Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC
(Industrial Grade)
Overview
KEMET’s High Temperature X7R Dielectric capacitors
are formulated and designed for extreme temperature
applications. Constructed of a robust and proprietary base
metal electrode (BME) dielectric system, these devices are
capable of reliable operation in temperatures up to 175°C.
Providing an attractive combination of performance and
robustness in general high temperature applications, High
Temperature X7R dielectric capacitors are well suited for
high temperature bypass and decoupling applications or
frequency discriminating circuits where Q and stability of
capacitance characteristics are not critical. They exhibit
a predictable change in capacitance with respect to time,
voltage and temperature up to 175°C.
Concerned with flex cracks resulting from excessive stresses
produced during board flexure and thermal cycling? These
devices are available with KEMET's Flexible termination
technology which inhibits the transfer of board stress to
the rigid ceramic body, therefore mitigating flex cracks
which can result in low IR or short circuit failures. Although
flexible termination technology does not eliminate the
potential for mechanical damage that may propagate during
extreme environmental and handling conditions, it does
provide superior flex performance over standard termination
systems.
KEMET’s High Temperature X7R surface mount MLCCs are
manufactured in state of the art ISO/TS 16949:2009 certified
facilities and are proven to function reliably in harsh, high
temperature and high humidity, down-hole environments.
Applications
• Decoupling
• Bypass
• Filtering
• Transient voltage suppression
Ordering Information
C
Ceramic
1210
Case
Specification/
Size1
Series1
(L" x W")
0402
0603
0805
1206
1210
1812
1
R
G = 175°C
with standard
termination
R = 175°C
w/ Flexible
termination
225
K
3
R
A
C
T050
Capacitance
Code (pF)
Capacitance
Tolerance
Rated
Voltage
(VDC)
Dielectric
Failure
Rate/
Design
Termination Finish
Packaging/
Grade (C-Spec)2
First two digits
represent
significant
figures. Third
digit specifies
number of
zeros.
J = ±5%
K = ±10%
M = ±20%
R = X7R
A = N/A
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
C = 100% Matte Sn
L = SnPb
(5% Pb minimum)
See
"Packaging
C-Spec
Ordering
Options Table"
below
Flexible termination option is only available in 0603 (1608 metric) and larger case sizes.
Built Into Tomorrow
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Packaging C-Spec Ordering Options Table
Packaging Type/
Unmarked2
Packaging
Ordering Code (C-Spec)
Bulk Bag
Blank 1
Waffle Tray
7292
7" Tape & Reel
TU
7" Tape & Reel / 2mm pitch3
7081
7" Tape & Reel - 50 pcs
T050
7" Tape & Reel - 100 pcs
T100
7" Tape & Reel - 250 pcs
T250
7" Tape & Reel - 500 pcs
T500
7" Tape & Reel - 1,000 pcs
T1K0
Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
The terms "Marked" and "Unmarked" pertain to laser marking option of components. All packaging options labeled as "Unmarked" will contain
capacitors that have not been laser marked. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking".
Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the "T1K0" packaging option, 1812 thru 2225 case size
devices with chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7" reels or a single 13" reel. Additional reeling or packaging options may
be available. Contact KEMET for details.
3
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
1
2
Benefits
• Operating temperature range of −55°C to +175°C
• Voltage derating not required
• Lead (Pb)-free, RoHS and REACH compliant
• Base metal electrode (BME) dielectric system
• EIA 0402, 0603, 0805, 1206, 1210, and 1812 case sizes
• DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V
• Capacitance offerings ranging from 2.7 nF to 3.3 µF
• Available capacitance tolerances of ±5%, ±10% & ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb termination finish option available (5% Pb minimum)
• Flexible termination option available upon request
Application Notes
X7R dielectric is not recommended for AC line filtering or pulse applications.
Voltage derating of these capacitors is not required for application temperatures up to 175°C.
