CJO04-100003320B30

产 品 规 格 书 SPECIFICATIONS FOR PRODUCT 产品类型 TYPE ： Crystal Oscillator 产品规格 SPEC ： 10MHz/5032/3.3V 产品型号 P/N 日期 ： CJO04-100003320B30 DATE ： 2019/07/05 核准及签名 部门 R&D DEPT. APPR. SIGNATURED 拟制 审核 批准 ISSUE CHECK APPROVAL 魏永鑫 许秋菊 杨立新 2019/07/05 2019/07/05 2019/07/05 频率器件事业部 长 科 技 有 限 公 司 江 苏 晶 JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD 地址：中国江苏省南京江北新区产业技术研创园江淼路88号腾飞大厦C座13楼 Add: 13Th Floor, C Block,Tengfei Building,No.88 Jiangmiao Rd. Pukou District,Nanjing City,Jiangsu Province,China 1 rev1.0 JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD SMD5.0 * 3.2 Crystal Oscillator CJO04-100003320B30 1. 1.1 2. Scope: This specification applies to the RoHS crystal oscillator with a frequency of 10MHz which will be used in electronic equipment. Construction: 2.1 Oscillators series: SMD 5.0×3.2 XO 2.2 Package: SMD 5.0×3.2 3. Electrical Characteristics 3.1 Nominal Frequency: 10MHz 3.2 Frequency Stability: ±20 ppm (incl. 25°C tolerance) 3.3 Aging: ±3ppm/year 3.4 Operating Temperature Range: -40℃ to +85℃ 3.5 Storage Temperature Range: -55℃ to +125℃ 3.6 Input Voltage (VDD): +3.3Vdc±10% 3.7 Input Current (IDD): 10mA max 3.8 Output Waveform: CMOS 3.9 Output Symmetry: 50±10% 3.10 Rise/Fall Time: 8ns max 3.11 Output Voltage VOL: 10%VDD VOH: 90%VDD 3.12 Output Load: 15pF 3.13 Output State Control: Enable/disable 3.14 Start-up Time: 5ms max 3.15 Standby current: 10µA max 3.16 Phase Jitter (rms): 1ps rms max 12kHz to 20MHz max 3.17 Oscillation mode: Fundamental 3.18 Others: Not recommended for safety applications 2 rev1.0 4. Reliability Specifications This is the quality control and quality assurance and relaibility tests performance data for the RoHS 10MHz SMD 5.0×3.2 XO related to the specification and approval sheet provided by JSCJ . Standard test condition (TEMP.: 20±15℃. Relative humidity: 65±20%) For any discripancy in GO/NG, test will be done at TEMP.25±2℃. R.H. 65±5%. R NO. 4.1 4.2 4.3 ITEM SPECIFICATION TEST METHOD Temperature Cycle (GB/T Frequency change after test≤± 2423.22-2002, Method Nb) 5ppm. 10 cycles from -55°C to 125°C. Measurement taken after DUT being left at room temperature for 24±2 hours. Low Temperature Storage (GB/T 2423.1-2001, Method Aa) High Temperature Storage (GB/T 2423.2-2001, Method Ba) Spending 72 hrs at -55°C±3°C constant temperature. Measurement taken after DUT being left at room temperature for 24±2 hours. Spending 72 hrs at 125°C±3°C constant temperature. Measurement taken after DUT being left at room temperature for 24±2 hours. Spending 96 hrs at 40 °C ± 3 °C, with 90± 3% R.H. Measurement taken after DUT being left at room temperature for 24±2 hours. Apply 0.75mm vibration at sweep frequency 10～500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. Frequency change after test≤± 5ppm. Frequency change after test≤± 5ppm. 4.4 Humidity (GB/T 2423.32006, Method Cab) Frequency change after test≤± 5ppm. 4.5 Vibration (GB/T 2423.101995, Method Fc) Frequency change after test≤± 5ppm. 4.6 Shock (GB/T 2423.5-1995, Frequency change after test≤± Method Ea) 5ppm. No visible damages. Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles / direction, total 18 cycles. Measurement taken after 1 hour. 4.7 Drop (GB/T 2423.8-1995, Method Ed) Frequency change after test≤± 5ppm. No visible damages. Free drop to the wooden plate from 1.0 m heights for 3 times. 4.8 Solderability (GB/T 2423.28-2005, Method Tc) Terminals shall be covered more then 95% with solder. In 255 ± 5℃ solder bath for 2 ± 0.5 seconds. There is no need to do functioned test. 8-12X magnifier. 4.9 Terminal Strength (JIS-C6429 Method 1 & 2 ) No visible damage Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds. 4.10 Resistance to Soldering Frequency change after test≤± Heat (GB/T 2423.28-2005, 5ppm. Test Tb Method 1B) 4.11 OTHERS 3 Passed through the re-flow oven under the following condition. Preheat to 150°C±5°C for 60 to 120sec,and peak 265°C±5°C for 10s±3sec.Measurement taken after DUT being left at room temperature for at 24±2 hours. rev1.0 Recommended Reflow soldering conditon 5. Recommended Reflow soldering condition (SMD) ■ Solder profile Peak: 260±5℃ Soldering zone: 230℃ or more, 30±10s. Pre-heating zone 1: 150～180℃, 90±30s 250 200 150 100 50 0 Temperature profile for reflow soldering 6. Soldering iron method Bit temperature: 350±10℃ Application time of soldering iron:3+1 s For other procedures, refer to IEC 60068-2-20. CJO04 * * Ω 4 rev1.0 3DFNDJH2XWOLQH'LPHQVLRQV PAD FUNCTION: 1:ENABLE CONTROL 2:GND 3:OUT 4:VDD 6XJJHVWHG3DG/D\RXW 5 rev1.0 7DSHDQG5HHO JSCJ 1000 149 16.0 3.2 5.0 2.0 8.0 7.5 0.3 1000 E=1.75±0.1、 D=1.5±0.1、 D1=1.5+0.25/-0.0、 P0=4.0±0.1、 P2=2.0±0.1 6 rev1.0