Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC
(Commercial & Automotive Grade)
Overview
The KEMET electrostatic discharge (ESD) rated commercial
and automotive grade surface mount capacitors in C0G
dielectric are suited for a variety of applications where
electrostatic discharge (ESD) events during assembly
or operation could damage the capacitor or the circuit.
These ESD rated capacitors provide the ability to design
within a given ESD criteria per the human body model
(HBM) AEC Q200–002 criteria. The KEMET automotive
grade capacitors also meet the other demanding
Automotive Electronics Council's AEC–Q200 qualification
requirements.
The C0G dielectric features a 125°C maximum operating
temperature and is considered “stable.” The Electronics
Industries Alliance (EIA) characterizes C0G dielectric as
a Class I material. Components of this classification are
temperature compensating and are suited for resonant
circuit applications, as well as those where Q and stability of
capacitance characteristics are required. The C0G dielectric
exhibits no change in capacitance with respect to time and
voltage, and boasts a negligible change in capacitance
compared to its value at 25°C. Capacitance change is limited
to ±30 ppm/°C from −55°C to +125°C.
Benefits
• AEC-Q200 automotive qualified
• ESD qualified per HBM - AEC Q200-002
• Available in package size EIA 0402, 0603, 0805, 1206
• DC Voltage ratings of 25 V, 50 V, 63 V, 100 V, 200 V and 250 V
• Capacitance range from 1 nF to 100 nF
• −55°C to +125°C operating temperature range
• Lead (Pb)-free, RoHS and REACH compliant
• Available capacitance tolerances of ±1%, ±2%, ±5%, ±10%, and ±20%
• No piezoelectric noise
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
• Preferred capacitance solution at line frequencies and
into the MHz range
• No capacitance changes with respect to applied DC voltage
• Negligible capacitance change with respect to temperature from −55°C to +125°C
• No capacitance decay with time
• Non-polar devices, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for excellent solderability
• Flexible Termination option available
Applications
Typical applications include: electrostatic discharge (ESD), integrated circuit (IC) protection, radio frequency (RF) filtering
function, input and output automotive applications such as controllers, navigation systems, airbags and keyless systems.
Built Into Tomorrow
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Ordering Information
C
0603
Ceramic
Case Size
(L" x W")
0402
0603
0805
1206
1
2
C
103
J
3
Specification/ Capacitance Capacitance Rated Voltage
Series
Code (pF)
Tolerance2
(VDC)
C = Standard
X = Flexible
Termination
Two
significant
digits and
number of
zeros
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
3 = 25
5 = 50
M = 63
1 = 100
2 = 200
A = 250
G
E
C
AUTO
Dielectric
Failure Rate/
Design
Termination
Finish2
Packaging/
Grade
(C-Spec)
G = C0G
E = ESD
C = 100%
Matte Sn
See
"Packaging
C-Spec
Ordering
Options
Table"
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Additional capacitance tolerance offerings and termination finish options may be available. Contact KEMET for details.Benefits (cont'd)
Table 1A – Capacitance Range/Selection Waterfall
Case Size/
Series
Capacitance Cap Code
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10 nF
15 nF
22 nF
33 nF
47 nF
68 nF
100 nF
102
152
222
332
472
682
103
153
223
333
473
683
104
C0402C
C0603C
Rated Voltage
(VDC)
25
50
63
100
25
50
63
Voltage Code
3
5
M
1
3
5
M
C0805C
100 200
1
2
25
50
63
3
5
M
C1206C
100 200 250
1
2
A
25
50
63
3
5
M
100 200 250
1
2
A
Cap Tolerance
ESD Level per AEC–Q200
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
4 kV 4 kV 4 kV 4 kV 6 kV 6 kV 6 kV 6 kV 6 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV
6 kV 6 kV
8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV
6 kV
12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV
16 kV 16 kV 16 kV 16 kV
16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV
16 kV 16 kV 16 kV 16 kV
25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
25 kV 25 kV
25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
25 kV
25 kV 25 kV 25 kV 25 kV
25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
25 kV
25 kV 25 kV 25 kV 25 kV
25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
25 kV 25 kV
25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
25 kV
25 kV 25 kV 25 kV 25 kV
25 kV
25 kV 25 kV 25 kV 25 kV
25 kV 25 kV
25 kV
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Ordering Code (C-Spec)
Packaging Type
Commercial Grade1
Bulk Bag
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
Not required (blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Automotive Grade3
7" Reel
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Default packaging is "Bulk Bag." An ordering code C-Spec is not required for "Bulk Bag" packaging.
The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking."
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
3
For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3
All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For
more information see "Capacitor Marking."