.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Dimensions – Millimeters (Inches) – Standard Termination
L
W
B
T
S
EIA Size
Code
Metric Size
Code
0402
1005
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
L
Length
W
Width
1.00 (0.040)
±0.05 (0.002)
1.60 (0.063)
±0.15 (0.006)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
4.50 (0.177)
±0.30 (0.012)
0.50 (0.020)
±0.05 (0.002)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
T
Thickness
B
Bandwidth
See Table 2
for Thickness
0.30 (0.012)
±0.10 (0.004)
0.35 (0.014)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.35 (0.014)
S
Separation
Minimum
Mounting
Technique
0.30 (0.012)
Solder Reflow
Only
0.70 (0.028)
0.75 (0.030)
N/A
Solder Wave
or
Solder Reflow
Solder Reflow
Only
Solder Reflow
Only
Dimensions – Millimeters (Inches) – Flexible Termination
EIA Size
Code
Metric Size
Code
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
L Length
W Width
1.60 (0.063)
±0.17 (0.007)
2.00 (0.079)
±0.30 (0.012)
3.30 (0.130)
±0.40 (0.016)
3.30 (0.130)
±0.40 (0.016)
4.50 (0.178)
±0.40 (0.016)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.30 (0.012)
1.60 (0.063)
±0.35 (0.013)
2.60 (0.102)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
T
Thickness
B Bandwidth
See Table 2
for Thickness
0.45 (0.018)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.70 (0.028)
±0.35 (0.014)
S
Separation
Minimum
0.58 (0.023)
0.75 (0.030)
N/A
Mounting
Technique
Solder Wave
or
Solder Reflow
Solder Reflow
Only
Solder Reflow
Only
Qualification/Certification
High temperature Industrial grade products meet or exceed the requirements outlined Table 4, Performance & Reliability.
Qualification packages are available upon request.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit at 25ºC
Insulation Resistance (IR) Limit at 25°C
−55°C to +175°C
±15% (−55°C to +125°C) beyond 125°C see "Capacitance vs.
Temperature Performance" plot – Reference Only
25
2.5%
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
X7R
Rated DC
Voltage
16/25
>25
Capacitance
Value
All
Dissipation Factor
(Maximum %)
5.0
3.0
Capacitance
Shift
Insulation
Resistance
± 20%
10% of Initial
Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Electrical Characteristics
Capacitance vs. Temperature Performance (−55°C to +175°C)
10.00
CAPACITANCE CHANGE %
0.00
−10.00
−20.00
−30.00
0603 (1608), 0.1µF, 25V
−40.00
0805 (2012), 0.27µF, 25V
−50.00
−60.00
−70.00
−80.00
−55
1206 (3216), 1.0µF, 25V
1210 (3225), 2.2µF, 25V
1812 (4532), 3.3µF, 25V
1812 (4532), 1.0µF, 50V
−40
−25
−10
5
20
35
50
65
80
95
110
125
140
155
170
TEMPERATURE (°C)
Capacitance vs. Bias Voltage Performance (25 VDC Rated )
10.0
CAPACITANCE CHANGE %
0.0
-10.0
-20.0
-30.0
-40.0
0603 (1608), 0.1µF, 25V
-50.0
0805 (2012), 0.27µF, 25V
-60.0
1210 (3225), 2.2µF, 25V
-70.0
1812 (4532), 3.3µF, 25V
-80.0
0
5
10
15
20
25
BIAS DC VOLTAGE
Capacitance vs. Bias Voltage Performance (1812 Case Size, 1.0 µF, 50 VDC Rated)
10.0
CAPACITANCE CHANGE %
5.0
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
1812 (4532), 1.0µF, 50V
-30.0
-35.0
-40.0
0
5
10
15
20
25
BIAS DC VOLTAGE
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 1 – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes)
Case Size/
Series
Capacitance Cap Code
C0402G
C0603G/R C0805G/R C1206G/R
Voltage Code
4
3
5
1
3
5
Rated Voltage
(VDC)
16
25
50
100
25
50
Capacitance
Tolerance
2700 pF
3300 pF
3900 pF
4700 pF
5600 pF
6800 pF
8200 pF
10000 pF
12000 pF
15000 pF
18000 pF
22000 pF
27000 pF
33000 pF
39000 pF
47000 pF
56000 pF
68000 pF
82000 pF
