C0603X432J5JAC7867

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Overview The KEMET Flexible Termination (FT-CAP) Multilayer Ceramic Capacitor in U2J dielectric incorporates a unique, flexible termination system that is integrated with KEMET’s standard termination materials. A conductive silver epoxy is utilized between the base metal and nickel barrier layers of the KEMET standard termination system in order to establish pliability while maintaining terminal strength, solderability and electrical performance. This technology was developed in order to address the primary failure mode of MLCCs — flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Flexible termination technology inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low insulation resistance (IR) or short circuit failures. KEMET automotive grade capacitors meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements. systems. FT-CAP complements KEMET’s Open Mode, Floating Electrode (FE-CAP), Floating Electrode with Flexible Termination (FF-CAP), and KEMET Power Solutions (KPS) product lines provide a complete portfolio of flex mitigation solutions. Combined with the stability of U2J dielectric and designed to accommodate all capacitance requirements, these flexrobust devices are RoHS compliant, offer up to 5 mm of flex-bend capability and capacitance change limited to –750 ±20 ppm/°C from –55°C to +125°C. These devices are leadfree, RoHS and REACH compliant without exception and are capable of withstanding multiple passes through a lead-free solder reflow profile. Although this technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Ordering Information C 1206 X Case Size Specification/ Ceramic (L" x W") Series 0603 0805 1206 1210 1812 1 X = Flexible Termination 104 Capacitance Code (pF) Two significant digits and number of zeros. J 3 J A Failure Rate/ Capacitance Rated Voltage Dielectric Design Tolerance1 (VDC) F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% 8 = 10 4 = 16 3 = 25 5 = 50 1 = 100 J = U2J A = N/A C TU Termination Finish Packaging/ Grade (C-Spec) C = 100% Matte Sn See "Packaging C-Spec Ordering Options Table" Additional capacitance tolerance offerings may be available. Contact KEMET for details. Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging Type1 Packaging/Grade Ordering Code (C-Spec) Commercial Grade1 Bulk Bag/Unmarked 7" Reel/Unmarked 13" Reel/Unmarked 7" Reel/Unmarked/2 mm pitch2 13" Reel/Unmarked/2 mm pitch2 7" Reel 13" Reel/Unmarked 7" Reel/Unmarked/2 mm pitch2 13" Reel/Unmarked/2 mm pitch2 Not required (Blank) TU 7411 (EIA 0603 and smaller case sizes) 7210 (EIA 0805 and larger case sizes) 7081 7082 Automotive Grade3 AUTO AUTO7411 (EIA 0603 and smaller case sizes) AUTO7210 (EIA 0805 and larger case sizes) 3190 3191 Default packaging is “Bulk Bag.” An ordering code C-Spec is not required for “Bulk Bag” packaging. The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking.” 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information.” 3 Reeling tape options (paper or plastic) are dependent on capacitor case size (l" x w") and thickness dimensions. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information.” 3 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information." 3 All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For more information see "Capacitor Marking.” 1 1 Benefits • AEC–Q200 automotive qualified • Low dissipation factor DF < 0.1% • Low noise solution similar to C0G • Low ESR and ESL • High thermal stability • High ripple current capability • Preferred capacitance solution at line frequencies and into the MHz range • Retains over 99% of nominal capacitance at full rated voltage • Small predictable and linear capacitance change with respect to temperature • Operating temperature range of −55°C to +125°C • Capacitance up to 470 nF • DC voltage ratings up to 100 V • Lead (Pb)-free, RoHS and REACH compliant • Non-polar device, minimizing installation concerns • 100% pure matte Tin-plated termination finish allowing for excellent solderability © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET product change notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence Process/Product change Obsolescence* Days Prior To Implementation KEMET assigned Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 1 Customer Notification Due To: KEMET Automotive C-Spec KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. PPAP (Product Part Approval Process) Level KEMET Automotive C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO 1 ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part number specific PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Applications Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression and blocking, as well as energy storage in critical and safety relevant circuits without (integrated) current limitation, including those subject to high levels of board flexure or temperature cycling. Dimensions – Millimeters (Inches) L W B T S EIA Size Code Metric Size Code 0603 1608 0805 2012 1206 3216 1210 3225 1812 4532 L Length W Width 1.60 (0.063) ± 0.17 (0.007) 2.00 (0.079) ± 0.30 (0.012) 3.30 (0.130) ± 0.40 (0.016) 3.30 (0.130) ± 0.40 (0.016) 