Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination
System (FF-CAP), X7R Dielectric, 6.3 – 250 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s Floating Electrode with Flexible Termination
capacitor (FF-CAP) combines two existing KEMET
technologies– Floating Electrode and Flexible Termination.
The floating electrode component utilizes a cascading
internal electrode design configured to form multiple
capacitors in series within a single monolithic structure.
This unique configuration results in enhanced voltage and
ESD performance over standard capacitor designs while
allowing for a fail-open condition if mechanically damaged
(cracked). The flexible termination component utilizes a
conductive silver epoxy between the base metal and nickel
barrier layers of KEMET’s standard termination system
in order to establish pliability while maintaining terminal
strength, solderability and electrical performance. Both
technologies address the primary failure mode of MLCCs–
flex cracks, which are typically the result of excessive
tensile and shear stresses produced during board flexure
and thermal cycling.
The FF-CAP complements KEMET’s Open Mode, Floating
Electrode (FE-CAP), Flexible Termination (FT-CAP) and KEMET
Power Solutions (KPS) product lines by providing an ultimate
fail-safe design optimized for low to mid range capacitance
values. These devices exhibit a predictable change in
capacitance with respect to time and voltage and boast a
minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±15% from
−55°C to +125°C.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
Although neither technology can eliminate the potential for
mechanical damage that may propagate during extreme
environmental and/or handling conditions, the combination
of these two technologies provide the ultimate level of
protection against a low IR or short circuit condition.
Ordering Information
C
Ceramic
0805
Case Size Specification/
(L" x W")
Series
0603
0805
1206
1210
1812
1
1
Y
Y = Floating
Electrode
with
Flexible
Termination
104
Capacitance
Code (pF)
Two significant
digits and
number of
zeros
K
5
R
A
C
TU
Failure Rate/
Capacitance Rated Voltage
Packaging/
Termination Finish1
Dielectric
Design
Tolerance
(VDC)
Grade (C-Spec)
J = ±5%
K = ±10%
M = ±20%
9 = 6.3
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
R = X7R
A = N/A
C = 100% Matte Sn
L = SnPb (5% Pb
minimum)
See
"Packaging
C-Spec
Ordering
Options
Table"
Additional termination finish options may be available. Contact KEMET for details.
SnPb termination finish option is not available on automotive grade product.
Built Into Tomorrow
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Ordering Code (C-Spec)
Packaging Type
Commercial Grade1
Bulk Bag
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Marked
13" Reel/Marked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
Not Required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
TM
7040 (EIA 0603)
7215 (EIA 0805 and larger case sizes)
7081
7082
Automotive Grade3
7" Reel
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information".
3
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking".
1
1
Benefits
• −55°C to +125°C operating temperature range
• Superior flex performance (up to 5 mm)
• Floating Electrode/fail open design
• Low to mid capacitance flex mitigation
• Lead (Pb)-free, RoHS and REACH compliant
• EIA 0603, 0805, 1206, 1210, and 1812 case sizes
• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,
200 V, and 250 V
• Capacitance offerings ranging from 180 pF to 0.22 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Commercial and Automotive (AEC–Q200) grades available
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb termination finish option available upon request
(5% Pb minimum)
Applications
Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits
without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature
cycling. Examples include raw power input side filtering (power plane/bus), high current applications (automobile battery
line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive,
aerospace and telecom.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days Prior To
Implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days minimum
AUTO
Yes (without approval)
Yes
90 days minimum
1
1
Customer Notification Due To:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
2
3
4
5
KEMET assigned1
●
●
●
●
●
AUTO
1
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
W
B
T
S
EIA Size
Code
Metric Size
Code
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
L
Length
W
Width
1.60 (0.063)
±0.17 (0.007)
2.00 (0.079)
±0.30 (0.012)
3.30 (0.130)
±0.40 (0.016)
3.30 (0.130)
±0.40 (0.016)
4.50 (0.178)
±0.40 (0.016)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.30 (0.012)
1.60 (0.063)
±0.35 (0.013)
2.60 (0.102)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
T
Thickness
B
Bandwidth
See Table 2 for
Thickness
0.45 (0.018)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.70 (0.028)
±0.35 (0.014)
S
Separation
Minimum
Mounting
Technique
0.58 (0.023)
0.75 (0.030)
N/A
Solder Wave or
Solder Reflow
Solder Reflow
Only
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
−55°C to +125°C
Capacitance Change with Reference to
+25°C and 0 Vdc Applied (TCC)
±15%
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
3.0%
1
2
3
4
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit at 25°C
Insulation Resistance (IR) Minimum Limit at 25°C
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50mA)
5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V)
See Insulation Resistance Limit Table
(Rated voltage applied for 120±5 seconds at 25°C)
Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3
Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
4
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
1
2
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
X7R
Rated DC
Voltage
> 25
16/25
< 16
Capacitance
Value
All
Dissipation Factor
(Maximum %)
3.0
5.0
7.5
Capacitance
Shift
Insulation
Resistance
±20%
10% of Initial
Limit
Insulation Resistance Limit Table (X7R Dielectric)
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
N/A
< 0.012 µF
< 0.047 µF
< 0.15 µF
< 0.47 µF
< 0.39 µF
ALL
< 2.2 µF
ALL
< 10 µF
ALL
ALL
≥ 0.012 µF
≥ 0.047 µF
≥ 0.15 µF
≥ 0.47 µF
≥ 0.39 µF
N/A
≥ 2.2 µF
N/A
≥ 10 µF
N/A
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0603 – 0805 Case Sizes)
200
250
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DD
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
250
25
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
