KIA2431AT

SEMICONDUCTOR TECHNICAL DATA PROGRAMMABLE PRECISION REFERENCES The KIA2431P/S/T/M/AP/AS/AT/AM/BM are integrated circuits are three-terminal programmable shunt regulator diodes. These monolithic IC voltage reference operate as a low temperature coefficient zener which is programmable from Vref to 16 volts with two external resistors. These devices exhibit a wide operating current range of 80μ A to 50mA with a typical dynamic impedance of 0.22Ω. The characteristics of these references make them excellent replacements for zener diodes in many applications such as digital voltmeters, power supplies, and op amp circuitry. FEATURES ・Programmable Output Voltage to 16 Volts. KIA2431P/S/T/M/AP/AS/ AT/AM/BM BIPOLAR LINEAR INTEGRATED CIRCUIT LINE UP ITEM KIA2431 P S T M AP AS AT AM BM Package TO-92 TSM TSV SOT-23 TO-92 TSM TSV SOT-23 SOT-23 Vref Tolerance (%) ±1.5 KIA2431 KIA2431 ±1.0 ±0.5 ・Low Dynamic Output Impedance : 0.22Ω(Typ.). A ・Sink Current Capability of 80μ to 50mA. ・Equivalent Full-Range Temperature Coefficient of 30ppm/℃ (Typ.). ・Temperature Compensated for Operation Over Full Rated Operating Temperature Range. ・Low Output Noise Voltage. Marking Type No. KIA2431T/S/M KIA2431AT/AS/AM KIA2431BM Marking 24A 24B 24C 2011. 7. 6 Revision No : 6 1/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM MAXIMUM RATINGS (Ta=25℃) (Full operating ambient temperature range applies unless otherwise noted.) CHARACTERISTIC Cathode To Anode Voltage Cathode Current Range, Continuous Reference Input Current Range, Continuos Operating Junction Temperature Operating Temperature Storage Temperature KIA2431P/AP KIA2431S/AS (Note1) Total Power Dissipation KIA2431T/AT KIA2431AM/BM (Note2) Note1) Package Mounted on 99.5% Alumina (10㎜×8㎜×0.6㎜) Note2) Package Mounted on a ceramic board (600㎟×0.8㎜) PD SYMBOL VKA IK Iref Tj Topr Tstg RATING 16 50 3 150 -40～85 -65～150 700 900 550 350 mW UNIT V mA mA ℃ ℃ ℃ ELECTRICAL CHARACTERISTICS (Ta=25℃) CHARACTERISTICS KIA2431P/S/T/M Reference Input Voltage KIA2431AP/AS/AT/AM KIA2431BM Reference Input Voltage Deviation Over Temperature Range Ratio of Change in Reference Input Voltage to Change in Cathode to Anode Voltage Reference Input Current Reference Input Current Deviation Over Temperature Range Minimum Cathode Current For Regulation Off-State Cathode Current Dynamic Impedance Ta=25℃ ΔVref ΔVref / ΔVKA Iref ΔIref Imin Ioff Zka Figure 1 (Note 1) Figure 2 Figure 2 Figure 2 Figure 1 Figure 3 Figure 1 (Note 2) VKA=Vref , IK=10mA IK=10mA ΔVKA= 16V～Vref Vref Figure 1 VKA=Vref , IK=10mA SYMBOL TEST CIRCUIT TEST CONDITION MIN. 1.222 1.228 1.234 TYP. 1.240 1.240 1.240 7.0 -0.6 0.15 0.05 55 2.6 0.22 MAX. 1.258 1.252 1.246 20 -1.5 0.5 0.3 80 1000 0.4 UNIT V V V mV mV/V μ A μ A μ A nA Ω IK=10mA, R1=10kΩ, R2=∞ IK=10mA, R1=10kΩ, R2=∞ VKA=Vref VKA=16V, Vref=0V VKA=Vref, IK=0.08mA～50mA, f≦1.0kHz 2011. 7. 6 Revision No : 6 2/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM Example : ΔVref = 5.0mV and slope is positive, Vref at 25℃=1.245V, ΔTa=110℃ α ref = V 0.005×106 = 36.5 ppm/℃ 110×1.245 Note 2: The dynamic impedance Zka is defined as: |Zka| = ΔVKA ΔIk * CKA greater than 100nF is needed for stability. Note 1: The deviation parameter ΔVref is defined as the differences between the maximum and minimum values obtained over the full operating ambient temperature range that applies. When the device is programmed with two external resistors, R1 and R2, (refer to Figure 2) the total dynamic impedance of the circuit is defined as: |Zka'| = |Zka| (1+ R1 R2 ) The average temperature coefficient of the Reference input voltage, ΔVref , is defined as: ( )= ΔVref Vref at 25℃ ΔTa ΔVref × 106 ΔTa(Vref at 25℃) ) × 106 V α ref ( ppm ℃ = α ref can be positive or negative depending on whether V Vref Min. or Vref Max. occurs at the lower ambient temperature. 2011. 7. 6 Revision No : 6 3/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM 2011. 7. 6 Revision No : 6 4/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM 2011. 7. 6 Revision No : 6 5/6 KIA2431P/S/T/M/AP/AS/AT/AM/BM PRECAUTION FOR USE SOLDERING Flat Package (TSM/TSV/SOT-23 Package) Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. (a) When employing solder reflow method ① Atmospheric temperature around resin surfaces must be less than 240℃, not exceeding the time length of 10 sec. ② Recommend temperature profile ③ Precautions on heating method When resin in kept exposed to high temperature for a long time, device reliability may be marred. Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. (b) When employing halogen lamps or infrared-ray heaters When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. ※ Please keep a reflow solder operating when TSM/TSV package's soldering. 2011. 7. 6 Revision No : 6 6/6