Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 200°C, C0G Dielectric, 10 – 200 VDC
(Industrial Grade)
Overview
KEMET’s High Temperature surface mount C0G Multilayer
Ceramic Capacitors (MLCCs) are constructed of a robust
and proprietary C0G/NP0 base metal electrode (BME)
dielectric system that offers industry-leading performance
at extreme temperatures up to 200°C. These devices are
specifically designed to withstand the demands of harsh
industrial environments such as down-hole oil exploration
and automotive/avionics engine compartment circuitry.
elevated temperatures up to 200°C. They also exhibit low ESR
at high frequencies and offer greater volumetric efficiency
over competitive high temperature precious metal electrode
(PME) and BME ceramic capacitor devices.
These devices are Lead (Pb)-Free, RoHS and REACH
compliant without the need of any exemptions.
KEMET’s High Temperature C0G capacitors are temperature
compensating and are well suited for resonant circuit
applications or those where Q and stability of capacitance
characteristics are required. They exhibit no change in
capacitance with respect to time and voltage and boast a
negligible change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±30ppm/ºC
from −55°C to +200°C. In addition, these capacitors exhibit
high insulation resistance with low dissipation factor at
Ordering Information
C
Ceramic
1210
Case Size Specification/
(L" x W")
Series
0402
0603
0805
1206
1210
1812
2220
1
2
H
H = High
temperature
(200°C)
124
J
5
G
A
C
TU
Capacitance
Code (pF)
Capacitance
Tolerance1
Voltage
Dielectric
Failure Rate/
Design
Termination Finish2
Packaging/
Grade (C-Spec)
Two significant digits +
number of zeros.
Use 9 for 1.0 – 9.9 pF
Use 8 for 0.5 – 0.99 pF
e.g., 2.2 pF = 229
e.g., 0.5 pF = 508
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
8 = 10 V
4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
G = C0G
A = N/A
C = 100% Matte Sn
L = SnPb (5% Pb minimum)
E = Gold (Au) 1.97 – 11.8 µin
F = Gold (Au) 30 – 70 µin
G = Gold (Au) 100 µin
minimum
See
“Packaging
C-Spec
Ordering
Options
Table”
below
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Additional termination finish options may be available. Contact KEMET for details.
Built Into Tomorrow
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Benefits
• −55°C to +200°C operating temperature range
• Lead (Pb)-free, RoHS and REACH compliant
• EIA 0402, 0603, 0805, 1206, 1210, 1812, and 2220
case sizes
• DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V,
and 200 V
• Capacitance offerings ranging from 0.5 pF up to 470 nF
• Available capacitance tolerances of ±0.10 pF, ±0.25 pF,
±0.5 pF, ±1%, ±2%, ±5%, ±10% or ±20%
• No piezoelectric noise
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
• Preferred capacitance solution at line frequencies and into
the MHz range
• No capacitance change with respect to applied rated DC
voltage
• Negligible capacitance change with respect to temperature
from −55°C to +200°C
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• Gold (Au), Tin/Lead (Sn/Pb) and 100% pure matte Tin (Sn)
termination finishes available
Applications
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling,
bypass, filtering, transient voltage suppression, blocking and energy storage for use in extreme environments such as downhole exploration, aerospace engine compartments and geophysical probes.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Packaging C-Spec Ordering Options Table
Termination Finish Options
Packaging Type/Options
Packaging
Ordering Code (C-Spec)
Standard Packaging – Unmarked3
Bulk Bag
Waffle Tray 2
7" Tape & Reel
C = 100% Matte Sn
L = SnPb (5% Pb min.)
F = Gold (Au) 30 – 70 µin
G = Gold (Au) 100 µin minimum
13" Reel
7” Tape & Reel/2 mm pitch4
7" Tape & Reel – 50 pieces
7" Tape & Reel – 100 pieces
7" Tape & Reel – 250 pieces
7" Tape & Reel – 500 pieces
7" Tape & Reel – 1,000 pieces
Blank1
7292
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
T050
T100
T250
T500
T1K0
Moisture Sensitive Packaging5 – Unmarked3
E = Gold (Au) 1.97 – 11.8 µin
F = Gold (Au) 30 – 70 µin
G = Gold (Au) 100 µin minimum
Waffle Tray 2
7" Tape & Reel
7" Tape & Reel – 50 pieces
7" Tape & Reel – 100 pieces
7" Tape & Reel – 250 pieces
7" Tape & Reel – 500 pieces
7" Tape & Reel – 1,000 pieces
7282
7130
Contact KEMET6
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
“Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric).
2
“Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric).
3
The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices.