0.1 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1 µF
1.2 µF
1.5 µF
1.8 µF
2.2 µF
2.7 µF
3.3 µF
Capacitance
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
Cap Code
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
Rated Voltage
(VDC)
Voltage Code
Case Size/
Series
C1210G/R
C1812G/R
1
3
5
1
3
5
1
3
5
1
3
5
1
2
100
25
50
100
25
50
100
25
50
100
25
50
100
200
GN
GN
GN
GN
GM
GM
GM
GM
GB
GB
GB
GB
GB
GB
GC
GE
GH
GJ
GL
GE
GG
GJ
GL
GB
GB
GB
GB
GB
GB
GC
GE
GH
GJ
GL
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
BB
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
DN
DN
DN
DN
DN
DP
DP
DF
DG
DG
DP
DP
DG
DG
DG
DN
DN
DN
DN
DN
DP
DP
DF
DG
DG
ED
ED
ED
ED
EP
EP
EJ
EJ
EJ
EP
EJ
EJ
EJ
ED
ED
ED
ED
EP
EP
EJ
EJ
EJ
FE
FE
FF
FF
FG
FG
FH
FM
FK
FK
FH
FM
FK
FK
FE
FE
FF
FF
FG
FG
FH
FM
FK
FK
16
25
50
100
25
50
100
25
50
100
25
50
100
25
50
100
25
50
100
200
4
3
5
1
3
5
1
3
5
1
3
5
1
3
5
1
3
5
1
2
C0402G
C0603G/R
C0805G/R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1206G/R
C1210G/R
C1812G/R
C1075_X7R_HT_SMD • 8/9/2021
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
CF
DN
DP
DF
DG
ED
EP
EJ
FE
FF
FG
FH
FM
FK
GB
GC
GE
GH
GG
GJ
GN
GL
GM
0402
0603
0805
0805
0805
0805
1206
1206
1206
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
1812
0.50 ± 0.05
0.80 ± 0.07*
0.78 ± 0.10*
0.90 ± 0.10*
1.10 ± 0.10
1.25 ± 0.15
1.00 ± 0.10
1.20 ± 0.20
1.70 ± 0.20
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
2.10 ± 0.20
1.00 ± 0.10
1.10 ± 0.10
1.30 ± 0.10
1.40 ± 0.15
1.55 ± 0.10
1.70 ± 0.15
1.70 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
10,000
4,000
4,000
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
50,000
15,000
15,000
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
2,500
2,000
2,500
2,500
2,500
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
500
0
0
0
0
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
EIA
Size
Code
Metric
Size
Code
0402
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1005
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
EIA
Size
Code
Metric
Size
Code
0603
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1608
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0805
2012
0.99
1.44
1.66
4.47
2.71
0.89
1.24
1.56
3.57
2.11
0.79
1.04
1.46
2.42
1.81
1206
3216
1.59
1.62
2.06
5.85
3.06
1.49
1.42
1.96
4.95
2.46
1.39
1.22
1.86
4.25
2.16
1210
3225
1.59
1.62
3.01
5.90
4.01
1.49
1.42
2.91
4.95
3.41
1.39
1.22
2.81
4.25
3.11
1812
4532
2.10
1.80
3.60
7.00
4.60
2.00
1.60
3.50
6.10
4.00
1.90
1.40
3.40
5.40
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
C
V2
X
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/JSTD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Termination Finish
SnPb
TP
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Time 25°C to Peak
6 minutes
8 minutes
Temperature
maximum
maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Appendix 1, Note:
Package Size
(L" x W")
Terminal Strength
Board Flex
JIS–C–6429
JIS–C–6429
Force
Duration
0402
5 N (0.51 kg)
60 seconds
0603
10 N (1.02 kg)
≥ 0805
18 N (1.83 kg)
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
Temperature Cycling
KEMET defined
Biased Humidity
MIL–STD–202 Method
103
Moisture Resistance
High Temperature Life
MIL–STD–202 Method
106
MIL–STD–202 Method
108
/EIA–198
Storage Life
KEMET defined
Vibration
MIL–STD–202 Method
204
Mechanical Shock
Resistance to Solvents
MIL–STD–202 Method
213
MIL–STD–202 Method
215
50 cycles (−55°C to +220°C). Measurement at 24 hours +/- 4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/−2 hours after test conclusion.
