Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC
(Commercial & Automotive Grade)
Lead-free
Overview
KEMET’s X8G Class I dielectric features a 150°C maximum
operating temperature, offering the latest in high
temperature dielectric technology and reliability for extreme
temperature applications and under the hood applications.
X8G exhibits no change in capacitance with respect to
voltage and boasts a minimal change in capacitance
with reference to ambient temperature. It is a suitable
replacement for higher capacitance and larger footprint
devices that fail to offer capacitance stability. Capacitance
change is limited to ±30ppm/°C from -55°C
to +150°C.
Driven by the demand for a more robust and reliable
component, X8G dielectric capacitors were developed for
critical applications where reliability and capacitance
stability at higher operating temperatures are a concern.
These capacitors are widely used in automotive for under
the hood and harsh environment as well as general high
temperature applications.
In addition to commercial grade, automotive grade devices
are available and meet Automotive Electronics Council’s
AEC-Q200 qualification requirements. Also available with
flexible termination technology which inhibits the transfer
of board stress to the rigid ceramic body, therefore
mitigating flex cracks which can result in low IR or short
circuit failures.
Benefits
Applications
• –55°C to +150°C operating temperature range
• Lead (Pb)-Free, RoHS and REACH compliant
• EIA 0402, 0603, 0805, 1206, 1210 & 1812 case sizes
• DC voltage ratings of 10V, 16V, 25V, 50V & 100V
• Capacitance offerings ranging from 0.5pF to 0.22μF
• Available capacitance tolerances of ±0.10pF, ±0.25pF,
±0.5pF, ±1%, ±2%, ±5%, ±10% & ±20%,
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
• No capacitance change with respect to applied rated DC
voltage
• Non-polar device, minimizing installation concerns
• Commercial and Automotive (AEC-Q200) grades available
• 100% pure matte tin-plated termination finish that
allowing for excellent solderability.
• Flexible Termination option available
• Decoupling
• Bypass
• Filtering
• Under the hood
• Transient voltage suppression
• Safety relevant circuits
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Built Into Tomorrow
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Ordering Information
C
Ceramic
1210
C
184
K
Case Size Specification/ Capacitance Capacitance
(L" x W")
Series1
Code (pF)
Tolerance
0402
0603
0805
1206
1210
1812
C = Standard
X = Flexible
Termination
Two
significant
digits and
number of
zeros
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
3
T
A
C
AUTO
Rated
Voltage
(VDC)
Dielectric
Failure
Rate/Design
Termination Finish2
Packaging/
Grade
(C-Spec)
T = X8G
A = N/A
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
C = 100% Matte Sn
L = SnPb (5% Pb minimum)
See
“Packaging
C-Spec
Ordering
Options
Table”
The flexible termination option is not available on EIA 0402 case size product. “C” must be used in the 6th character position when ordering this
case size.
2
Additional termination finish options may be available. Contact KEMET for details.
2
SnPb termination finish option is not available on automotive grade product.
1
Packaging C-Spec Ordering Options Table
Packaging/Grade
Ordering Code (C-Spec)
Packaging Type
Commercial Grade1
Bulk Bag
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
Not Required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Automotive Grade3
7" Reel
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L” x W”) and thickness dimension. See “Chip Thickness/Tape & Reel
Packaging Quantities” and “Tape & Reel Packaging Information”.
3
For additional Information regarding “AUTO” C-Spec options, see “Automotive C-Spec Information”.
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see “Capacitor Marking”.
