JMPL1050AK
-100V 37m P-Ch Power MOSFET
Product Summary
Features
Parameter
Value
Unit
VDS
-100
V
VGS(th)_Typ
-2.0
V
-30
A
• RoHS and Halogen-Free Compliant
ID (@ VGS = -10V) (1)
RDS(ON)_Typ (@ VGS = -10V)
37
m
• 100% UIS Tested, 100% Rg Tested
RDS(ON)_Typ (@ VGS = -4.5V)
50
m
• Low On-Resistance
• Excellent Gate Charge x RDS(ON) Product (FOM)
• Pb-Free Lead Plating
Applications
• Battery Management
• DC/DC in Telecoms and Inductrial
• Hard Switching and High Speed Circuit
TO‐252‐3L Top View
D
D
G
G
S
S
Ordering Information
Device
Package
# of Pins
Marking
MSL
TJ (°C)
Media
Quantity (pcs)
JMPL1050AK-13
TO-252-3L
3
PL1050A
1
-55 to 150
13-inch Reel
2500
Absolute Maximum Ratings (@ TA = 25°C unless otherwise specified)
Parameter
Symbol
Value
Unit
Drain-to-Source Voltage
VDS
-100
V
Gate-to-Source Voltage
VGS
±20
V
TC = 25°C
Continuous Drain
Current (1)
-30
ID
TC = 100°C
Pulsed Drain Current (2)
A
-19
IDM
-68
Avalanche Current
(3)
IAS
-27
A
Avalanche Energy
(3)
EAS
109
mJ
Power Dissipation (4)
TC = 25°C
96
PD
TC = 100°C
Junction & Storage Temperature Range
W
38
-55 to 150
TJ, TSTG
RDS(ON) vs. VGS
°C
Gate Charge
150
10
VDS = -50V
ID = -15A
120
8
90
6
- VGS (V)
RDS(ON) (m)
A
60
30
ID = -15A
4
2
0
0
0
5
10
15
20
0
5
Rev. 1.1
10
15
20
25
Qg (nC)
-VGS (V)
JieJie Microelectronics Co., Ltd.
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Page 1 of 6
JMPL1050AK
Electrical Characteristics (@ TJ = 25°C unless otherwise specified)
Parameter
Conditions
Symbol
Min.
Typ.
Max.
Unit
STATIC PARAMETERS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
Gate Threshold Voltage
Static Drain-Source ON-Resistance
V(BR)DSS ID = -250A, VGS = 0V
IDSS
IGSS
VGS(th)
RDS(ON)
VDS = VGS, ID = -250A
A
-5.0
VDS = 0V, VGS = ±20V
±100
-1.0
nA
-2.0
-3.0
V
37
50
m
VGS = -4.5V, ID = -10A
50
66
m
30
-1.0
V
-96
A
VGS = -10V, ID = -15A
gFS
VDS = -5V, ID = -15A
Diode Forward Voltage
VSD
IS = -1A, VGS = 0V
IS
V
-1.0
TJ = 55°C
Forward Transconductance
Diode Continuous Current
-100
VDS = -80V, VGS = 0V
-0.7
TC = 25°C
S
DYNAMIC PARAMETERS (5)
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate Resistance
Rg
VGS = 0V, VDS = -50V, f = 1MHz
VGS = 0V, VDS= 0V, f = 1MHz
1412
pF
222
pF
2.6
pF
10.2
20
nC
12.6
nC
6.4
nC
nC
SWITCHING PARAMETERS (5)
Total Gate Charge (@ VGS = -10V)
Qg
Total Gate Charge (@ VGS = -6.0V)
Qg
Gate Source Charge
Qgs
Gate Drain Charge
Qgd
3.3
Turn-On DelayTime
tD(on)
10.7
ns
Turn-On Rise Time
tr
56
ns
Turn-Off DelayTime
tD(off)
45
ns
81
ns
VGS = 0 to -10V
VDS = -50V, ID = -15A
VGS = -10V, VDS = -50V
RL = 3.3, RGEN = 6
Turn-Off Fall Time
tf
Body Diode Reverse Recovery Time
trr
IF = -15A, dIF/dt = -100A/s
51
ns
Body Diode Reverse Recovery Charge
Qrr
IF = -15A, dIF/dt = -100A/s
130
nC
Thermal Performance
Parameter
Symbol
Typ.
Max.
Unit
Thermal Resistance, Junction-to-Ambient
RJA
47
56
°C/W
Thermal Resistance, Junction-to-Case
RJC
1.0
1.3
°C/W
Notes:
1. Computed continuous current assumes the condition of TJ_Max while the actual continuous current depends on the thermal & electro-mechanical
application board design.
2. This single-pulse measurement was taken under TJ_Max = 150°C.
3. This single-pulse measurement was taken under the following condition [L = 300H, VGS = -10V, VDD = -50V] while its value is limited by
TJ_Max = 150°C.
4. The power dissipation PD is based on TJ_Max = 150°C.
5. This value is guaranteed by design hence it is not included in the production test.
Rev. 1.1
JieJie Microelectronics Co., Ltd.
