KPF401G01A

SEMICONDUCTOR TECHNICAL DATA FEATURES Broad Pressure Range : 50~1,000kPa. High Sensitivity, Excellent Linearity. Highly Stable in Temperature Change. KPF500G01A ~ KPF102G01A Semiconductor Pressure Sensor APPLICATIONS Medical Deivces. Industrial Instrumentations. Pressure Switch, Water Height Control, Pneumatic Devices etc. Home Appliances. MODEL NUMBER FOR ORDERING KP F 000 G 00 A Package Pin Configuration No Mark : Standard A : Type 1 Silicon Pressure Sensor Package Type 00 : Die 01~ : Package Series ON/OFF Chip N:ON Chip (Amplified) Rated Pressure F:OFF Chip (Not Amplified) 123 12 103=12,000kPa Measuring Pressure A : Absolute Pressure D : Differential Pressure G : Gage Pressure PIP1 MAXIMUM RATING ITEM Model No. Classification Rated Pressure 0.51 Measurable Pressure Range Maximum Pressure Load Bridge Impedance Operating Temperature Storage Temperature -50 ~ 50 1.02 -100 ~ 100 2.04 -100 ~ 200 4.08 -100 ~ 400 6.12 -100 ~ 600 8.16 -100 ~ 800 10.20 -100 ~ 1000 kgf/ kPa kPa(kgf/ ) SPEC. KPF500G01A KPF101G01A KPF201G01A KPF401G01A KPF601G01A KPF801G01A 500 50 101 100 201 200 401 400 601 600 801 800 KPF102G01A 102 1000 UNIT kPa Twice of Rated Pressure 3000 ~ 6000 -20 ~ 100 -40 ~ 120 1.5 Times of Reated Pressure ELECTRICAL CHARACTERISTICS ITEM Classification Test Condition Compensational Temperature Range Full Scale Voltage Offset Voltage Linearity Pressure Hysteresis Mechanical Response Time Temperature Coefficient Of Offset (TCO) Temperature Coefficient Of Sensitivity (TCS) 500 101 201 SPEC. 401 601 801 102 UNIT - Operating Input Current 1.5 constant, Ambient Temperature Ta=25 0 ~ 50 60 ~ 140 20 0.3 0.5 2 5.0 2.5 mV mV %FS %FS msec %FS %FS Comment) 1. Operating humidity 25~80%RH. (unless otherwise noted) 2. Please, consult us when you use any other pressure media except air. 2007. 6. 15 Revision No : 2 1/4 KPF500G01A ~ KPF102G01A RELIABILITY TEST ITEMS High Temp. Storage Low Temp. Storage Steady State Operating Life Test Low Temp. Operating High Temp. Operating Temperature / Humidity Operating Heat Resistance Environment Test Temp. Cycle Vibration Drop Mechanical Test Lead Fatigue Solderability 120 , 1000hrs TEST CONDITIONS -40 , 1000hrs 25 5 , 1 million times, Rated Pressure -20 , 1 million times, Rated Pressure 100 40 260 , 1 million times, Rated Pressure , 90%RH, 1 million times, Rated Voltage , 10 seconds -40 ~120 , 30minutes/1Cycle, 100Cycles Amplitude : 1.5mm, Frequency : 10~55Hz, X, Y, Z(3-directions), 2 hrs each direction 75cm height, 2 times Tensile Strength : 9.8N(1kgf), 10seconds Bending Strength : 4.9N(0.5kgf), Right/Left 90 , 1time 230 , 5 seconds CHARACTERISTIC GRAPHS 1. Full Scale Voltage Characteristics Operating Input Current : 1.5mA, Temperature : 25 C 120 100 Full Scale Voltage (mV) 80 TCO (%FS) 60 40 20 0 -20 0 1/2Pr Rated Pressure (kPa) Pr 2. Temperature Coefficient of Offset (TCO) _ Operating Input Current : 1.5mA, Spec. : + 5.0 %FS 5.0 4.0 3.0 2.0 1.0 0 -1.0 -2.0 -3.0 -4.0 -5.0 0 25 Temperature ( C) 50 TCS (%FS) 3. Temperature Coefficient of Sensitivity (TCS) _ Operating Input Current : 1.5mA, Spec. : + 2.5%FS 2.5 2.0 1.5 1.0 0.5 0 -0.5 -1.0 -1.5 -2.0 -2.5 0 25 Temperature ( C) 50 4. High Temperature continuous Operating Test 100°C, 1 million times : After testing, offset and full scale voltage variation is very small. Offset Voltage Variation 3 2 1 0 -1 -2 -3 0 500,000 Pressure Cycle 1,000,000 Full Scale Voltage Variation (%FS) Offset Voltage Variation (%FS) 3 2 1 0 -1 -2 -3 0 Full Scale Voltage Variation 500,000 Pressure Cycle 1,000,000 2007. 6. 15 Revision No : 2 2/4 KPF500G01A ~ KPF102G01A PACKAGE DIMENSIONS AND PC BOARD PATTERN (Unit :mm) Pressure Inlet Φ 1.1 7.2 7.2 Φ4 0 Φ2.5 -0.1 4 R 0.2 R 0.5 0.8 5 3.5 1.75 4.3 0.41 _ 0.25 + 0.1 _ 9.5 + 1.5 _ 2.5 + 0.25 7.5 _ 0.5 + 0.1 _ 0.25 2.5 + 0.9 dia Logo 1 6 Model No 2 5 2.5 Lot No 3 Remark 4 2.5 Pin Hole PIN CONFIGURATION Terminal No. 1 2 3 4 5 6 Meaning (-)Output (+)Input (+)Output Open (-)Input (-)Output Constant current source i = 1.5mA + 2 V R2 R1 1 6 R3 R4 - 3 5 2007. 6. 