1
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days Prior To
Implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days minimum
AUTO
Yes (without approval)
Yes
90 days minimum
1
1
Customer Notification Due To:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
2
3
4
5
KEMET assigned1
●
●
●
●
●
AUTO
1
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
W
B
T
S
Standard Termination
EIA Size Code
Metric Size
Code
0402
1005
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
L
Length
W
Width
T
Thickness
B
Bandwidth
1.00 (0.040)
±0.05 (0.002)
1.60 (0.063)
±0.15 (0.006)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
4.50 (0.177)
±0.30 (0.012)
0.50 (0.020)
±0.05 (0.002)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
See Table 2 for
Thickness
0.30 (0.012)
±0.10 (0.004)
0.35 (0.014)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.35 (0.014)
L
Length
W
Width
T
Thickness
1.60 (0.063)
±0.17 (0.007)
2.00 (0.079)
±0.30 (0.012)
3.30 (0.130)
±0.40 (0.016)
3.30 (0.130)
±0.40 (0.016)
4.50 (0.178)
±0.40 (0.016)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.30 (0.012)
1.60 (0.063)
±0.35(0.013)
2.60(0.102)
±0.30(0.012)
3.20 (0.126)
±0.30 (0.012)
S
Separation
Minimum
Mounting
Technique
0.30 (0.012)
Solder Reflow
Only
0.70 (0.028)
0.75 (0.030)
N/A
Solder Wave or
Solder Reflow
Solder Reflow
Only
Flexible Termination
EIA Size Code
Metric Size
Code
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
S
Separation
Minimum
B
Bandwidth
0.45 (0.018) ± 0.15
(0.006)
0.50 (0.02) ± 0.25
(0.010)
See Table 2 for
0.60 (0.024) ±
Thickness
0.25 (0.010)
0.60 (0.024) ±
0.25 (0.010)
0.70 (0.028) ±
0.35 (0.014)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
0.58 (0.023)
0.75 (0.030)
N/A
Mounting
Technique
Solder Wave
or
Solder Reflow
Solder Reflow
Only
C1109_X8G_150C_SMD • 10/30/2020
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead-free
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 1A – Standard Termination Capacitance Range/Selection Waterfall
(0402 – 1812 Case Sizes)
1
100
5
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
100
1
50
5
50
3
50
4
100
8
16
1
25
5
10
3
50
4
100
8
16
1
25
10
5
C1812C
508 & 758 B C D
BB BB BB BB
CF CF CF CF CF DN DN DN DN DN
758
B C D
BB BB BB BB
CF CF CF CF CF DN DN DN DN DN
109 - 919* B C D
BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
100
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
110
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
120
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
130
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
150
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
160
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
180
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
200
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
220
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
240
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
270
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
300
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
330
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
360
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
390
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
430
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
470
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
510
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
560
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
620
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
680
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
750
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
820
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
910
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
101
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
111
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
121
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
131
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
151
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
161
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
181
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
201
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
221
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
241
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
271
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
301
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
331
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
361
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
391
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
431
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
471
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
511
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
561
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
621
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
681
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
751
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
821
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DN EB EB EB EB EB FB FB FB FB FB
911
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DP EB EB EB EB EB FB FB FB FB FB
102
F G J K M BB BB BB BB BB CF CF CF CF CF DN DN DN DN DP EB EB EB EB EB FB FB FB FB FB
112
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DP EB EB EB EB EB FB FB FB FB FB
122
F G J K M BB BB BB BB
CF CF CF CF CF DN DN DN DN DP EB EB EB EB EB FB FB FB FB FB
5
1
Case Size/Series
C0402C
C0603C
C0805C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
1
8
C1206C
50
5
100
3
16
4
25
8
10
1
50
5
100
3
16
4
25
8
10
1
50
5
100
3
16
4
25
10
8
100
1
50
5
16
3
25
10
4
100
8
25
Voltage Code
50
Rated Voltage (VDC)
16
Cap
Code
10
Capacitance
3
C1210C
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Capacitance Tolerance
0.50 & 0.75 pF
0.75 pF
1.0 - 9.1 pF*
10 pF
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
39 pF
43 pF
47 pF
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
91 pF
100 pF
110 pF
120 pF
130 pF
150 pF
160 pF
180 pF
200 pF
220 pF
240 pF
270 pF
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
4
10
8
50
1
C1206C
100
5
16
3
25
4
100
8
50
1
16
5
C0805C
25
3
10
4
100
8
25
Voltage Code
Rated Voltage (VDC)
C0603C
50
Cap
Code
16
Capacitance
C0402C
10
Case Size/Series
4
3
5
1
C1210C
C1812C
C1109_X8G_150C_SMD • 10/30/2020
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 1A – Standard Termination Capacitance Range/Selection Waterfall
(0402 – 1812 Case Sizes) cont.
