SEMICONDUCTOR
TECHNICAL DATA
GENERAL DESCRIPTION
This Trench MOSFET has better characteristics, such as fast switching time, low on resistance, low gate charge and excellent avalanche characteristiscs. It is mainly suitable for DC/DC Converter and Battery pack..
D P
KU063N03Q
N-Ch Trench MOSFET
H T G L
FEATURES
・VDSS=30V, ID=16A. ・Drain to Source On Resistance. RDS(ON)=6.3mΩ(Max.) @ VGS=10V RDS(ON)=10.7mΩ(Max.) @ VGS=4.5V
8 A
5 B1 B2
1
4
MOSFET Maximum Ratings (Ta=25℃ Unless otherwise noted)
CHARACTERISTIC Drain to Source Voltage Gate to Source Voltage Drain Current Drain Power Dissipation DC@Ta=25℃ (Note 1) Pulsed @Ta=25℃ (Note 1) SYMBOL RATING VDSS VGSS ID IDP PD Tj Tstg (Note 1) RthJA 30 ±20 16 64 2.5 150 -55~150 50 UNIT V V A A W ℃ ℃ ℃/W
DIM A B1 B2 D G H L P T
MILLIMETERS _ 4.85 + 0.2 _ 3.94 + 0.2 _ 6.02 + 0.3 _ 0.4 + 0.1 0.15+0.1/-0.05 _ 1.63 + 0.2 _ 0.65 + 0.2 1.27 0.20+0.1/-0.05
FLP-8
Maximum Junction Temperature Storage Temperature Range Thermal Resistance, Junction to Ambient
Note1) Surface Mounted on 1″ 1″ × FR4 Board, t≤10sec.
KU063N 03Q
PIN CONNECTION (TOP VIEW)
S S S G
1
8
D D D D
1 2 3
8 7 6 5
2
7
3
6
4
4
5
2010. 6. 17
Revision No : 0
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KU063N03Q
ELECTRICAL CHARACTERISTICS (Ta=25℃) UNLESS OTHERWISE NOTED
CHARACTERISTIC Static Drain to Source Breakdown Voltage Drain Cut-off Current Gate to Source Leakage Current Gate to Source Threshold Voltage Drain to Source On Resistance Forward Transconductance Dynamic Input Capaclitance Ouput Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Gate to Source Charge Gate to Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Source to Drain Diode Ratings Source to Drain Forward Voltage Reverse Recovery Time Reverse Recovered Charge VSD trr Qrr VGS=0V, IS=16A IS=16A, dI/dt=100A/μ s IS=16A, dI/dt=100A/μ s (Note2) 0.8 22.5 9.5 1.2 V ns nC VGS=10V VGS=4.5V Ciss Coss Crss Rg Qg Qgs Qgd td(on) tr td(off) tf VDS=15V, VGS=10V ID=16A, RG=1.6Ω (Note2) VDS=15V, VGS=10V, ID=16A (Note2) f=1MHz VDS=15V, VGS=0V, f=1MHz (Note2) 1751 350 253 2.8 39.7 20.1 6.8 8.2 10.1 10.5 31.2 11.0 nC ns Ω pF BVDSS IDSS IGSS Vth RDS(ON) gfs VGS=0V, ID=250μ A VGS=0V, VDS=30V VGS=±20V, VDS=0V VDS=VGS, ID=250μ A VGS=10V, ID=16A VGS=4.5V, ID=13A VDS=5V, ID=16A (Note2) (Note2) (Note2) 30 1.0 5.3 8.9 52 1 ±100 3.0 6.3 10.7 mΩ S V μ A nA V SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT
Note2) Pulse Test : Pulse Width≤300㎲, Duty Cycle≤2%
2010. 6. 17
Revision No : 0
2/4
KU063N03Q
Drain to Source On Resistance RDS(ON) (Ω)
Fig1. ID - VDS
65
VGS=10V 5.0V 4.5V 4.0V 3.5V
Fig2. RDS(on) - ID
10 8 6 4 2 0
Drain Current ID (A)
52 39
3.0V
VGS=4.5V
VGS=10V
26 13 0 0 0.5 1.0 1.5 2.0 2.5 3.0
0
13
26
39
52
65
Drain to Source Voltage VDS (V)
Drain Current ID (A)
Fig3. ID - VGS
VDS=5V
Fig4. RDS(ON) - Tj
Normalized On Resistance RDS(ON)
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -75 -50 -25 0 25 50 75 100 125 150 175
VGS=4.5V, ID=13A VGS=10V, ID=16A
65
Drain Current ID (A)
52 39
Tj=25 C
26 13 0
Tj=150 C Tj=-55 C
0
1
2
3
4
5
Gate - Source Voltage VGS (V)
Junction Temperature Tj ( C )
Normalized Gate to Source Threshold Voltage
Fig5. Vth - Tj
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -75 -50 -25 0 25 50 75 100 125 150 175 102
Fig6. IS - VSD
Reverse Drain Current IS (A)
VDS = VGS, ID = 250µA
Tj=150 C
101
Tj=25 C
100
Tj=-55 C
10-1 0.2
0.4
0.6
0.8
1.0
1.2
Junction Temperature Tj ( C )
Source to Drain Voltage VSD (V)
2010. 6. 17
Revision No : 0
3/4
KU063N03Q
Fig7. RDS(ON) - VGS
20
ID=16A
Drain to Source On Resistance RDS(ON) (mΩ)
Fig8. C - VDS
104 f=1MHz Ciss 103
Coss
12
Tj=150 C
Capacitance C (pF)
16
8
Tj=25 C
102
Crss
4 0 101 0 2 4 6 8 10 12
0
5
10
15
20
25
30
Gate to Source Voltage VGS (V)
Drain to Source Voltage VDS (V)
Fig9. Qg - VGS
10
Fig10. Safe Operation Area
102
Gate to Source Voltage VGS (V)
VDS = 15V, ID = 16A
Drain Current ID (A)
8
101
( DS ON )
100us
LI M IT
1ms 10ms 100ms
6
100
R
4
2
10-1
VGS= 10V SINGLE PULSE TA= 25 C
DC
0 0 15 30 45 60 75
10-2 10-2
10-1
100
101
102
Gate to Charge Qg (nC)
Drain to Source Voltage VDS (V)
Fig11. Transient Thermal Response Curve
Normalized Effective Transient Thermal Resistance
101
100
0.5 0.2
10-1
0.1 0.05 0.02 0.01 PDM Single Pulse t1 t2 RthJA=60.5 C/W
10-2
10-3 10-4
10-3
10-2
10-1
100
101
102
103
Square Wave Pulse Duration (sec)
2010. 6. 17
Revision No : 0
4/4
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