3
Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 through 2225 case
size devices with chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options
may be available. Contact KEMET for details.
4
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
5
Moisture sensitive packaging is required for Gold (Au) termination option “E” (1.97 – 11.8 µin)
6
Additional reeling or packaging options may be available. Contact KEMET for details.
1
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Dimensions – Millimeters (Inches)
L
W
B
T
S
EIA Size
Code
Metric Size
Code
0402
1005
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
2220
5650
L
Length
W
Width
1.00 (0.040)
±0.05 (0.002)
1.60 (0.063)
±0.15 (0.006)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
4.50 (0.177)
±0.30 (0.012)
5.70 (0.224)
±0.40 (0.016)
0.50 (0.020)
±0.05 (0.002)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
5.00 (0.197)
±0.40 (0.016)
T
Thickness
B
Bandwidth
See Table 2 for
Thickness
0.30 (0.012)
±0.10 (0.004)
0.35 (0.014)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
S
Separation
Minimum
Mounting
Technique
0.30 (0.012)
Solder Reflow
Only
0.70 (0.028)
0.75 (0.030)
N/A
Solder Wave or
Solder Reflow
Solder Reflow
Only
Qualification/Certification
High temperature (200ºC) Industrial grade products meet or exceed the requirements outlined in Table 4, Performance &
Reliability. Qualification packages are available for review and download on our website at www.kemet.com/hightemp
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
1
2
3
Dissipation Factor (DF) Maximum Limit at 25ºC
Insulation Resistance (IR) Minimum Limit at 25°C
−55°C to +200°C
±30 ppm/ºC (up to 200ºC)
0%
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50 mA)
0.1%
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120±5 seconds at 25°C)
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
3
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to “ON.”
1
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
C0G
All
All
0.5
0.3% or ±0.25 pF
Insulation
Resistance
10% of Initial
Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Electrical Characteristics
Delta Cap vs. Temperature (Typical)
C1210H104J1GAC - Life Test IR Distribution (Lognormal)
20
99
15
10
80
70
60
50
40
30
20
Percent %
5
Delta Cap (%)
0 hrs
2000 hrs
95
90
0
−5
10
−10
−15
0 Vr
5
100% Vr
1
−20
0.1
1.0
10.0
100.0
200
180
160
140
120
100
80
60
40
20
0
−20
−40
−60
25°C IR (GOhms)
Temperature (ºC)
Capacitance vs. Temperature with 25 V DC Bias
(Rated Voltage)
DF vs. Temperature without DC Bias.
1.00
200
200ºC C0G 100nF no DC
0.50
DF (%)
150
Capacitance (nF)
200ºC C0G MLCC 100nF
200ºC C0G 100nF 25V DC
100
0.00
50
−0.50
0
−1.00
BME vs. PME/IR vs. Temperature with 25 V DC Bias
(Rated Voltage)
1.E+08
1.E+08
1.E+07
1.E+07
1.E+06
1.E+06
IR (MOhms)
1.E+05
IR (MOhms)
200
180
160
140
120
100
80
60
40
IR vs. Temperature with 25 V DC Bias (Rated Voltage)
1.E+04
1.E+03
1.E+02
1.E+01
20
0
−20
−40
−60
200
180
160
140
120
100
80
60
40
20
0
−20
−40
−60
Temperature (°C)
Temperature (°C)
1.E+05
1.E+04
1.E+03
PME C0G MLCC 1206/10nF
1.E+02
200ºC C0G MLCC 100nF
BME C0G MLCC 1206/10nF
1.E+01
1.E+00
200
180
160
140
120
80
100
60
40
0
20
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
−20
−40
−60
200
180
160
140
120
80
100
60
40
0
20
−20
−40
−60
Temperature (°C)
Temperature (°C)
C1001_C0G_200C_SMD • 8/22/2022
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)
5
1
2
25
100
200
10
Case Size / Series
16
25
50
100
200
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EC
EC
ED
EB
EB
EB
EB
EB
EB
EC
EC
ED
EF
EH
EH
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EC
EC
ED
EB
EB
EB
EB
EB
EB
EE
EE
EF
EH
EH
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
ED
ED
ED
ED
EE
EC
EC
EC
EE
EE
EF
EC
EC
ED
ED
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EE
EE
EH
EH
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EE
EB
EB
EC
EC
ED
ED
ED
EE
EC
EC
2
8
4
3
5
1
2
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DP
DP
DP
DE
DE
DE
DE
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DF
DG
DG
DG
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DP
DP
DP
DE
DE
DE
DE
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DF
DG
DG
DG
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DP
DP
DP
DE
DE
DE
DE
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DF
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DE
DG
DN
DN
DN
DN
DN
DP
DN
DN
DN
DN
DN
DN
DP
DP
16
25
50
100
3
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EC
EC
ED
EB
EB
EB
EB
EB
EB
EC
EC
ED
EF
EH
EH
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DP
DP
DP
DE
DE
DE
DE
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DF
DG
DG
DG
10
4
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EC
