产 品 规 格 书
SPECIFICATIONS
FOR
PRODUCT
产品类型 TYPE : Crystal Oscillator
产品规格 SPEC : 25MHz/3225/1.8V
产品型号 P/N : CJO05-250001820B30
日期
DATE : 2020/11/05
核准及签名
部门
R&D
DEPT.
APPR. SIGNATURED
拟制
审核
批准
ISSUE
CHECK
APPROVAL
魏永鑫
许秋菊
杨立新
2020/11/05
2020/11/05
2020/11/05
频率器件事业部
长
科
技
有
限
公
司
江
苏
晶
JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD
地址:中国江苏省南京江北新区产业技术研创园江淼路88号腾飞大厦C座13楼
Add: 13Th Floor, C Block,Tengfei Building,No.88 Jiangmiao Rd. Pukou
District,Nanjing City,Jiangsu Province,China
JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD
SMD3.2 * 2.5 Crystal Oscillator
CJO05-250001820B30
1.
Scope:
1.1
This specification applies to the RoHS crystal oscillator with a frequency of
25MHz which will be used in electronic equipment.
2.
Construction:
2.1
Oscillators series: SMD 3.2×2.5 XO
2.2
Package: SMD 3.2×2.5
3.
Electrical Characteristics
3.1
Nominal Frequency:
25MHz
3.2
Frequency Stability:
±20ppm
(incl. 25°C tolerance)
3.3
Aging:
±3ppm/year
3.4
Operating Temperature Range:
-40℃ to +85℃
3.5
Storage Temperature Range:
-55℃ to +125℃
3.6
Input Voltage (VDD):
+1.8 Vdc±10%
3.7
Input Current (IDD):
10mA max
3.8
Output Waveform:
CMOS
3.9
Output Symmetry:
50±10%
3.10 Rise/Fall Time:
8ns max
3.11 Output Voltage VOL:
10%VDD
VOH:
90%VDD
3.12 Output Load:
15pF
3.13 Output State Control:
Enable/disable
3.14 Start-up Time:
5ms max
3.15 Standby current:
10µA max
3.16 Phase Jitter (rms):
1ps max (12KHz to 20MHz)
3.17 Oscillation mode:
A1
3.18 Others:
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Not recommended for safety applications
1
rev1.0
4.
Reliability Specifications
This is the quality control and quality assurance and relaibility tests performance data for the RoHS
25MHz SMD 3.2×2.5 XO
related to the specification and approval sheet provided by JSCJ .
Standard test condition (TEMP.: 20±15℃. Relative humidity: 65±20%)
For any discripancy in GO/NG, test will be done at TEMP.25±2℃. R.H. 65±5%.
R
NO.
4.1
4.2
4.3
ITEM
SPECIFICATION
TEST METHOD
Temperature Cycle (GB/T Frequency change after test≤±
2423.22-2002, Method Nb) 5ppm.
10 cycles from -55°C to 125°C. Measurement taken after
DUT being left at room temperature for 24±2 hours.
Low Temperature Storage
(GB/T 2423.1-2001, Method
Aa)
High Temperature Storage
(GB/T 2423.2-2001, Method
Ba)
Spending 72 hrs at -55°C±3°C constant temperature.
Measurement taken after DUT being left at room
temperature for 24±2 hours.
Spending 72 hrs at 125°C±3°C constant temperature.
Measurement taken after DUT being left at room
temperature for 24±2 hours.
Spending 96 hrs at 40 °C ± 3 °C, with 90± 3% R.H.
Measurement taken after DUT being left at room
temperature for 24±2 hours.
Apply 0.75mm vibration at sweep frequency 10~500 Hz,
for 2h. 10 cycles in each direction of 3 axis. Measurement
taken after 1 hour.
Frequency change after test≤±
5ppm.
Frequency change after test≤±
5ppm.
4.4
Humidity (GB/T 2423.32006, Method Cab)
Frequency change after test≤±
5ppm.
4.5
Vibration (GB/T 2423.101995, Method Fc)
Frequency change after test≤±
5ppm.
4.6
Shock (GB/T 2423.5-1995, Frequency change after test≤±
Method Ea)
5ppm. No visible damages.
Peak 1000m/s2, normal width 6ms half sine wave form,
3.7m/s, 3 perpendicular axis of samples, 3 cycles /
direction, total 18 cycles. Measurement taken after 1
hour.
4.7
Drop (GB/T 2423.8-1995,
Method Ed)
Frequency change after test≤±
5ppm. No visible damages.
Free drop to the wooden plate from 1.0 m heights for 3
times.
4.8
Solderability (GB/T
2423.28-2005, Method Tc)
Terminals shall be covered more
then 95% with solder.
In 245 ± 5℃ solder bath for 2 ± 0.5 seconds. There is no
need to do functioned test. 8-12X magnifier.
4.9
Terminal Strength (JIS-C6429 Method 1 & 2 )
No visible damage
Mount on a glass-epoxy board (100x50x1.6mm), then
bend to 2mm displacement (velocity 1mm/sec) and keep
for 5 seconds. or pulling force 0.5 kg for at least 60
seconds.
4.10
Resistance to Soldering
Frequency change after test≤±
Heat (GB/T 2423.28-2005,
5ppm.
Test Tb Method 1B)
4.11
OTHERS
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2
Passed through the re-flow oven under the following
condition. Preheat to 150°C±5°C for 60 to 120sec,and
peak 265°C±5°C for 10s±3sec.Measurement taken after
DUT being left at room temperature for at 24±2 hours.
rev1.0
Recommended Reflow soldering conditon
5.
Recommended Reflow soldering condition (SMD)
■
Solder profile
Peak: 260±5℃ Soldering zone: 230℃ or more, 30±10s.
Pre-heating zone 1: 150~180℃, 90±30s
250
200
150
100
50
0
Temperature profile for reflow soldering
6.
Soldering iron method
Bit temperature: 350±10℃ Application time of soldering iron:3+1 s
For other procedures, refer to IEC 60068-2-20.
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3
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TEST CIRCUIT (CMOS LOAD)
OUTPUT WAVEFORM (CMOS LOAD)
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4
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CJO05
6XJJHVWHG3DG/D\RXW
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5
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Inside Structure
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No.
Components
Materials
1
Package
Ceramic(Al2O3)
2
Lid
KV(Fe/Ni/Co)
3
4
Crystal blank
Electrode
SiO2
Ag、Cr
5
Silver glue
Ag、CH3OH、SiO2
6
IC
Si
7
Gold Wire
Au
6
rev1.0
7DSHDQG5HHO
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7
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Package
Inside package
Outside package
JSCJ
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JSCJ
8
rev1.0
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