15 Revision No : 2 3/4 KPF500G01A ~ KPF102G01A Note 1. Mounting on printed circuit boards When mounting a transistor on a printed circuit, it is assumed that lead wires will be processed or reformed due to space limitation or relations with other components. Even if no such special processing reforming is conducted exercise care on the following points : (a) Make the spaces of lead wire inserting holes on the printed circuit board the same as those of lead wires on a transistor. (b) Even if The spaces are not the same, do not pull the lead wires or push heavily against the sensor element. (c) Use a spacer for form a lead maintain space between a sensor and a printed circuit board, rather than closely contacting them with each other. (d) When forming a lead prior to mounting onto a board - Bend the lead at a point 3mm or more apart from the body(Lead root). - Bend one lead wire after securing the other lead wire. (near the main body) - Keep space between the sensor main body and and a fixing jig. - When bending the lead along the jig, be careful not to damage it with an edge of the jig. - Follow other precautions described in respective standard (e) When mounting a sensor onto a heat sink - Use the specified accessory. - Drill threaded holes on the heat kink as per specifications and keep the surface free from burrs and undulations. - Use KEC’s recommended silicon grease. - Tighten the screw within the specified torque. - Never apply a pneumatic screwdriver to a transistor main body. (f) Do not bend or stretch the lead wires repeatedly. When pulling in the axial directions, apply 500g or 600g power, depending on the shapes of lead wires. lead wires nor affect the electrical characteristics of a sensor. The basic precautions for soldering procedures are as follows : (a) Complete soldering procedures in a time as short as possible. (b) Do not apply stress to a sensor after soldering by correcting or modifying its location or direction. (c) For a sensor employing a heat sink, mount it on the heat sink first: then solder this unit to a printed circuit board after confirming that it is fully secured. (d) Do not directly solder the heat-radiating portion of a sensor to a printed circuit board. (e) In flow solder jobs, sensors are apt to float on the solder due to solder surface tension. When adjusting the locations of sensor, be careful not to apply excessive stress to the roots of the sensor lead wires. (f) When using a soldering iron select those which have less leakage, and be sure to ground the soldering iron. 3. Cleaning a circuit board After soldering, circuit boards must be cleaned to remove flux. Observe the following precautions while cleaning them (a) When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as Na or Cl ions remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases which can degrade device performance. (b) Do not rub the indication marks with a brush or one’s fingers when cleaning or while a cleaning agent is applied to the markings. (c) There are ultrasonic wave cleaning methods which offer a high cleaning effect within a short time. Since there methods involve a complicated combination of factors such as the cleaning bath size, ultrasonic wave vibrator output, and printed circuit board mounting method, there is fear that the service life of airtight seal-type sensors may be extremely shortened. Therefore, as far as possible avoid using the ultrasonic wave cleaning method. - Basic requirements of ultrasonic wave cleaning method. Frequency : 27~29kHz Output : 300W or less (300W/ or less) Recommended solvents : Refer to details above Cleaning time : 30seconds or less 2. Soldering When soldering a sensor to a printed circuit board, the soldering temperature is usually so high that it adversely affects the sensor. Normally, tests are conducted at a soldering temperature of 265 for 10 seconds or 300 for 3 seconds. Be sure to complete soldering procedures under these conditions of temperature and time. Be careful to select a type of flux that will neither corrode the Application circuit The Pressure sensor is designed to convert a voltage by means of constant current drive and then, if nesessary, it amplifies the voltage for use. The circuit shown below is a typical example of a circuit in which the pressure sensor is used. Constant Current Circuit Unit Pressure Sensor Amplifier Circuit Unit OP AMP OP AMP OP AMP 2007. 6. 15 Revision No : 2 4/4