3
5
1
8
4
3
5
1
8
4
3
5
1
5
1
100
10
16
25
50
100
10
16
25
50
100
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GK
GH
GG
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GN
5
1
50
GH
100
GB
16
GB
25
GB
16
GB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FE
FG
FH
FJ
25
GB
10
GB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FE
FG
FH
FJ
10
GB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FE
FG
FH
FJ
50
GB
EC
ED
ED
ED
ED
EE
EC
EC
EC
EE
EE
EF
EC
EC
ED
ED
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EE
EE
EH
EH
100
GB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EE
EE
EF
EH
EH
16
GB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
ED
EF
EH
EH
25
3
C0603C
GB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
ED
EF
EH
EH
10
4
GB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
ED
EF
EH
EH
50
8
GB
DP
DP
DP
DP
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DE
DG
100
1
GB
GB
GB
GB
GB
GB
DP
DP
DP
DP
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DF
16
5
GB
GB
GB
GB
GB
GB
DP
DP
DP
DP
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DF
DG
25
5
3
C0402C
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
FB
FB
FB
FB
FC
FC
FC
FC
FC
FF
FF
FF
FF
FG
FG
FG
FG
FG
FC
FC
FE
FF
FB
FB
FB
FB
FB
FB
FE
FE
FF
FG
FH
FM
DP
DP
DP
DP
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DF
DG
10
4
50
8
16
Voltage Code
Case Size/Series
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
25
Rated Voltage (VDC)
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FF
FG
FH
FM
DP
DP
DP
DP
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DF
DG
1
8
4
3
5
1
8
4
3
5
1
8
4
3
5
1
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
10
M BB BB BB BB
M BB BB BB BB
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
100
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
50
Cap
Code
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
16
Capacitance
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
10
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
100
4
100
8
50
1
50
5
50
3
100
4
Capacitance Tolerance
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
100,000 pF
120,000 pF
150,000 pF
180,000 pF
220,000 pF
C1812C
100
8
C1210C
50
1
C1206C
16
5
C0805C
25
3
10
4
100
8
25
Voltage Code
Rated Voltage (VDC)
C0603C
50
Cap
Code
16
Capacitance
C0402C
10
Case Size/Series
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
C0805C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1206C
C1210C
C1812C
C1109_X8G_150C_SMD • 10/30/2020
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 1B – Flexible Termination Capacitance Range/Selection Waterfall
(0603 – 1812 Case Sizes)
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
Rated Voltage (VDC)
Voltage Code
8
4
3
5
1
8
4
3
5
1
8
4
3
5
1
8
4
3
5
1
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
Case Size/Series
M
M
M
M
M
M
M
M
M
M
M
M
M
M
C0603C
100
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
100
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
1
50
16
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
5
50
10
50
50
100
100
16
25
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
50
10
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
100
100
25
50
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
16
1
25
5
10
3
50
4
100
8
16
1
25
5
10
3
100
4
16
10
8
25
100
1
50
Capacitance
Cap
Code
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
5
16
508 & 758
758
109 - 919*
119
129
139
159
169
189
209
229
249
279
309
339
369
399
439
479
519
569
629
689
759
829
919
100
110
120
130
150
160
180
200
220
240
270
300
330
360
3
5
1
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Capacitance Tolerance
0.50 & 0.75 pF
0.75 pF
1.0 - 9.1 pF*
1.1 pF
1.2 pF
1.3 pF
1.5 pF
1.6 pF
1.8 pF
2.0 pF
2.2 pF
2.4 pF
2.7 pF
3.0 pF
3.3 pF
3.6 pF
3.9 pF
4.3 pF
4.7 pF
5.1 pF
5.6 pF
6.2 pF
6.8 pF
7.5 pF
8.2 pF
9.1 pF
10 pF
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
4
25
8
10
1
100
5
25
16
3
50
4
C1812C
25
8
C1210C
50
Voltage Code
Rated Voltage (VDC)
C1206C
16
Cap
Code
C0805C
10
Capacitance
C0603C
10
Case Size/Series
C0805C
C1206C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1210C
C1812C
C1109_X8G_150C_SMD • 10/30/2020
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 1B – Standard Termination Capacitance Range/Selection Waterfall
(0603 – 1812 Case Sizes) cont.
100
16
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DR
DR
DD
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
Rated Voltage (VDC)
100
10
50
50
100
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
50
16
25
50
10
100
100
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
50
50
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
100
1
25
5
16
1
25
5
10
3
50
4
100
8
16
1
25
5
10
3
16
10
4
25
100
8
100
Cap
Code
1
50
Capacitance
5
16
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
3
Voltage Code
8
4
3
5
1
8
4
3
5
1
8
4
3
5
1
8
4
3
5
1
5
1
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Capacitance Tolerance
39 pF
43 pF
47 pF
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
91 pF
100 pF
110 pF
120 pF
130 pF
150 pF
160 pF
180 pF
200 pF
220 pF
240 pF
270 pF
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
4
25
8
10
1
100
5
25
16
3
50
4
C1812C
25
8
C1210C
50
Voltage Code
Rated Voltage (VDC)
C1206C
16
Cap
Code
C0805C
10
Capacitance
C0603C
10
Case Size/Series
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
Case Size/Series
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
C0603C
C0805C
C1206C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1210C
C1812C
C1109_X8G_150C_SMD • 10/30/2020
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 1B – Standard Termination Capacitance Range/Selection Waterfall
(0603 – 1812 Case Sizes) cont.
