2450BM15A0002E

High Frequency Ceramic Solutions P/N 2450BM15A0002 2.45 GHz Impedance Matched Balun-BPF: For TI CC253X, CC254X, CC257X, CC853X and CC852X Chipset family Detail Specification: 4/29/2013 Page 1 of 2 General Specifications 2450BM15A0002 Part Number 2400 - 2500 Frequency (MHz) 50 Ω Unbalanced Impedance Phase Diff. Impedance match to T.I. CC253X, CC254X, CC257X, CC853X and CC852X Chipsets Balanced Differential Impedance Insertion Loss 1.5 dB max. (-40°C to +85°C) Insertion Loss 1.7 dB max. (-40°C to +125°C) 18 min. @ 4800~5000MHz 20 min. @ 7200~7500MHz 180° ± 15 (-40°C to 125°C) 2W max. Input Power 4,000 Reel Quanity 9.5 dB min. Return Loss (-40°C to 125°C) 12 min. @ 1GHz Differential Mode Attenuation (dB) -40°C to 125°C Operating Temperature -40°C to +125°C Recommended Storage Conditions +5 ~ +35 °C, Humidity 45~75%RH, 18 mos. max Part Number Explanation P/N Suffix Packaging Style Bulk Suffix = S Eg. 2450BM15A0002S T&R Suffix = E Eg. 2450BM15A0002E Terminal Configuration Suffix = None Eg. 2450BM15A0002(E or S) No. Function 1 Unbalanced Port 2 GND Termination Style 100% Tin Evaluation Board 2450BM15A0002-EBSMA 3 Balanced Port In mm 4 Balanced Port L 0.079 ± 0.004 2.00 ± 0.10 5 GND W 0.049 ± 0.004 1.25 ± 0.10 6 GND T 0.028 ± 0.004 0.70 ± 0.10 a 0.012 ± 0.004 0.30 ± 0.10 b 0.008 ± 0.004 0.20 ± 0.10 c 0.012 +.004/-.008 0.30 +0.1/-0.2 g 0.014 ± 0.004 0.35 ± 0.10 Mechanical Dimensions p 0.026 ± 0.002 W L c a       p T g 0.65 ± 0.05 b Mounting Considerations Mount these devices with brown mark facing up. Units: mm * Line width should be designed to provide 50 Ω impedance matching characteristics. 0.35 Solder Resist Note: No DC Blocking Capacitor required (internal) * 0.8 Land    Through-hole (0.3) T.I. Chipset    1.0 0.30 Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821 Ver 1.2 2013 Johanson Technology, Inc. All Rights Reserved High Frequency Ceramic Solutions 2.45 GHz Impedance Matched Balun-BPF: For TI CC253X, CC254X, CC257X, CC853X and CC852X Chipset family Detail Specification: P/N 2450BM15A0002 4/29/2013 Page 2 of 2 Typical Electrical Performance at 25°C and 125°C 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 freq, GHz 25C Unbalanced RL 25C Balanced Return Loss 25C Insertion Loss/Attenuation (Differential Mode) 125C Unbalanced RL 125C Balanced Return Loss 125C Insertion Loss/Attenuation (Differential Mode) Technical notes and Reference Designs Technical Note: www.johansontechnology.com/CC2530AppNote Gerber Files and TI Reference Notes: http://www.ti.com/tool/cc2530balun-refdes Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821 Ver 1.2 2013 Johanson Technology, Inc. All Rights Reserved