 Quality Factor(Q): 60K TYP 3.7 Turnover Temperature(To): 25 ℃± 5℃ 3.8 Temperature Coefficient(K): -0.035±0.006 ppm/℃2 3.9 Operation Temperature: -20 ℃~ +70℃ 3.10 Preservation Temperature: -55 ℃~ +125℃ 3.11 Shunt Capacitance(CO)： 1.5PF Typical 3.12 Aging 1st Year(△f /f): ±5 ppm max. 3.13 Shock Resistance: ±5 ppm max. 3.14 Capacitance Ratio(C0/C1): 520 Typical 3.15 Insulation Resistance: 500MΩ at DC 100V±15V 3.16 Drive Level: 1 μW www.jscj-elec.com 2 rev1.0 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS 4. Reliability Specifications 4.1. Humidity Subject the crystal at 40℃± 2℃ and 90％ - 95%RH for 96±4 hours Then release the crystal into the room conditions for 2hour prior to the measurement. 4.2. High Temperature Exposure Subject the crystal to 85℃± 5℃ for 96±4 hours﹒ Then release the crystal into the room conditions for 2hour prior to the measurement. 4.3. Low Temperature Subject the crystal to -20℃± 5℃ for 96±4 hours﹒Then release the crystal into the room conditions for 2hour prior to the measurement. 4.4. Mechanical Shock Drop the crystal randomly onto a concrete floor from the height of 75cm 3 times﹒Then release the crystal into the room temperature for 15 minutes prior to the measurement. 4.5. Temperature Cycling Subject the crystal to -30℃ for 30 min. followed by a high temperature of +85℃ for 30 min. Cycling shall be repeated 5times with a transfer time of 15sec. at the room condition﹒ Then release the resonator into the room temperature for 2hours prior to the measurement. 4.6. Vibration Subject the crystal to vibration for 2hours each in x, y, and z axes with the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10-55 Hz﹒Then release the crystal into the room temperature for 15 minutes prior to the measurement. 4.7. Resistance to Solder Heat Dip the crystal terminals no closer than 2 mm into the solder bath 260℃±5℃ for 5±1 sec; Then release the crystal into the room temperature for 2hour prior to the measurement. 4.8. Solder Ability Dip the crystal terminals no closer than 2 mm into the solder bath at 235℃± 5℃ for 3±0.5 sec . more than 95％ of the erminal surface of the crystal shall be covered with fresh solder. Then release the crystal into the room temperature for 2hour prior to the measurement. 4.9. Lead Fatigue 1) Pulling Test Weight along with the direction of terminals without any shock 0.5kg for 10±1sec.; The crystal shall no evidence of damage and shall fulfill all the initial electric characteristics. 2) Bending Test Lead shall be subject to withstand against 90 degree bending at its stem. This operation shall be done towards both direction; The crystal shall no evidence of damage and shall fulfill all the initial electric characteristics. www.jscj-elec.com 3 rev1.0 Handling Notice for Standard Tuning Fork Crystal (Cylindrical Type) 5. Reliability Specifications 5.1. Shock Resistance It may deteriorate the characteristics or cause of no oscillation if excess physical shock given. Please be careful not to drop. Please use under condition to minimize the shocks as much as possible. Please review the conditions if it is used by auto mounting or after the conditions are changed. 5.2. Heat and Humidity Resistance in Storage Storing the crystal products under higher or lower temperature or high humidity for a long period may deteriorate the characteristics of crystal units. Please store and use the crystal products at the normal temperature and humidity. 5.3. Solder Heat Resistance Standard type crystal products use Material have a 230℃ melting point. Heating up the package more than 210℃ may deteriorate the characteristics or cause of no oscillation the products. If the crystal products need to be soldered at temperature of more than +210ºC, please study heat-resistance products or SMD products. Please review the condition or consult us about flow solder process. Our soldering condition is under 280ºC within 5sec or 260ºC within 10sec for lead parts. Please don’t solder the crystal unit (case) directly. It may cause of deteriorate the characteristics. 5.4. Mounting Method to PCB When the crystal products need to be lay down please fix to PCB securely. If the crystal is used with mechanical vibration location, please put cushion in between PCB or fix with elasticity glue (Silicon etc) as shown in below figure. Please don’t gluing hermetic seal grass. When the crystal products need to be mounted vertically, gap between crystal units and PCB more than 3mm for 3×8 type , more than 2mm for 2×6 type is recommended. 3×8 : 3mmmin 2×6 : 2mmmin www.jscj-elec.com 4 rev1.0 Handling Notice for Standard Tuning Fork Crystal (Cylindrical Type) 6. Lead Process When the lead needs to be cut please maintenance the cutter. When the lead needs to be bent or repaired please be careful not to giving excess pressure at the root of the lead to avoid crack of the hermetic seal glass. Also please be careful not to giving excess pressure at sealing to avoid sealing tightness deteriorate. Leave more than 0.5 mm of lead from the case. 7. Ultrasonic Cleaning and Ultrasonic Soldering Soldered by ultrasonic cannot be guaranteed, because crystal may be sympathetic vibrated and may damage. Please study at your side about ultrasonic cleaning. 8. Drive Level Applying excessive drive level to the crystal units may cause deterioration of characteristics or damage. Less then 1.0μW is recommended to this products. More than 2.0μW cannot be guaranteed. 3DFNDJH2XWOLQH'LPHQVLRQV Units:mm www.jscj-elec.com 5 rev1.0