16
25
50
100
10
16
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GH
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GK
GH
GG
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GN
5
1
DD
DD
DD
DR
DR
DR
DR
DD
DD
DD
DS
DS
DS
DS
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DF
DG
DD
DD
DD
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DF
DG
DD
DD
DD
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DF
DD
DD
DD
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DS
DG
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ER
ER
ER
ER
ER
ES
ES
EQ
EQ
EQ
ER
ER
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ES
EF
EH
EH
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ER
ER
ER
ER
ER
ES
ES
EQ
EQ
EQ
ER
ER
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ES
EF
EH
EH
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ER
ER
ER
ER
ER
ES
ES
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ES
EF
EH
EH
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ER
ER
ER
ER
ER
ES
ES
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ET
EF
EH
EH
ES
ES
ES
ES
ET
ER
ER
ER
ET
ET
EF
ER
ER
ES
ES
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ET
ET
EH
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FA
FN
FN
FN
FN
FQ
FQ
FE
FA
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FE
FZ
FU
FJ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FA
FN
FN
FN
FN
FQ
FQ
FE
FA
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FE
FZ
FU
FJ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FA
FN
FN
FN
FN
FQ
FQ
FE
FA
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FE
FZ
FU
FJ
50
GB
GB
GB
GB
GB
DD
DD
DD
DR
DR
DR
DR
DD
DD
DD
DS
DS
DS
DS
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DF
DG
100
FN
FN
FN
FQ
FQ
FQ
FQ
FQ
FA
FA
FA
FA
FZ
FZ
FZ
FZ
FZ
FQ
FQ
FE
FA
FN
FN
FN
FN
FN
FN
FE
FA
FZ
FU
FM
25
100
10
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FA
FN
FN
FN
FN
FQ
FQ
FE
FA
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FA
FZ
FU
FM
100
100
50
1
50
5
50
1
100
5
16
5
3
25
3
C0603C
4
10
4
8
50
8
1
100
Voltage Code
5
16
Rated Voltage (VDC)
Case Size/Series
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
3
25
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
4
10
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
8
100
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
25
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
1
50
10
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
50
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
5
50
100
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
16
Capacitance
Cap
Code
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
10
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
473
563
683
823
104
124
154
184
224
3
1
8
4
3
5
1
8
4
3
5
1
8
4
3
5
1
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Capacitance Tolerance
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
100,000 pF
120,000 pF
150,000 pF
180,000 pF
220,000 pF
4
16
8
25
1
16
5
C1812C
25
3
C1210C
10
4
C1206C
100
8
25
Voltage Code
Rated Voltage (VDC)
C0805C
50
Cap
Code
16
Capacitance
C0603C
10
Case Size/Series
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
C0805C
C1206C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1210C
C1812C
C1109_X8G_150C_SMD • 10/30/2020
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions
Test
Reference
Test Condition
Limits
Visual and
Mechanical
KEMET
Internal
No defects that may affect performance (10X)
Dimensions according KEMET Spec Sheet
KEMET
Internal
C ≤ 1,000 pF
Frequency: 1 MHz ±100 kHz
Voltage*:1.0 Vrms ±0.2 V
C > 1,000 pF
Frequency: 1 kHz ±50 Hz
Voltage: 1.0 Vrms ±0.2 V
* See part number specification sheet for voltage
Within Tolerance
KEMET
Internal
C ≤ 1,000 pF
Frequency: 1 MHz ±100 kHz
Voltage*:1.0 Vrms ±0.2 V
C > 1,000 pF
Frequency: 1 kHz ±50 Hz
Voltage: 1.0 Vrms ±0.2 V
* See part number specification sheet for voltage”
Within Specification
Dissipation factor (DF) maximum limit at 25°C = 0.1%
Capacitance
(Cap)
Dissipation
Factor (DF)
Within Specification
Insulation
Resistance (IR)
KEMET
Internal
Rated voltage applied for 120 ±5 seconds at 25°C
To obtain IR limit, divide MΩ-µF value by the capacitance and
compare to GΩ limit. Select the lower of the two limits.