EC
ED
EB
EB
EB
EB
EB
EB
EC
EC
ED
EF
EH
EH
CF
CF
CF
CF
200
8
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
100
Voltage Code
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
25
Rated Voltage (VDC)
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
50
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
16
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
10
D
D
50
C
C
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
100
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
25
Cap Code
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
16
Capacitance
B
B
200
3
200
4
50
8
100
2
50
1
100
5
25
3
25
4
16
8
10
2
16
1
10
5
200
3
50
25
4
10
508 & 758
109 - 919*
100 - 910*
101 - 181*
201 - 431*
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
393
473
563
683
823
104
C1206H
8
Capacitance Tolerance
0.5 & 0.75 pF
1.0 - 9.0 pF*
10 - 91 pF*
100 - 180 pF*
200 - 430 pF*
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
C0805H
1
16
Rated Voltage (VDC)
C0603H
5
10
3
50
4
100
8
16
Capacitance
C0402H
Voltage Code
10
Case Size / Series
Cap
Code
5
1
8
4
3
5
1
2
8
4
3
5
1
C0402H
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
C0603H
C0805H
C1206H
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
4
3
5
Rated Voltage (VDC)
50
100
200
10
16
25
50
100
200
10
16
Rated Voltage (VDC)
Voltage Code
8
4
Case Size / Series
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FG
FG
FB
FB
FB
FB
FB
FB
FB
FB
FC
FE
FG
FH
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FG
FG
FB
FB
FB
FB
FB
FB
FB
FC
FF
FG
FH
FM
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FC
FC
FF
FF
FF
FF
FG
FG
FG
FG
FG
FC
FC
FE
FF
FB
FB
FB
FB
FB
FB
FE
FE
FF
FG
FH
FM
JJ
JJ
JJ
JJ
2
8
4
3
5
1
2
FB
FB
FB
FB
FB
FB
FC
FE
FE
FE
FE
FG
FC
FC
FF
FF
FF
FF
FF
FG
FG
FG
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GK
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GK
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GK
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GK
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GN
100
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FG
FG
FB
FB
FB
FB
FB
FB
FB
FB
FC
FE
FG
FH
50
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FG
FG
FB
FB
FB
FB
FB
FB
FB
FB
FC
FE
FG
FH
25
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
3
5
1
16
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
10
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
200
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
50
D
D
25
C
C
16
Cap Code
B
B
2
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
10
Capacitance
508 & 758
109 - 919*
100 - 910*
101 - 911*
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
474
1
200
8
200
2
100
1
100
5
50
3
50
4
25
8
25
2
16
1
10
5
200
3
Capacitance Tolerance
0.5 & 0.75 pF
1.0 - 9.1 pF*
10 - 91 pF*
100 - 910 pF*
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.47 µF
C2220H
4
25
Cap
Code
C1812H
8
16
Capacitance
C1210H
Voltage Code
10
Case Size / Series
3
5
1
2
8
4
C1210H
C1812H
C2220H
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
CF
DN
DP
DE
DF
DG
EB
EC
ED
EE
EF
EH
FB
FC
FE
FF
FG
FH
FM
GB
GD
GH
GK
GN
JJ
0402
0603
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
2220
0.50±0.05
0.80±0.07
0.78±0.10
0.90±0.10
1.00±0.10
1.10±0.10
1.25±0.15
0.78±0.10
0.90±0.10
1.00±0.10
1.10±0.10
1.20±0.15
1.60±0.20
0.78±0.10
0.90±0.10
1.00±0.10
1.10±0.10
1.25±0.15
1.55±0.15
1.70±0.20
1.00±0.10
1.25±0.15
1.40±0.15
1.60±0.20
1.70±0.20
2.20±0.15
10,000
4,000
4,000
4,000
0
0
0
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
50,000
15,000
15,000
15,000
0
0
0
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
4,000
4,000
2,500
2,500
2,500
2,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
1,000
1,000
1,000
1,000
1,000
500
0
0
0
0
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
2,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1
If ordering using the 2mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2mm pitch option see “Tape & Reel Packaging Information”.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
Secure Packaging
2” x 2” Waffle Pack/
Tray3
N/A 2
7282/7292
Case Size
EIA (in)
Chip Thickness Packaging Quantities (pieces/unit packaging)
(mm)
Metric (mm)
Minimum
Maximum
Minimum
Maximum
0402
0603
0805
1206
1206
1005
1608
2012
3216
3216
1210
1808
1812
1825
2220
2225
3225
4520
4532
4564
5650
5664
368
368
100
126
50
All
50,000
≤ 1.25 (nominal)
> 1.25 (nominal)
1
All
1
20,000
80
50
42
20
20
20
The "Packaging C-Spec" is a 4-digit code which identifies the packaging type. When ordering, the proper code must be included in the 15th through
18th character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a
packaging C-Spec will default to our standard "Bulk Bag" packaging.