4.50 (0.178) ± 0.40 (0.016) 0.80 (0.032) ± 0.15 (0.006) 1.25 (0.049) ± 0.30 (0.012) 1.60 (0.063) ± 0.35(0.013) 2.60(0.102) ± 0.30(0.012) 3.20 (0.126) ± 0.30 (0.012) T Thickness B Bandwidth See Table 2 for thickness 0.45 (0.018) ± 0.15 (0.006) 0.50 (0.02) ± 0.25 (0.010) 0.60 (0.024) ± 0.25 (0.010) 0.60 (0.024) ± 0.25 (0.010) 0.70 (0.028) ± 0.35 (0.014) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com S Separation Minimum 0.58 (0.023) 0.75 (0.030) N/A Mounting Technique Solder wave or Solder reflow Solder reflow only C1087_U2J_FT-CAP_SMD • 9/14/2020 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Qualification/Certification Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in the document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit at 25ºC Insulation Resistance (IR) Limit at 25°C −55°C to +125°C −750 ±120 ppm/ºC 0.1% 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) 0.1% 1,000 MΩ µF or 100 GΩ (Rated voltage applied for 120 ±5 seconds at 25°C) To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Electrical Characteristics (Typical) Capacitance vs. Temperature (TCC) Capacitance Change (%) 15 10 5 0 −5 −10 −15 −60 −40 −20 0 20 40 60 80 100 120 140 Temperature (°C) Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage U2J All Capacitance Dissipation Factor Value (Maximum %) All 0.5 Capacitance Shift 0.3% or ±0.25 pF © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Insulation Resistance 10% of Initial limit C1087_U2J_FT-CAP_SMD • 9/14/2020 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes) 1 8 25 5 GB GB GB GB GB GB GB GB GB GB GB GB GC GH GK GB GB GB GB GB GB GB GB GB GB GB GB GC GH GK GB GB GB GB GB GB GB GB GB GB GB GB GC GH GK 25 3 16 FB FB FB FB FB FB FC FC FC FE FG FG FG FH FT FK 16 FB FB FB FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM 10 FB FB FB FB FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM 10 3 100 4 100 8 8 C0805X © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com EB EB EB EB EB EB EB EB EB EB EC EC EC EF EF EH EH EB EB EB EB EB EB EB EB EB EC EC EE EF EH EH FB FB FB FB FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM FB FB FB FB FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM 16 3 5 EB EB EB EB EB EB EB EB EB EB EC EC EC EP EF EH EH 10 4 3 EB EB EB EB EB EB EB EB EB EB EC EC EC EF EF EH EH 50 DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG DG 25 DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG DG 16 DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG DG 10 DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG DG 4 C0603X 1 50 8 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 5 25 Voltage Code Case Size/Series CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 3 50 16 Rated Voltage (VDC) CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 4 16 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 8 50 10 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 5 4 3 Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 10 K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K 3 25 50 J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 4 25 25 G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G 8 16 16 F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F 5 10 10 Capacitance Tolerance 3 50 4 25 8 16 5 C1812X 10 3 C1210X 50 4 C1206X 25 8 50 Capacitance Cap Code Voltage Code Rated Voltage (VDC) 25 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 C0805X 16 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 100,000 pF 120,000 pF 150,000 pF 180,000 pF 220,000 pF 270,000 pF 330,000 pF 390,000 pF 470,000 pF C0603X 10 Cap Capacitance Code Case Size/ Series 5 8 4 3 5 8 4 C1206X C1210X C1812X C1087_U2J_FT-CAP_SMD • 9/14/2020 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity1 Plastic Quantity Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel CF DC DD DG EB EC EE EF EP EH FB FC FE FG FH FM FT FK GB GC GH GK 0603 0805 0805 0805 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 0.80 ± 0.07* 0.78 ± 0.10 0.90 ± 0.10 1.25 ± 0.15 0.78 ± 0.10 0.90 ± 0.10 1.10 ± 0.10 1.20 ± 0.15 1.20 ± 0.20 1.60 ± 0.20 0.78 ± 0.10 0.90 ± 0.10 1.00 ± 0.10 1.25 ± 0.15 1.55 ± 0.15 1.70 ± 0.20 1.90 ± 0.20 2.10 ± 0.20 1.00 ± 0.10 1.10 ± 0.10 1.40 ± 0.15 1.60 ± 0.20 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4,000 4,000 2,500 4,000 4,000 2,500 2,500 2,500 2,000 4,000 4,000 2,500 2,500 2,000 2,000 2,000 2,000 1,000 1,000 1,000 1,000 0 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 10,000 8,000 8,000 8,000 8,000 4,000 4,000 4,000 4,000 Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Plastic Quantity Paper Quantity1 Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape & Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information.” Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec N/A 2 Case Size Packaging Quantities (pieces/unit packaging) 1 EIA (in) Metric (mm) Minimum 0603 0805 1206 1210 1812 1608 2012 3216 3225 4532 1 Maximum 50,000 20,000 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for automotive grade products. 2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and automotive grade products). The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. 