1
1
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive
Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notifi cation system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fi t, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days Prior To
Implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days minimum
AUTO
Yes (without approval)
Yes
90 days minimum
1
1
Customer Notification Due To:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specifi cation requirements are properly
understood and fulfi lled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
2
3
4
5
KEMET assigned1
●
●
●
●
●
AUTO
1
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specifi c PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
W
B
T
S
EIA Size
Code
Metric Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0.30 (0.012)
±0.10 (0.004)
0.30 (0.012)
Solder reflow
only
0.35 (0.014)
±0.15 (0.006)
0.70 (0.028)
0.50 (0.02)
±0.25 (0.010)
0.75 (0.030)
0.50 (0.02)
±0.25 (0.010)
N/A
0.45 (0.018)
±0.15 (0.006)
0.58 (0.023)
0.50 (0.02)
±0.25 (0.010)
0.75 (0.030)
0.60 (0.024)
±0.25 (0.010)
N/A
Without Flexible Termination
0402
1005
1.00 (0.040)
±0.05 (0.002)
0.50 (0.020)
±0.05 (0.002)
0603
1608
1.60 (0.063)
±0.15 (0.006)
0.80 (0.032)
±0.15 (0.006)
0805
2012
2.00 (0.079)
±0.20 (0.008)
1.25 (0.049)
±0.20 (0.008)
1206
3216
3.20 (0.126)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
See Table 2 for
Thickness
Solder wave
or
Solder reflow
With Flexible Termination
0603
1608
1.60 (0.063)
±0.17 (0.007)
0.80 (0.032)
±0.15 (0.006)
0805
2012
2.00 (0.079)
±0.30 (0.012)
1.25 (0.049)
±0.30 (0.012)
1206
3216
3.30 (0.130)
±0.40 (0.016)
1.60 (0.063)
±0.35 (0.013)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
See Table 2 for
Thickness
Solder wave or
Solder reflow
C1091_C0G_ESD • 4/25/2022
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
1
2
3
Dissipation Factor (DF) Maximum Limit at 25°C
Insulation Resistance (IR) Minimum Limit at 25°C
−55°C to +125°C
±30 ppm/°C
0%
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
0.1%
1,000 MΩ µF or 100 GΩ
(Rated voltage applied for 120 ±5 seconds at 25°C)
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
3
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance, it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as automatic level control (ALC). The ALC feature should be switched to "ON."
1
Post Environmental Limits
Post Environmental Limits
Dielectric
Rated DC
Voltage
Capacitance
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
C0G
All
All
0.5
0.3% or
±0.25 pf
10% of
Initial limit
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 1B – Product Availability and Chip Thickness Waterfall – Standard Termination
Case Size/
Series
Capacitance Cap Code
C0402C
Rated Voltage
(VDC)
25
50
63
100
25
50
63
Voltage Code
3
5
M
1
3
5
M
Cap Tolerance
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10 nF
15 nF
22 nF
33 nF
47 nF
68 nF
100 nF
C0603C
102
152
222
332
472
682
103
153
223
333
473
683
104
C0805C
100 200
1
2
25
50
63
3
5
M
C1206C
100 200 250
1
2
A
25
50
63
3
5
M
100 200 250
1
2
A
Product Availability and Chip Thickness Codes – See Packaging Specs for Chip Thickness Dimensions
BB
BB
BB
BB
BB
BB
BB
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
DD
DR
DR
DR
DD
DG
DD
DG
DF
DG
DG
DD
DR
DR
DR
DD
DG
DD
DG
DF
DD
DR
DR
DR
DD
DG
DD
DG
DD
DR
DR
DR
DD
DG
DD
DG
DD
DR
DR
DR
DD
DG
DD
DR
DR
DR
DD
DG
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
EF
EH
EH
EH
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
EF
EH
EH
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
EF
EH
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
EF
EH
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
Table 1C – Product Availability and Chip Thickness Waterfall – Flexible Termination
Case Size/
Series
Capacitance
Cap Code
102
152
222
332
472
682
103
153
223
333
473
683
104
C0805C
C1206C
Rated Voltage
(VDC)
25
50
63
100
200
25
50
63
100
200
250
25
50
63
100
200
250
Voltage Code
3
5
M
1
2
3
5
M
1
2
A
3
5
M
1
2
A
Cap Tolerance
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10 nF
15 nF
22 nF
33 nF
47 nF
68 nF
100 nF
C0603C
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
Product Availability and Chip Thickness Codes – See Packaging Specs for Chip Thickness Dimensions
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
CJ
CJ
CJ
DD
DR
DR
DR
DD
DG
DD
DG
DF
DG
DG
DD
DR
DR
DR
DD
DG
DD
DG
DF
DD
DR
DR
DR
DD
DG
DD
DG
DD
DR
DR
DR
DD
DG
DD
DG
DD
DR
DR
DR
DD
DG
DD
DR
DR
DR
DD
DG
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
EF
EH
EH
EH
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
EF
EH
EH
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
EF
EH
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
EF
EH
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
C1091_C0G_ESD • 4/25/2022
EQ
ER
ET
EQ
EQ
EQ
ER
EF
EH
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
CF
DN
DP
DF
DG
EB
EC
EE
EF
EH
0402
0603
0805
0805
0805
0805
1206
1206
1206
1206
1206
0.50 ± 0.05
0.80 ± 0.07
0.78 ± 0.10
0.90 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
0.78 ± 0.10
0.90 ± 0.10
1.10 ± 0.10
1.20 ± 0.15
1.60 ± 0.20
10,000
4,000
4,000
4,000
0
0
0
0
0
0
0
50,000
15,000
15,000
15,000
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
4,000
4,000
2,500
2,500
2,000
0
0
0
0
10,000
10,000
10,000
10,000
10,000
10,000
8,000
Table 3 – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec
N/A 2
Case Size
Packaging Quantities (pieces/unit packaging)
1
EIA (in)
Metric (mm)
0402
0603
0805
1206
