CJK07-327681220B20

产 品 规 格 书 SPECIFICATIONS FOR PRODUCT 产品类型 TYPE ： Quartz Crystal 产品规格 SPEC ： 32.768KHz/3215/12.5PF/20PPM 产品型号 P/N 日期 ： CJK07-327681220B20 DATE ： 2019/03/27 核准及签名 部门 R&D DEPT. APPR. SIGNATURED 拟制 审核 批准 频率器件事业部 ISSUE CHECK APPROVAL 王嘉诚 许秋菊 杨立新 2019/03/27 2019/03/27 2019/03/27 长 科 技 有 限 公 司 江 苏 晶 JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD 地址：中国江苏省南京江北新区产业技术研创园江淼路88号腾飞大厦C座13楼 Add: 13Th Floor, C Block,Tengfei Building,No.88 Jiangmiao Rd. Pukou District,Nanjing City,Jiangsu Province,China www.jscj-elec.com 1 rev1.0 JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD CJ-310 Quartz Crystal CJK07-327681220B20 1. Scope: This specification applies to the RoHS/SONY compliance quartz crystal unit with a frequency of 32.768KHz which will be used in crystal oscillator applications. Construction: 2.1 Type of Quartz Resonator: CJ-310 3. Electrical Characteristics 3.1 Mode of Vibration： +2°X-cut , Fundamental 3.2 Nominal frequency(F): 32.768KHz 3.3 Load Capacitance(CL): 12.5PF 3.4 Frequency Tolerance at 25℃ ±20ppm 3.5 Series Resistance(Rr): 70 KΩ Max 3.6 Quality Factor(Q): 60K TYP 3.7 Turnover Temperature(To): 25 ℃± 5℃ 3.8 Temperature Coefficient(K): -0.035±0.006 ppm/℃2 3.9 Operation Temperature: -40 ℃~ +85℃ 3.10 Preservation Temperature: -55 ℃~ +125℃ 3.11 Shunt Capacitance(CO)： 1.5PF Typical 3.12 Aging 1st Year(△f /f): ±5 ppm max. 3.13 Shock Resistance: ±5 ppm max. 3.14 Capacitance Ratio(C0/C1): 520 Typical 3.15 Insulation Resistance: 500MΩ at DC 100V±15V 3.16 Drive Level: 1 μ W www.jscj-elec.com 2 rev1.0 Reliability Specifications 4. Reliability Specifications This is the quality control and quality assurance and reliability tests performance data for the RoHS/SONY compliance 32.768KHz CJ-310 Quartz Crystal. related to the specification and approval sheet provided by JSCJ . Standard test condition (TEMP.: 20±5°C. Relative humidity: 65±20%) For any discrepancy in GO/NG, test will be done at TEMP.25±2°C, R.H. 65±5%. NO. PROCESS SPECIFICATION TEST METHOD 4.1 Temperature Cycle (GB/T 2423.22-2002, Method Nb) 4.2 Low Temperature Storage Frequency change after test ≤± Spending 72 hrs at -55°C±3°C constant (GB/T 2423.1-2001, Method 5ppm.Resonance resistance temperature. Measurement taken after DUT being Aa) change after test ≤10ohms. left at room temperature for 24±2 hours. 4.3 High Temperature Storage Frequency change after test ≤± Spending 72 hrs at 125°C±3°C constant (GB/T 2423.2-2001, Method 5ppm.Resonance resistance temperature. Measurement taken after DUT being Ba) change after test ≤10ohms. left at room temperature for 24±2 hours. 4.4 Humidity (GB/T 2423.32006, Method Cab) Frequency change after test ≤± Spending 96 hrs at 40 °C ± 3 °C, with 93 %R.H, 5ppm.Resonance resistance Then keep the DUT in dry oven at 40 ± 5 °C for 24 change after test ≤10ohms. hour. Measurement taken after DUT being left at room temperature for 1 to 2 hours. 4.5 Vibration (GB/T 2423.101995, Method Fc) Frequency change after test ≤± Apply 0.75mm vibration at sweep frequency 10～ 5ppm.Resonance resistance 500 Hz, 10 cycles in each direction of 3 axis. change after test ≤10ohms. Measurement taken after 1 hour. 4.6 Shock (GB/T 2423.5-1995, Method Ea) Frequency change after test ≤± 5ppm.Resonance resistance change after test ≤10ohms.and exhibit no visible damage. 4.7 Drop (GB/T 2423.8-1995, Method Ed) Frequency change after test ≤± Free drop to the steel plate with thickness of 3 mm 5ppm.Resonance resistance from 0.75 m heights for 3 times. change after test ≤10ohms.and exhibit no visible damage. 4.8 Solderability ( IEC60068-2- Terminals shall be covered 58,Test Td:) more then 95% with solder. Passed through the re-flow oven under the following condition. Preheat 150 to 180°C for 60 to 120sec, and soldering time for 20s ± 5s at 235°C, peak soldering time for 10s ± 1s betweein 240 and 250°C. There is no need to do functional test. 812X magnifier. 4.9 Terminal Strength (JIS-C6429 Method 1 & 2 ) Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5kg for at least 60 seconds. 4.10 Resistance to Soldering Frequency change after test ≤± Passed through the re-flow oven under the Heat (IEC60068-2-58,Test 5ppm.Resonance resistance following condition. Preheat 150 to 180°C for 60 to Td: Table 4) change after test ≤10ohms. 120sec, and sodering time for 60s max at 235°C, peak soldering time for 20s max at 265°C max. Measurement taken after DUT being left at room temperature for at least 2 hours. 4.11 OTHERS www.jscj-elec.com Frequency change after test ≤± 10 cycles from -55°C to 125°C. Measurement 5ppm.Resonance resistance taken after DUT being left at room temperature for change after test ≤10ohms. 24±2 hours. No visible damage 3 Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles / direction, total 18 cycles. Measurement taken after 1 hour. rev1.0 Recommended Reflow soldering conditon 5. Recommended Reflow soldering condition (SMD) Solder profile Peak: 260±5℃ Soldering zone: 230℃ or more, 30±10s. Pre-heating zone 1: 150～ 180℃, 90±30s 250 200 150 100 50 0 Temperature profile for reflow soldering 6. Soldering iron method Bit temperature: 350±10℃ Application time of soldering iron:3+1 s. For other procedures, refer to IEC 60068-2-20. www.jscj-elec.com 4 rev1.0 3DFNDJH2XWOLQH'LPHQVLRQV Units:mm 1.5±0.1 3.2±0.1 0.75 4-R0.15 （2.4） 0.1 1.8 1.3 C0.3 0.6 0.1 6XJJHVWHG3DG/D\RXW 1.4 1.1 1.9 1.1 www.jscj-elec.com 5 rev1.0 7DSHDQG5HHO www.jscj-elec.com 6 rev1.0