SEMICONDUCTOR
TECHNICAL DATA
ULTRA HIGH SPEED SWITCHING APPLICATION. FEATURES
Low Forward Voltage. Fast Reverse Recovery Time. Small Total Capacitance.
1
KDS165T
SILICON EPITAXIAL PLANAR DIODE
E B 4
DIM MILLIMETERS _ A 2.9 + 0.2
B C D 1.6+0.2/-0.1 _ 0.70 + 0.05 _ 0.4 + 0.1 2.8+0.2/-0.3 _ 1.9 + 0.2 _ 0.16 + 0.05 0.00-0.10 0.25+0.3/-0.15 _ 0.60 + 0.1 _ 0.55 + 0.1
A
F
2
3
MAXIMUM RATING (Ta=25
CHARACTERISTIC Maximum (Peak) Reverse Voltage Reverse Voltage Maximum (Peak) Forward Current Average Forward Current Surge Current (10ms) Power Dissipation Junction Temperature Storage Temperature Range
)
SYMBOL VRM VR IFM * IO * IFSM * PD ** Tj Tstg RATING 85 80 300 100 2 900 150 -55 150 0.8 ) UNIT V V mA mA A mW
K C
H I I
E F G H I J K
G
D
4 D1 1
3 D2 2
TSQ
* : Unit Rating. (Total Rating=Unit Rating 1.5) ** : Total rating, Package mounted on a ceramic board (600
Marking
4
3
Lot No.
Type Name
G3
1 2
ELECTRICAL CHARACTERISTICS (Ta=25
CHARACTERISTIC VF(1) Forward Voltage VF(2) VF(3) Reverse Current Total Capacitance Reverse Recovery Time IR CT trr
)
TEST CONDITION IF=1mA IF=10mA IF=100mA VR=80V VR=0, f=1MHz IF=10mA MIN. TYP. 0.60 0.72 0.90 0.9 1.6 MAX. 1.20 0.5 3.0 4.0 A pF nS V UNIT
SYMBOL
2005. 6. 21
Revision No : 0
1/2
KDS165T
I F - VF
10 FORWARD CURRENT I F (mA) 10 10
C Ta =2 Ta 5 C =-2 5 C 0
3
I R - VR
10 REVERSE CURRENT I R (µA)
Ta=100 C Ta=75 C
2
1
1 10 10
-1
Ta =
10
10
-1
Ta=50 C
-2
10
Ta=25 C
-2
0
0.2
0.4
0.6
0.8
1.0
1.2
10
-3
0
20
40
60
80
FORWARD VOLTAGE V F (V)
REVERSE VOLTAGE VR (V)
C T - VR
REVERSE RECOVERY TIME t rr (ns) 2.0 TOTAL CAPACITANCE CT (pF) 1.6 1.2 0.8 0.4 0
f=1MHz Ta=25 C
t rr
100 50 30
- IF
Ta=25 C Fig. 1
10 5 3
1 0.5 0.1 0.3 1 3 10 30 100
0.1
0.3
1
3
10
30
100
REVERSE VOLTAGE VR (R)
FORWARD CURRENT I F (mA)
Fig. 1. REVERSE RECOVERY TIME(t rr ) TEST CIRCUIT INPUT WAVEFORM 0
INPUT
0.01µF
DUT OUTPUT SAMPLING OSCILLOSCOPE (RIN =50Ω) I F =10mA 0 IR
WAVEFORM
0.1 I R
50Ω
2kΩ
-6V 50ns
E t rr PULSE GENERATOR (R OUT =50Ω)
2005. 6. 21
Revision No : 0
50Ω
2/2
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