KPN020D02

SEMICONDUCTOR TECHNICAL DATA FEATURES Low pressure (0~1 ) Easy to use dual in-line package (DIP) Wide 0~60 compensated temperature range Span calibration to 2% for low pressure Zero offset calibration High performance, stable packaged silicon chip Gage and differential pressure configurations KPF010D04~KPF070D04 Semiconductor Pressure Sensor APPLICATIONS Medical Equipment Respiration HVAC Level Detection Flow Measurement Industrial Control MODEL NUMBER FOR ORDERING KP F 000 G 00 A Package Pin Configuration No Mark : Standard A : Type 1 Silicon Pressure Sensor Package Type 00 : Die 01~ : Package Series ON/OFF Chip N:ON Chip (Amplified) Rated Pressure F:OFF Chip (Not Amplified) 123 12 103=12,000kPa Measuring Pressure A : Absolute Pressure D : Differential Pressure G : Gage Pressure PIP3 MAXIMUM RATING ITEM Model No. Classification Rated Pressure 0.14 Maximum Pressure Load Burst Pressure Bridge Impedance Operating Temperature Storage Temperature 0.290 Tenth of Rated Pressure Fifth of Rated Pressure 3000~6000 -40~125 -55~125 1.015 psi kPa kPa KPF010D04 010 1 SPEC. KPF020D04 020 2 KPF070D04 070 7 UNIT kPa ELECTRICAL CHARACTERISTICS ITEM Classification Test Condition Compensational Temperature Range Full Scale Voltage Offset Voltage Linearity Pressure Hysteresis Repeatability Temperature Coefficient Of Offset (TCO) Temperature Coefficient Of Sensitivity (TCS) 010 Operating Input Current 1.5 SPEC. 020 070 UNIT - constant, Ambient Temperature Ta=25 0 ~ 60 25~75 2 2.5 0.65 0.3 2.0 2.0 mV mV %FS %FS %FS %FS %FS Comment) 1. Operating humidity 25~80%RH (unless otherwise noted) 2. Please, consult us when you use any other pressure media except air. 2007. 5. 15 Revision No : 2 1/3 KPF010D04~KPF070D04 RELIABILITY TEST ITEMS High Temp. Storage Low Temp. Storage Life Test Steady State Operating Low Temp. Operating High Temp. Operating Temperature / Humidity Operating Environment Test Heat Resistance Temp. Cycle Vibration Drop Mechanical Test Lead Fatigue Solderability 120 25 100 40 260 5 , 1000hrs , 1 million times, Rated Pressure , 1 million times, Rated Pressure , 90%RH, 1 million times, Rated Voltage , 10 seconds TEST CONDITIONS -40 , 1000hrs -20 , 1 million times, Rated Pressure -40 ~120 , 30minutes/1Cycle, 100Cycles Amplitude : 1.5mm, Frequency : 10~55Hz, X, Y, Z(3-directions), 2 hrs each direction 75cm height, 2 times Tensile Strength : 9.8N(1kgf), 10seconds Bending Strength : 4.9N(0.5kgf), Right/Left 90 , 1time 230 , 5 seconds PACKAGE CONFIGURATION AND DIMENSIONS (Unit : mm) Not Used for Absolute L = 12.19 8 = 8.38 3.3 OD 2.03ID 2 Tubes Not Used for Gage 8 15.24 2.54 7 6 5 3.87 2.54 2.54 2.54 0.9 dia 15.24 Ceramic Substrate 1.02 8.64 4.45 4.06 0.51 Ref Cover 9.40 13.97 1 0.51 Typ. 8Pins 3.05 9.40 2 3 4 14.73 8.13 5.08 15 Pin Hole PIN CONFIGURATION Pressure Sensor 1 - Out + Gain Set Resistor ln + 6 100K 3.012V 4 5 100K - Temminal No. 1 2 3 4 5 6 Meaning (-) Out (-) In (+) Out (+) In Gainset resistor Gainset resistor 2 ln - + Out 2007. 5. 15 Revision No : 2 + 3 2/3 KPF010D04~KPF070D04 Note 1. Mounting on printed circuit boards When mounting a transistor on a printed circuit, it is assumed that lead wires will be processed or reformed due to space limitation or relations with other components. Even if no such special processing reforming is conducted exercise care on the following points : (a) Make the spaces of lead wire inserting holes on the printed circuit board the same as those of lead wires on a transistor. (b) Even if The spaces are not the same, do not pull the lead wires or push heavily against the sensor element. (c) Use a spacer for form a lead maintain space between a sensor and a printed circuit board, rather than closely contacting them with each other. (d) When forming a lead prior to mounting onto a board - Bend the lead at a point 3mm or more apart from the body(Lead root). - Bend one lead wire after securing the other lead wire. (near the main body) - Keep space between the sensor main body and and a fixing jig. - When bending the lead along the jig, be careful not to damage it with an edge of the jig. - Follow other precautions described in respective standard (e) When mounting a sensor onto a heat sink - Use the specified accessory. - Drill threaded holes on the heat kink as per specifications and keep the surface free from burrs and undulations. - Use KEC’s recommended silicon grease. - Tighten the screw within the specified torque. - Never apply a pneumatic screwdriver to a transistor main body. (f) Do not bend or stretch the lead wires repeatedly. When pulling in the axial directions, apply 500g or 600g power, depending on the shapes of lead wires. the sensor lead wires. (f) When using a soldering iron select those which have less leakage, and be sure to ground the soldering iron. 3. Cleaning a circuit board After soldering, circuit boards must be cleaned to remove flux. Observe the following precautions while cleaning them (a) When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as Na or Cl ions remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases which can degrade device performance. (b) Do not rub the indication marks with a brush or one’s fingers when cleaning or while a cleaning agent is applied to the markings. (c) There are ultrasonic wave cleaning methods which offer a high cleaning effect within a short time. Since there methods involve a complicated combination of factors such as the cleaning bath size, ultrasonic wave vibrator output, and printed circuit board mounting method, there is fear that the service life of airtight seal-type sensors may be extremely shortened. Therefore, as far as possible avoid using the ultrasonic wave cleaning method. - Basic requirements of ultrasonic wave cleaning method. Frequency : 27~29kHz Output : 300W or less (300W/ or less) Recommended solvents : Refer to details above Cleaning time : 30seconds or less 2. Soldering When soldering a sensor to a printed circuit board, the soldering temperature is usually so high that it adversely affects the sensor. Normally, tests are conducted at a soldering temperature of 265 for 10 seconds or 300 for 3 seconds. Be sure to complete soldering procedures under these conditions of temperature and time. Be careful to select a type of flux that will neither corrode the lead wires nor affect the electrical characteristics of a sensor. The basic precautions for soldering procedures are as follows : (a) Complete soldering procedures in a time as short as possible. (b) Do not apply stress to a sensor after soldering by correcting or modifying its location or direction. (c) For a sensor employing a heat sink, mount it on the heat sink first: then solder this unit to a printed circuit board after confirming that it is fully secured. (d) Do not directly solder the heat-radiating portion of a sensor to a printed circuit board. (e) In flow solder jobs, sensors are apt to float on the solder due to solder surface tension. When adjusting the locations of sensor, be careful not to apply excessive stress to the roots of 2007. 5. 15 Revision No : 2 3/3