1,000 megaohm microfarads or 100 GΩ.
Capacitance change with reference to +25°C and 0
VDC applied.
* See part number specification sheet for voltage
Temperature
Coefficient of
Capacitance
(TCC)
KEMET
Internal
Step
Temperature (°C)
1
+25°C
2
−55°C
3
+25°C (Reference)
4
+150°C
Dielectric
Withstanding
Voltage
(DWV)
KEMET
Internal
250% of rated voltage
(5 ±1 seconds and charge/discharge
not exceeding 50 mA)
Aging Rate
(Maximum %
Capacitance
Loss/Decade
Hour)
KEMET
Internal
Maximum % capacitance loss/decade hour
Within Specifcation
±30 ppm/°C
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Withstand test voltage without insulation
breakdown or damage.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
0% Loss/Decade Hour
C1109_X8G_150C_SMD • 10/30/2020
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions cont.
Test
Reference
Test Condition
Limits
Shear stress test per specific case size, Time: 60±1 seconds
Terminal
Strength
KEMET
Internal
Case Size
Force
0402
3N
0603
5N
0805
9N
≥1206
18N
3.0 mm minimum
Test time: 60± 5 seconds
Ramp time: 1 mm/second
No evidence of mechanical
damage
Board
Flex
AEC-Q200-005
Solderability
J-STD-002
Condition: 4 hours ± 15 minimum at 155°C dry bake
apply all methods
Test 245 ± 5°C (SnPb & Pb-Free)
Visual Inspection.
95% coverage on termination.
No leaching
JESD22
Method JA-104
1,000 cycles (−55°C to +150°C)
2 – 3 cycles per hour
Soak Time 1 or 5 minutes
Measurement at 24 hours ±4
hours after test conclusion.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Temperature
Cycling
Biased
Humidity
MIL-STD-202
Method 103
Load Humidity:
1,000 hours 85°C/85% RH and 200 VDC maximum.
Low Volt Humidity:
1,000 hours 85°C/85% RH and 1.5 V.
No evidence of mechanical
damage
Measurement at 24 hours ±4
hours after test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Moisture
Resistance
MIL-STD-202
Method 106
Number of cycles required 10, 24 hours per cycle.
Steps 7a and 7b not required
Measurement at 24 hours ±4
hours after test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Thermal Shock
MIL-STD-202
Method 107
Number of cycles required 5, (−55°C to 150°C)
Dwell time 15 minutes.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
High
Temperature
Life
Storage Life
1,000 hours at 150°C with 2 X rated voltage applied
MIL-STD-202
Method 108
1,000 hours at 150°C, Unpowered
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF: 0.5%
C1109_X8G_150C_SMD • 10/30/2020
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions cont.
Test
Reference
Test Condition
Limits
Vibration
MIL-STD-202
Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations.
Test from 10 – 2,000 Hz
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Mechanical
Shock
MIL-STD-202
Method 213
1,500 g’s 0.5 ms Half-sine,
Velocity Change 15.4 feet/second
(Condition F)
Resistance to
Solvents
MIL-STD-202
Method 215
Add Aqueous wash chemical OKEMCLEAN
(A 6% concentrated Oakite cleaner) or equivalent.
Do not use banned solvents.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Visual Inspection 10X
Readable marking,
no decoloration or stains.
No physical damage.
