KIA7027AF-RTF/P

SEMICONDUCTOR TECHNICAL DATA KIA7019AP/AF/AT~ KIA7045AP/AF/AT BIPOLAR LINEAR INTEGRATED CIRCUIT VOLTAGE DETECTOR Function of this IC is accurately resetting the system after detecting voltage at the time of switching power on and instantaneous power off in various CPU systems and other logic systems. FEATURES ・Current Consumption is Low. ICCL=300μA Typ. ICCH=30μA Typ. ・Resetting Output Minimum Guarantee Voltage is Low 0.8V Typ. ・Hysteresis Voltage is Provided. 50mV Typ. ・Reset Signal Generation Starting Voltages : KIA7019 1.9V Typ. KIA7033 3.3V Typ. KIA7021 2.1V Typ. KIA7034 3.4V Typ. KIA7023 2.3V Typ. KIA7035 3.5V Typ. KIA7025 2.5V Typ. KIA7036 3.6V Typ. KIA7027 2.7V Typ. KIA7039 3.9V Typ. KIA7029 2.9V Typ. KIA7042 4.2V Typ. KIA7031 3.1V Typ. KIA7045 4.5V Typ. KIA7032 3.2V Typ. ・Taping Type is also Available. ・Qualified to AEC-Q100. APPLICATIONS (1) As Control Circuit of Battery-Backed Memory. (2) As Measure Against Erroneous Operations at Power ON-OFF. (3) As Measure Against System Runaway at Instantaneous Break of Power Supply etc. (4) As Resetting Function for the CPU-Mounted Equipment, such as Personal Computers, Printers, VTRs and so forth. Marking Type No. Marking Type No. Marking Type No. Marking KIA7019AF/AT 6A KIA7029AF/AT 6F KIA7035AF/AT 6L KIA7021AF/AT 6B KIA7031AF/AT 6G KIA7036AF/AT 6M KIA7023AF/AT 6C KIA7032AF/AT 6H KIA7039AF/AT 6N KIA7025AF/AT 6D KIA7033AF/AT 6J KIA7042AF/AT 6P KIA7027AF/AT 6E KIA7034AF/AT 6K KIA7045AF/AT 6R 2014. 10. 13 Revision No : 5 1/4 KIA7019AP/AF/AT~KIA7045AP/AF/AT MAXIMUM RATINGS (Ta=25℃) CHARACTERISTIC Supply Voltage SYMBOL RATING UNIT VCC -0.3～+15.0 V 400 KIA7019AP～45AP Power Dissipation (Package Limitation) PD KIA7019AF～45AF mW 500 350 KIA7019AT～45AT Operating Temperature Topr -30～+85 ℃ Storage Temperature Tstg -55～+150 ℃ ELECTRICAL CHARACTERISTICS (VCC=5V, VEE=GND, Ta=25℃) CHARACTERISTIC Detecting Voltage SYMBOL VS TEST CIRCUIT 1 TEST CONDITION RL=200Ω VOL≦0.4V MIN. TYP. MAX. KIA7019 1.75 1.9 2.05 KIA7021 1.95 2.1 2.25 KIA7023 2.15 2.3 2.45 KIA7025 2.35 2.5 2.65 KIA7027 2.55 2.7 2.85 KIA7029 2.75 2.9 3.05 KIA7031 2.95 3.1 3.25 KIA7032 3.05 3.2 3.35 KIA7033 3.15 3.3 3.45 KIA7034 3.25 3.4 3.55 KIA7035 3.35 3.5 3.65 KIA7036 3.45 3.6 3.75 KIA7039 3.75 3.9 4.05 KIA7042 4.05 4.2 4.35 KIA7045 4.35 4.5 4.65 UNIT V Low-Level Output Voltage VOL 1 RL=200Ω - - 0.4 V Output Leakage Current IOH 1 VCC=15V - - 0.1 μA ΔVs 1 RL=200Ω 30 50 100 mV Vs/ΔT 1 RL=200Ω - ±0.01 - %/℃ Circuit Current at on Time IccL 1 VCC=Vsmin.-0.05V - 300 500 μA Circuit Current at off Time IccH 1 VCC=5.25V - 30 50 μA Threshold Operating Voltage Vopr 1 RL=200Ω, VOL≦0.4V - 0.8 - V "L" Transmission Delay Time tpHL 2 RL=1.0kΩ, CL=100pF - 10 - μs "H" Transmission Delay Time tpLH 2 RL=1.0kΩ, CL=100pF - 15 - μs Output Current at on Time I IoL I 1 VCC=Vsmin.-0.05V, Tc=25℃ 20 - - mA Output Current at on Time II IoL II 1 VCC=Vsmin.-0.05V, Tc=-30～+75℃ 16 - - mA Hysteresis Voltage Detecting Voltage Temperature Coefficient 2014. 10. 13 Revision No : 5 2/4 KIA7019AP/AF/AT~KIA7045AP/AF/AT 2014. 10. 13 Revision No : 5 3/4 KIA7019AP/AF/AT~KIA7045AP/AF/AT PRECAUTION FOR USE Lead-Free Soldering Condition. Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. [Lead-Free Soldering Temperature Profile] 1. When employing solder reflow method 1) Soldering Condition ⓐ Standard Condition : 250℃ (Temperature), 10±1sec. (Time) ⓑ Peak Condition : 260±3℃ 2) Recommend temperature profile 3) Precautions on heating method When resin in kept exposed to high temperature for a long time, device reliability may be marred. Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. 2. When employing halogen lamps or infrared-ray heaters When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. ※ Please keep a reflow solder operating when Surface Mount Package s Soldering. 2014. 10. 13 Revision No : 5 4/4