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Page 2 of 6
JMPL1050AK
Typical Electrical & Thermal Characteristics
10
50
VGS = -10V
VDS = -5.0V
VGS = -6.0V
VGS = -8.0V
40
8
6
30
- ID (A)
- ID (A)
VGS = -4.5V
VGS = -4.0V
20
TJ = 125°C
4
TJ = 25°C
10
2
VGS = -3.5V
0
0
0
1
2
3
4
0
5
3
4
Figure 1: Saturation Characteristics
Figure 2: Transfer Characteristics
5
2.5
70
2
Normalized RDS(ON)
RDS(ON) (m)
2
- VGS (V)
80
60
VGS = -4.5V
50
VGS = -10V
40
VGS = -10V
ID = -15A
1.5
VGS = -4.5V
1
ID = -10A
0.5
30
20
0
0
5
10
15
20
25
30
-50
0
50
100
150
- ID (A)
Temperature (℃)
Figure 3: RDS(ON) vs. Drain Current
Figure 4: RDS(ON) vs. Junction Temperature
3
120
VGS = 0V
VGS = VDS
ID = -250A
110
- VBR(DSS) (V)
2.5
- VGS(th) (V)
1
- VDS (V)
ID = -1.0mA
2
ID = -250A
100
90
1.5
80
1
-50
Rev. 1.1
0
50
100
150
-50
0
50
100
150
Temperature (℃)
Temperature (℃)
Figure 5: VGS(th) vs. Junction Temperature
Figure 6: VBR(DSS) vs. Junction Temperature
JieJie Microelectronics Co., Ltd.
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Page 3 of 6
JMPL1050AK
Typical Electrical & Thermal Characteristics
100
10000
Ciss
10
Capacitance (pF)
1000
- IS (A)
1
TJ = 125°C
0.1
TJ = 25°C
0.01
Coss
100
10
Crss
0.001
0.0
0.2
0.4
0.6
0.8
1.0
1
1.2
0
20
40
60
80
- VSD (V)
- VDS (V)
Figure 7: Body-Diode Characteristics
Figure 8: Capacitance Characteristics
100
100
40
80
PD (W)
- ID (A)
30
20
60
40
10
20
0
0
0
25
50
75
100
125
150
0
25
50
75
100
125
TCASE (C)
TCASE (C)
Figure 9: Current De-rating
Figure 10: Power De-rating
300
150
1000
250
100
1.0s
- ID (A)
PD (W)
200
150
Limited by
RDS(ON)
10s
10
100s
100
DC
1.0ms
1
50
10ms
TJ_Max = 150°C
TC = 25°C
0
0.0001
0.1
0.001
0.01
0.1
1
10
0.1
1
10
100
1000
Pulse Width (s)
- VDS (V)
Figure 11: Single Pulse Power Rating, Junction-to-Case
Figure 12: Maximum Safe Operating Area
Rev. 1.1
JieJie Microelectronics Co., Ltd.
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Downloaded From Oneyac.com
Page 4 of 6
JMPL1050AK
Typical Electrical & Thermal Characteristics
10
Normalized Transient
Thermal Resistance, ZJC
Duty Cycle = Ton/TPeak
TJ = TC + PD x ZJC x RJC
RJC = 1.0°C/W
1
0.1
Duty = 0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 13: Normalized Maximum Transient Thermal Impedance
Rev. 1.1
JieJie Microelectronics Co., Ltd.
All product information are copyrighted and subject to legal disclaimers
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Page 5 of 6
JMPL1050AK
TO-252-3L Package Information
Package Outline Type-A
E
b3
V1
c1
H
D
D1
L
DIM.
E1
c
b
e
Detail A
Top View
Bottom View
Side View
V2
A1
A
M AX.
2.18
2.30
2.39
A1
0
--
0.13
b
0.64
0.76
0.89
c
0.40
0.50
0.61
c1
0.46
0.50
0.58
6.23
D
5.97
6.10
D1
5.05
--
--
E
6.35
6.60
6.73
E1
4.32
--
--
b3
5.21
5.38
5.55
2.29 BSC
H
9.40
10.00
10.40
L
0.89
--
1.27
L2
1.40
--
1.78
V1
V1
L2
NOM.
A
e
V1
Front View
MILLIMETER
M IN.
V2
7° REF
0°
--
6°
Detail A
Package Outline Type-B
E
b3
DIM.
H
D
D1
L
V1
c1
E1
MILLIMETER
MIN.
NOM.
MAX.
A
2.10
2.30
2.40
A1
0
--
0.13
b
0.66
0.76
0.86
5.55
b3
5.21
5.38
c
0.40
0.50
0.60
c1
0.44
0.50
0.58
D
5.90
6.10
6.30
D1
c
b
e
Top View
Detail A
Bottom View
Side View
A
V2
A1
V1
L2
E
6.40
6.60
6.80
E1
4.63
-
-
2.29 BSC
e
H
9.50
10.00
L
1.09
--
1.21
L2
1.35
--
1.65
V1
V1
Front View
5.30REF
V2
10.70
7° REF
0°
--
6°
Detail A
Recommended Soldering Footprint
2.800
11.350
6.700
6.250
4.572
1.500
DIMENSION S:MILLIMETERS
Rev. 1.1
JieJie Microelectronics Co., Ltd.
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