1,000 hours at 175°C with 2 X rated voltage applied.
200°C, 0 VDC for 1,000 hours.
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Figure 1 of Method 213, Condition F.
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Construction – Standard Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Dielectric
Barrier Layer
Material (BaTiO3)
(Ni)
End Termination/
Termination Finish
External Electrode
(100% Matte Sn)
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode (Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Construction – Flexible Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Dielectric
Material (BaTiO3)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
End Termination/
(Ni)
External Electrode (Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
Termination
Finish
(100% Matte Sn)
C1075_X7R_HT_SMD • 8/9/2021
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Capacitor Marking (Optional)
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be
marked as an extra cost option. Marking is available
on most KEMET devices, but must be requested using
the correct ordering code identifier(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited
to the “K” character only.
Marking appears in legible contrast. Illustrated below
is an example of an MLCC with laser marking of “KA8”,
which designates a KEMET device with rated capacitance
of 100 µF. Orientation of marking is vendor optional.
KEMET
ID
2-Digit
Capacitance
Code
Laser marking option is not available on:
• C0G, ultra stable X8R and Y5V dielectric devices.
• EIA 0402 case size devices.
• EIA 0603 case size devices with flexible termination
option.
• KPS commercial and automotive grade stacked
devices.
• X7R dielectric products in capacitance values outlined
below.
EIA Case Size
Metric Size Code
Capacitance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
≤ 170 pF
≤ 150 pF
≤ 910 pF
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Capacitor Marking (Optional) cont.
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
Character
9
A
0.10
1.0
10
100
1,000
10,000
B
0.11
1.1
11
110
1,100
11,000
C
0.12
1.2
12
120
1,200
12,000
D
0.13
1.3
13
130
1,300
E
0.15
1.5
15
150
1,500
0
1
2
3
4
5
6
7
8
100,000
1,000,000
10,000,000
100,000,000
110,000
1,100,000
11,000,000
110,000,000
120,000
1,200,000
12,000,000
120,000,000
13,000
130,000
1,300,000
13,000,000
130,000,000
15,000
150,000
1,500,000
15,000,000
150,000,000
160,000,000
Capacitance (pF)
F
0.16
1.6
16
160
1,600
16,000
160,000
1,600,000
16,000,000
G
0.18
1.8
18
180
1,800
18,000
180,000
1,800,000
18,000,000
180,000,000
H
0.20
2.0
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
2.2
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M
0.30
3.0
30
300
3,000
30,000
300,000
3,000,000
30,000,000
300,000,000
N
0.33
3.3
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
3.6
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
3.9
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
4.3
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
470,000,000
S
0.47
4.7
47
470
4,700
47,000
470,000
4,700,000
47,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
5.6
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
6.2
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
6.8
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X
0.75
7.5
75
750
7,500
75,000
750,000
7,500,000
75,000,000
750,000,000
Y
0.82
8.2
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
2.5
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
3.5
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d
0.40
4.0
40
400
4,000
40,000
400,000
4,000,000
40,000,000
400,000,000
e
0.45
4.5
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.50
5.0
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.60
6.0
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.70
7.0
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t
0.80
8.0
80
800
8,000
80,000
800,000
8,000,000
80,000,000
800,000,000
y
0.90
9.0
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
punched paper carrier.
ET
KEM
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812
and 2220
16
12
12
Array 0612
8
4
4
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifications.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Double the parts on each reel results in fewer reel
changes and increased efficiency.
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
P0
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
ØD1
Cover Tape
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
R Reference S1 Minimum
T
Note 2
Note 3
Maximum
25.0
(0.984)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
(0.024)
30
(1.181)
E1
P0
P2
T1
Maximum
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
B1 Maximum
Note 4
4.35
Single (4 mm)
(0.171)
Single (4 mm)
8.2
and double (8 mm)
(0.323)
12.1
Triple (12 mm)
(0.476)
Pitch
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
4.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
5.5 ±0.05
8.0 ±0.10
(0.217 ±0.002) (0.315 ±0.004)
7.5 ±0.05
12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
R
C1075_X7R_HT_SMD • 8/9/2021
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
12.4 +2.0/−0.0
(0.488 +0.078/−0.0)
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 8/9/2021
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