2
A packaging C-Spec (see note 1 above) is not required For "Bulk Bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character
positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging.
3
Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection.
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
0402
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1005
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1210
1
3225
1.50
1.60
2.90
5.60
3.90
1.40
1.40
2.80
4.70
3.30
1.30
1.20
2.70
4.00
3.00
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
2220
5650
2.75
1.70
5.50
8.20
6.50
2.65
1.50
5.40
7.30
5.90
2.55
1.30
5.30
6.60
5.60
Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
1
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
Termination Finish
SnPb
TP
100% Matte Sn
Ramp-Up Rate (TL to TP)
100°C
150°C
60 – 120 seconds
3°C/second
maximum
150°C
200°C
60 – 120 seconds
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Product Qualification Test Plan
Reliability/Environmental Tests per MIL–STD–202//JESD22
High Temperature Life
Load Humidity
Low Voltage Humidity
Temperature Cycling
Thermal Shock
Moisture Resistance
200°C rated voltage 1,000 hours
85°C/85%RH rated voltage 1,000 hours
85°C/85%RH, 1.5 V, 1,000 hours
−55°C to +200°C, 50 Cycles
−55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 cycles
Cycled Temp/RH 0 V, 10 cycles at 24 hours each
Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429
Resistance to Solvents
Mechanical Shock and Vibration
Resistance to Soldering Heat
Terminal Strength
Board Flex
Include Aqueous wash chemical, OKEM Clean or equivalent
Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes 12 cycles
Condition B, no per-heat of samples, Single Wave Solder
Force of 1.8 kg for 60 seconds
Appendix 2, Note: 3.0 mm (minimum)
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid
condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability chip stock should be used promptly, preferably within the time frame outlined in the table below:
Termination Finish
Termination Finish Ordering Code1
Storage Life
100% Matte Tin (Sn)
C
1.5 years upon receipt
L
1.5 years upon receipt
E
6 months upon receipt2
Gold (Au) 30 – 70 µin
F
1.5 years upon receipt
Gold (Au) 100 µin min.
G
1.5 years upon receipt
SnPb (5% Pb min.)
Gold (Au) 1.97 – 11.8 µin
2
The fourteenth (14th) character position of the KEMET part number is assigned to identify and/or define the termination finish.
For more information, see “Ordering Information” section of this document.
2
Gold plating option “E” devices should remain in its factory sealed moisture sensitive packaging during storage. If the factory sealed packaging is
disturbed please store any remaining packaged components in a dry box container to prevent oxidation of the termination finish.
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Construction
Detailed Cross Section
Termination Finish:
C = 100% Matte Sn
L = SnPb - 5% Pb min
E = Gold (Au) 1.97 - 11.8 µin
F = Gold (Au) 30 - 70 µin
G = Gold (Au) 100 µin min
Barrier Layer
(Ni)
Dielectric Material
(CaZrO3)
Dielectric
Material (CaZrO3)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(See options at left)
Inner Electrodes
(Ni)
Capacitor Marking (Optional):
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
punched paper carrier.