1 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm) EIA Size Code Metric Size Code 0603 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81 1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16 1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X C V2 X C Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. The KEMET recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/JSTD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish SnPb Preheat/Soak Temperature Minimum (TSmin) 100°C Temperature Maximum (TSmax) 150°C Time (t S) from TSmin to TSmax 60 – 120 seconds 100% Matte Sn 150°C 200°C 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second maximum 3°C/second maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum 6°C/second maximum Time 25°C to Peak Temperature TP TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Terminal Strength JIS–C–6429 Board Flex JIS–C–6429 Test or Inspection Method Package Size (L" x W") Force Duration 0402 0603 ≥ 0805 5 N (0.51 kg) 10 N (1.02 kg) 18 N (1.83 kg) 60 seconds Appendix 1, Note: Appendix 2, Note: 3.0 mm (minimum) Magnification 50 X Conditions: Solderability J–STD–002 a) Method B, 4 hours at 155°C, dry heat at 235°C b) Method B, at 215°C, category 3 c) Method D, at 260°C, category 3 Temperature Cycling JESD22 Method JA-104 Biased Humidity MIL-STD-202 Method 103 Moisture Resistance MIL-STD-202 Method 106 Thermal Shock MIL-STD-202 Method 107 High Temperature Life MIL-STD-202 Method 108/EIA -198 Storage Life MIL-STD-202 Method 108 125°C, 0 VDC for 1,000 hours. Vibration MIL-STD-202 Method 204 5 G's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL-STD-202 Method 215 1,000 cycles (−55°C to +125°C). Measurement at 24 hours ±4 hours after test conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. Low Volt Humidity: 1,000 hours 85C°/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours ±4 hours after test conclusion. −55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell time – 15 minutes. Air – air. 1,000 hours at 125°C with 2 X rated voltage applied. Add aqueous wash chemical, OKEM clean or equivalent. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp, and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Construction Detailed Cross Section Dielectric Material (CaZrO3) End Termination/ Barrier Layer External Electrode (Ni) (Cu) Termination Finish Epoxy Layer (100% Matte (Ag) Sn/SnPb–5% Pb min) Dielectric Material (CaZrO3) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Inner Electrodes (Ni) Termination Finish (100% Matte Sn/SnPb–5% Pb min) Capacitor Marking (Optional) Laser marking option is not available on: • C0G, U2J, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with flexible termination option. • KPS commercial and automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel ® Embossed plastic* or punched paper carrier. ET KEM Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm or 16 mm carrier tape 180 mm (7.00") or 330 mm (13.00") Anti-static cover tape (0.10 mm (0.004") maximum thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel 13" Reel Pitch (P1)* Punched Paper 7" Reel 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 and 2220 16 12 12 Array 0612 8 4 4 *Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 and 7 for tolerance specifications. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) Packaging Type/Options C-3190 C-3191 C-7081 C-7082 Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefits of Changing from 4 mm to 2 mm Pitching Spacing • Lower placement costs. • Double the parts on each reel results in fewer reel changes and increased efficiency. • Fewer reels result in lower packaging, shipping and storage costs, reducing waste. C1087_U2J_FT-CAP_SMD • 9/14/2020 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 (10 pitches cumulative tolerance on tape ±0.2 mm) P0 A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) R Reference S1 Minimum T Note 2 Note 3 Maximum 25.0 (0.984) 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.024) 30 (1.181) E1 P0 P2 T1 Maximum 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm 16 mm B1 Maximum Note 4 4.35 Single (4 mm) (0.171) Single (4 mm) 8.2 and double (8 mm) (0.323) 12.1 Triple (12 mm) (0.476) Pitch E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 ±0.05 4.0 ±0.10 (0.138 ±0.002) (0.157 ±0.004) 5.5 ±0.05 8.0 ±0.10 (0.217 ±0.002) (0.315 ±0.004) 7.5 ±0.05 12.0 ±0.10 (0.138 ±0.002) (0.157 ±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.2 mm) A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) maximum R Reference Note 2 0.75 (0.030) 25 (0.984) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum F P1 T Maximum W Maximum A0 B 0 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum Maximum Rotation ( 20 10 5 ° S) Figure 5 – Bending Radius Embossed Carrier 16 mm Tape Punched Carrier 1.0 mm maximum 1.0 mm maximum R © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R C1087_U2J_FT-CAP_SMD • 9/14/2020 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/−0.0 (0.331 +0.059/−0.0) 12.4 +2.0/−0.0 (0.488 +0.078/−0.0) 16.4 +2.0/−0.0 (0.646 +0.078/−0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1087_U2J_FT-CAP_SMD • 9/14/2020 19