SEMICONDUCTOR
TECHNICAL DATA
ULTRA HIGH SPEED SWITCHING APPLICATION. FEATURES
Small Package Low Forward Voltage Small Total Capacitance : ESM. : VF=0.9V (Typ.).
2 E
KDS121E
SILICON EPITAXIAL PLANAR DIODE
B
Fast Reverse Recovery Time : trr=1.6ns(Typ.).
A G H
D
DIM A B
C D E G H J
: CT=0.9pF (Typ.).
MILLIMETERS _ 1.60 + 0.10 _ 0.85 + 0.10 _ 0.70 + 0.10
0.27+0.10/-0.05 _ 1.60 + 0.10 _ 1.00 + 0.10 0.50 _ 0.13 + 0.05
1
3
C
MAXIMUM RATING (Ta=25
CHARACTERISTIC Maximum (Peak) Reverse Voltage Reverse Voltage Maximum (Peak) Forward Current Average Forward Current Surge Current (10ms) Power Dissipation Junction Temperature Storage Temperature Range
)
SYMBOL VRM VR IFM IO IFSM PD Tj Tstg RATING 85 80 300 * 100 * 2* 100 150 -55 150 UNIT V
J
3
1. ANODE 1
V mA mA A mW
2. ANODE 2 3. CATHODE
2 1
ESM
Note : * Unit Rating. Total Rating=Unit Rating x 1.5
Marking
B3
ELECTRICAL CHARACTERISTICS (Ta=25
CHARACTERISTIC
)
TEST CONDITION IF=1mA IF=10mA IF=100mA VR=80V VR=0, f=1MHz IF=10mA MIN. TYP. 0.60 0.72 0.90 0.9 1.6 MAX. 1.20 0.5 3.0 4.0 A pF nS V UNIT
SYMBOL VF(1)
Forward Voltage
VF(2) VF(3)
Reverse Current Total Capacitance Reverse Recovery Time
IR CT trr
2007. 5. 10
Revision No : 3
1/2
KDS121E
IF - VF
10 FORWARD CURRENT I F (mA)
3
IR - VR
10 REVERSE CURRENT I R (µA)
10 10
2
1
Ta=100 C Ta=75 C
=2 5 =-2 C 5 C
C
10
10
-1
0
Ta =
Ta
1 10 10
-1
Ta
Ta=50 C
-2
10
Ta=25 C
-2
10 0 0.2 0.4 0.6 0.8 1.0 1.2 FORWARD VOLTAGE V F (V)
-3
0
20
40
60
80
REVERSE VOLTAGE VR (V)
C T - VR
REVERSE RECOVERY TIME t rr (ns) 2.0 TOTAL CAPACITANCE CT (pF)
f=1MHz Ta=25 C
t rr - I F
100 50 30
Ta=25 C Fig. 1
1.6 1.2 0.8 0.4 0 0.1 0.3 1 3 10 30 100 REVERSE VOLTAGE VR (R)
10 5 3
1 0.5 0.1 0.3 1 3 10 30 100 FORWARD CURRENT I F (mA)
Fig. 1. REVERSE RECOVERY TIME(t rr ) TEST CIRCUIT
INPUT WAVEFORM 0
INPUT
0.01µF
DUT OUTPUT SAMPLING OSCILLOSCOPE (RIN =50Ω) I F =10mA 0 IR
WAVEFORM
0.1 I R
50Ω
2kΩ
-6V 50ns
E t rr PULSE GENERATOR (R OUT =50Ω)
2007. 5. 10
Revision No : 3
50Ω
2/2
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