ET
KEM
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
P0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
ØD1
Cover Tape
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
1.0
(0.039)
8 mm
12 mm
D1 Minimum
Note 1
1.5+0.10 −0.0
(0.059+0.004 −0.0)
16 mm
R Reference S1 Minimum
T
Note 2
Note 3
Maximum
T1
Maximum
25.0
(0.984)
1.75±0.10
4.0±0.10
2.0±0.05
(0.069±0.004) (0.157±0.004) (0.079±0.002)
1.5
(0.059)
30
(1.181)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
T2
W
Maximum Maximum
3.5±0.05
4.0±0.10
2.5
8.3
(0.138±0.002) (0.157±0.004) (0.098)
(0.327)
5.5±0.05
8.0±0.10
4.6
12.3
(0.217±0.002) (0.315±0.004) (0.181)
(0.484)
7.5±0.05
12.0±0.10
4.6
16.3
(0.138±0.002) (0.157±0.004) (0.181)
(0.642)
F
P1
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(See Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
Maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
R
C1001_C0G_200C_SMD • 8/22/2022
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Waffle Tray Packaging Information – 2" x 2" w/ Static Protection
Figure 9 – Waffle Tray Dimensions – Inches (Millimeters)
M
0.10 (2.54) X 45°
M3
M1
Y
M2
X
X
A
Z
0.156 +0.002/-0.003
(3.962 +0.051/-0.076)
0.098
(2.489)
0.086
(2.184)
2.000 ±0.004 SQ
(50.800 ±0.102 SQ)
90°
0.004
(0.102)
1.800 ±0.004 SQ
(45.720 ±0.102 SQ)
1.812 ±0.004 SQ
(46.025 ±0.102 SQ)
STANDARD RIB MATRIX
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Table 9A – Waffle Tray Dimensions – Inches
Case Size
EIA (in)
0402
0504
0603
0805
1005
12061,2
12061,3
1210
1808
1812
1825
2220
2225
Metric (mm)
1005
1210
1608
2012
2512
3216
3216
3225
4520
4532
4564
5650
5664
2" x 2" Waffle Tray Dimensions – Inches
M
±0.003
0.175
0.235
0.175
0.232
0.230
0.194
0.250
0.217
0.271
0.271
0.318
0.318
0.318
M1
±0.003
0.153
0.226
0.153
0.186
0.240
0.228
0.250
0.244
0.285
0.285
0.362
0.362
0.362
M2
±0.002
0.077
0.172
0.077
0.181
0.190
0.193
0.375
0.215
0.286
0.286
0.424
0.424
0.424
M3
±0.002
0.110
0.170
0.110
0.171
0.140
0.124
0.167
0.174
0.243
0.243
0.34
0.34
0.34
X
±0.002
0.073
0.080
0.073
0.062
0.060
0.067
0.100
0.110
0.150
0.150
0.24
0.24
0.24
Y
±0.002
0.042
0.090
0.042
0.092
0.110
0.130
0.200
0.145
0.200
0.200
0.32
0.32
0.32
Z
±0.003
0.041
0.055
0.041
0.036
0.075
0.065
0.070
0.080
0.075
0.075
0.032
0.032
0.032
A°
± 1/2°
7
5
7
10
5
5
5
5
5
5
5
5
5
MATRIX
(X x Y)
16 X 23
10 X 10
16 X 23
10 X 10
12 X 9
14 X 9
10 X 5
10 X 8
7X6
7X6
5X4
5X4
5X4
Packaging Quantity
(pcs/unit
packaging)
368
100
368
100
108
126
50
80
42
42
20
20
20
Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection
Waterfall" and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor.
2
Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches).
3
Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches).
1
Table 9B – Waffle Tray Dimensions – Millimeters
Case Size
EIA (in)
0402
0504
0603
0805
1005
12061,2
12061,3
1210
1808
1812
1825
2220
2225
Metric (mm)
1005
1210
1608
2012
2512
3216
3216
3225
4520
4532
4564
5650
5664
2" x 2" Waffle Tray Dimensions – Millimeters
M
±0.08
4.45
5.97
4.45
5.89
5.84
4.93
6.35
5.51
6.88
6.88
8.08
8.08
8.08
M1
±0.08
3.89
5.74
3.89
4.72
6.10
5.79
6.35
6.20
7.24
7.24
9.19
9.19
9.19
M2
±0.05
1.96
4.37
1.96
4.60
4.83
4.90
9.53
5.46
7.26
7.26
10.77
10.77
10.77
M3
±0.05
2.79
4.32
2.79
4.34
3.56
3.15
4.24
4.42
6.17
6.17
8.64
8.64
8.64
X
±0.05
1.85
2.03
1.85
1.57
1.52
1.70
2.54
2.79
3.81
3.81
6.10
6.10
6.10
Y
±0.05
1.07
2.29
1.07
2.34
2.79
3.30
5.08
3.68
5.08
5.08
8.13
8.13
8.13
Z
±0.08
1.04
1.40
1.04
0.91
1.91
1.65
1.78
2.03
1.91
1.91
0.81
0.81
0.81
A°
± 1/2°
7
5
7
10
5
5
5
5
5
5
5
5
5
MATRIX
(X x Y)
16 X 23
10 X 10
16 X 23
10 X 10
12 X 9
14 X 9
10 X 5
10 X 8
7X6
7X6
5X4
5X4
5X4
Packaging Quantity
(pcs/unit
packaging)
368
100
368
100
108
126
50
80
42
42
20
20
20
Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection
Waterfall" and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor.
2
Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches).
3
Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches).
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 8/22/2022
23
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