Table 2A – Standard Termination Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
CF
DN
DP
DE
DF
DG
EB
EC
ED
EE
EF
EH
FB
FC
FE
FF
FG
FH
FM
FJ
GB
GD
GH
GG
GK
GN
0402
0603
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
0.50 ± 0.05
0.80 ± 0.07*
0.78 ± 0.10*
0.90 ± 0.10*
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.20 ± 0.15
1.60 ± 0.20
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
1.85 ± 0.20
1.00 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.55 ± 0.10
1.60 ± 0.20
1.70 ± 0.20
10,000
4,000
4,000
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
50,000
15,000
15,000
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
4,000
4,000
2,500
2,500
2,500
2,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
0
0
0
0
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 2B – Flexible Termination Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
CJ
DR
DD
DS
DF
DG
EQ
ER
ES
ET
EF
EH
FN
FQ
FE
FA
FZ
FU
FM
FJ
GB
GD
GH
GG
GK
GN
0603
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
0.80 ± 0.15*
0.78 ± 0.20
0.90 ± 0.10
1.00 ± 0.20
1.10 ± 0.10
1.25 ± 0.15
0.78 ± 0.20
0.90 ± 0.20
1.00 ± 0.20
1.10 ± 0.20
1.20 ± 0.15
1.60 ± 0.20
0.78 ± 0.20
0.90 ± 0.20
1.00 ± 0.10
1.10 ± 0.15
1.25 ± 0.20
1.55 ± 0.20
1.70 ± 0.20
1.85 ± 0.20
1.00 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.55 ± 0.10
1.60 ± 0.20
1.70 ± 0.20
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4,000
4,000
2,500
2,500
2,500
4,000
4,000
2,500
2,500
2,500
2,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
0
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 2C – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
N/A 2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
0402
0603
0805
1206
1210
1808
1005
1608
2012
3216
3225
4520
1812
1825
2220
2225
4532
4564
5650
5664
Minimum
Maximum
50,000
1
20,000
The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for Automotive Grade products.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 3 – Standard Termination Chip Capacitor Land Pattern Design
Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
0402
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1005
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1210
1
3225
1.50
1.60
2.90
5.60
3.90
1.40
1.40
2.80
4.70
3.30
1.30
1.20
2.70
4.00
3.00
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
Only for capacitance values ≥ 22 µF.
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
1
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 4 – Flexible Termination Chip Capacitor Land Pattern Design
Recommendations per IPC–7351 (mm)
EIA
Size
Code
Metric
Size
Code
0603
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1608
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0805
2012
0.99
1.44
1.66
4.47
2.71
0.89
1.24
1.56
3.57
2.11
0.79
1.04
1.46
2.42
1.81
1206
3216
1.59
1.62
2.06
5.85
3.06
1.49
1.42
1.96
4.95
2.46
1.39
1.22
1.86
4.25
2.16
1210
3225
1.59
1.62
3.01
5.90
4.01
1.49
1.42
2.91
4.95
3.41
1.39
1.22
2.81
4.25
3.11
1808
4520
2.30
1.75
2.30
7.40
3.30
2.20
1.55
2.20
6.50
2.70
2.10
1.35
2.10
5.80
2.40
1812
4532
2.10
1.80
3.60
7.00
4.60
2.00
1.60
3.50
6.10
4.00
1.90
1.40
3.40
5.40
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
C
V2
X
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/JSTD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Termination Finish
SnPb
TP
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Time 25°C to Peak
6 minutes
8 minutes
Temperature
maximum
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Construction
Standard Termination
Detailed Cross Section
Barrier Layer
(Ni)
Termination Finish
(100% matte Sn)
Dielectric Material
(CaZrO3)
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% matte Sn)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Construction cont.
Flex Termination
Detailed Cross Section
Dielectric Material
(CaZrO3)
End Termination/
Barrier Layer
External Electrode
(Ni)
(Cu)
Termination Finish
Epoxy Layer
(100% Matte
(Ag)
Sn/SnPb–5% Pb min)
Dielectric Material
(CaZrO3)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte
Sn/SnPb–5% Pb min)
Capacitor Marking (Optional)
Laser marking option is not available on:
• C0G, U2J, X8G, X8R and Y5V dielectric devices.
• EIA 0402 case size devices.
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
punched paper carrier.
ET
KEM
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812
and 2220
16
12
12
Array 0612
8
4
4
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifications.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Double the parts on each reel results in fewer reel
changes and increased efficiency.
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
P0
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
ØD1
Cover Tape
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
R Reference S1 Minimum
T
Note 2
Note 3
Maximum
25.0
(0.984)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
(0.024)
30
(1.181)
E1
P0
P2
T1
Maximum
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
B1 Maximum
Note 4
4.35
Single (4 mm)
(0.171)
Single (4 mm)
8.2
and double (8 mm)
(0.323)
12.1
Triple (12 mm)
(0.476)
Pitch
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
4.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
5.5 ±0.05
8.0 ±0.10
(0.217 ±0.002) (0.315 ±0.004)
7.5 ±0.05
12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
23
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
R
C1109_X8G_150C_SMD • 10/30/2020
24
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
12.4 +2.0/−0.0
(0.488 +0.078/−0.0)
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
25
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
26
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1109_X8G_150C_SMD • 10/30/2020
27
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