1210
1808
1812
1005
1608
2012
3216
3225
4520
4532
1825
2220
2225
4564
5650
5664
Minimum
Maximum
50,000
1
20,000
The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for automotive grade products.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and automotive grade products.) The
15th through 22nd character positions of the ordering code should be left blank. All products ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
1
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 4 – Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
C
Y
X
V1
Density Level B:
Median (Nominal)
Land Protrusion (mm)
V2
C
Y
X
Density Level C:
Minimum (Least)
Land Protrusion (mm)
V1
V2
C
Y
X
V1
V2
Without Flexible Termination
0402
1005
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
With Flexible Termination
0603
1608
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0805
2012
0.99
1.44
1.66
4.47
2.71
0.89
1.24
1.56
3.57
2.11
0.79
1.04
1.46
2.42
1.81
1206
3216
1.59
1.62
2.06
5.85
3.06
1.49
1.42
1.96
4.95
2.46
1.39
1.22
1.86
4.25
2.16
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile
The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the
IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow
passes at these conditions.
Termination Finish
TP
100% Matte Sn
Preheat/Soak
Temperature minimum (TSmin)
Temperature maximum (TSmax)
Time (tS) from TSmin to TSmax
150°C
200°C
60 – 120 seconds
Ramp-up rate (TL to TP)
3°C/second maximum
Liquidous temperature (TL)
217°C
Time above liquidous (tL)
60 – 150 seconds
Peak temperature (TP)
260°C
Time within 5°C of maximum peak
temperature (tP)
30 seconds maximum
Ramp-down rate (TP to TL)
6°C/second maximum
Time 25°C to peak temperature
8 minutes maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Note : All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 5 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex
JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for
C0G. Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C, category 3
c) Method D at 260°C, category 3
Temperature Cycling
JESD22 Method JA–104
1,000 Cycles (−55°C to +125°C). Measurement at 24 hours ±4 hours after test conclusion.
Load humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
Low volt humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required.
Measurement at 24 hours ±4 hours after test conclusion.
−55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20
seconds.
Dwell time – 15 minutes. Air – Air.
Biased Humidity
MIL–STD–202
Method 103
Moisture Resistance
MIL–STD–202
Method 106
Thermal Shock
MIL–STD–202
Method 107
High Temperature Life
MIL–STD–202
Method 108/EIA–198
Storage Life
MIL–STD–202
Method 108
150°C, 0 VDC for 1,000 hours.
Vibration
MIL–STD–202
Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: use 8" X 5" PCB 0.031" thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
Resistance to Solvents
MIL–STD–202
Method 213
MIL–STD–202
Method 215
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Figure 1 of Method 213, Condition F.
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Dielectric Material
(CaZrO3)
Dielectric
Material (CaZrO3)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Construction – Flexible Termination
Detailed Cross Section
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Dielectric
Material (CaZrO3)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Termination
Finish
(100% Matte Sn)
C1091_C0G_ESD • 4/25/2022
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional)
Laser marking option is not available on:
• C0G, ultra stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with flexible termination option.
• KPS commercial and automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
punched paper carrier.
ET
KEM
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 6 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812
and 2220
16
12
12
Array 0612
8
4
4
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifications.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Double the parts on each reel results in fewer reel
changes and increased effi ciency.
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
C1091_C0G_ESD • 4/25/2022
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
P0
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
ØD1
Cover Tape
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 7 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
R Reference S1 Minimum
T
Note 2
Note 3
Maximum
25.0
(0.984)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
(0.024)
30
(1.181)
E1
P0
P2
T1
Maximum
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
B1 Maximum
Note 4
4.35
Single (4 mm)
(0.171)
Single (4 mm)
8.2
and Double (8 mm)
(0.323)
12.1
Triple (12 mm)
(0.476)
Pitch
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
4.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
5.5 ±0.05
8.0 ±0.10
(0.217 ±0.002) (0.315 ±0.004)
7.5 ±0.05
12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes, and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape, and to 1.0 mm maximum for 16 mm tape (see
Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 8 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Bending
Radius
R
C1091_C0G_ESD • 4/25/2022
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 9 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
12.4 +2.0/−0.0
(0.488 +0.078/−0.0)
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1091_C0G_ESD • 4/25/2022
20
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