200
16
100
10
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
100
A
50
2
50
1
25
5
16
3
6.3
25
200
16
100
10
Voltage Code
4
10
Capacitance Code
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
Rated Voltage
(VDC)
8
6.3
Capacitance
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
9
200
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
2
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
9
8
4
3
5
1
2
9
8
4
3
5
1
2
A
Capacitance
Tolerance
180 pF
220 pF
270 pF
330 pF
390 pF
470 pF
560 pF
680 pF
820 pF
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
1
100
Rated Voltage
(VDC)
5
50
3
50
4
25
8
16
9
C0805Y
10
Voltage Code
6.3
Capacitance
Code
C0603Y
6.3
Capacitance
Case Size/
Series
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Case Size/Series
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C0603Y
C0805Y
C1015_X7R_FF-CAP_SMD • 8/18/2023
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 1B – Capacitance Range/Selection Waterfall (1206 – 1812 Case Sizes)
5
1
2
A
3
5
1
2
A
10
16
25
50
100
200
250
6.3
10
16
25
50
100
200
250
Case Size/
Series
9
8
4
3
5
1
2
C1206Y
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
A
3
5
1
2
A
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FX
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
200
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
100
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
50
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ER
EQ
25
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
16
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
10
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
6.3
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
250
Voltage Code
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
200
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
Rated Voltage
(VDC)
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
100
Capacitance
Tolerance
250
3
250
4
200
8
200
9
100
A
100
2
50
1
50
5
25
3
25
4
250
8
50
Cap Code
9
25
Capacitance
Voltage Code
16
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
C1812Y
Rated Voltage
(VDC)
10
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
C1210Y
6.3
Cap
Code
C1206Y
6.3
Capacitance
Case Size/
Series
A
9
8
4
3
5
1
2
C1210Y
C1812Y
C1015_X7R_FF-CAP_SMD • 8/18/2023
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
CJ
DR
DD
DG
EQ
ER
FN
FQ
FX
GB
0603
0805
0805
0805
1206
1206
1210
1210
1210
1812
0.80 ± 0.15
0.78 ± 0.20
0.90 ± 0.10
1.25 ± 0.15
0.78 ± 0.20
0.90 ± 0.20
0.78 ± 0.20
0.90 ± 0.20
0.95 ± 0.20
1.00 ± 0.10
4,000
0
0
0
0
0
0
0
0
0
15,000
0
0
0
0
0
0
0
0
0
0
4,000
4,000
2,500
4,000
4,000
4,000
4,000
4,000
1,000
0
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
4,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Plastic Quantity
Paper Quantity1
Package quantity based on finished chip thickness specifications.
1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
N/A 2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
Minimum
Maximum
50,000
1
20,000
The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for Automotive Grade products.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
1
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
0603
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1608
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0805
2012
0.99
1.44
1.66
4.47
2.71
0.89
1.24
1.56
3.57
2.11
0.79
1.04
1.46
2.42
1.81
1206
3216
1.59
1.62
2.06
5.85
3.06
1.49
1.42
1.96
4.95
2.46
1.39
1.22
1.86
4.25
2.16
1210
3225
1.59
1.62
3.01
5.90
4.01
1.49
1.42
2.91
4.95
3.41
1.39
1.22
2.81
4.25
3.11
1812
4532
2.10
1.80
3.60
7.00
4.60
2.00
1.60
3.50
6.10
4.00
1.90
1.40
3.40
5.40
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
C
V2
X
C
Grid Placement Courtyard
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
Termination Finish
SnPb
TP
100% Matte Sn
Ramp-Up Rate (TL to TP)
100°C
150°C
60 – 120 seconds
3°C/second
maximum
150°C
200°C
60 – 120 seconds
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
30 seconds
maximum
maximum
6°C/second
6°C/second
Ramp-Down Rate (TP to TL)
maximum
maximum
Time 25°C to Peak
6 minutes
8 minutes
Temperature
maximum
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex
JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
Temperature Cycling
JESD22 Method JA–104
Biased Humidity
MIL–STD–202 Method
103
Moisture Resistance
Thermal Shock
High Temperature Life
Storage Life
Vibration
Mechanical Shock
Resistance to Solvents
MIL–STD–202 Method
106
MIL–STD–202 Method
107
MIL–STD–202 Method
108
/EIA–198
MIL–STD–202 Method
108
MIL–STD–202 Method
204
MIL–STD–202 Method
213
MIL–STD–202 Method
215
1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test
conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required.
Measurement at 24 hours +/− 4 hours after test conclusion.
−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20
seconds, dwell time – 15 minutes. Air – Air.
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
150°C, 0 VDC for 1,000 hours.
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Figure 1 of Method 213, Condition F.
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Construction
Detailed Cross Section
Dielectric Material
(BaTiO3)
Barrier Layer
End Termination/
(Ni)
External Electrode
Termination Finish
(Cu)
(100% Matte Sn /
Epoxy Layer
SnPb - 5% Pb min)
(Ag)
Dielectric Material
(BaTiO3)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
C1015_X7R_FF-CAP_SMD • 8/18/2023
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Capacitor Marking (Optional)
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be
marked as an extra cost option. Marking is available
on most KEMET devices, but must be requested using
the correct ordering code identifier(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited
to the “K” character only.
Marking appears in legible contrast. Illustrated below
is an example of an MLCC with laser marking of “KA8”,
which designates a KEMET device with rated capacitance
of 100 µF. Orientation of marking is vendor optional.
KEMET
ID
2-Digit
Capacitance
Code
Laser marking option is not available on:
• C0G, ultra stable X8R and Y5V dielectric devices.
• EIA 0402 case size devices.
• EIA 0603 case size devices with flexible termination
option.
• KPS commercial and automotive grade stacked
devices.
• X7R dielectric products in capacitance values outlined
below.
EIA Case Size
Metric Size Code
Capacitance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
≤ 170 pF
≤ 150 pF
≤ 910 pF
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Capacitor Marking (Optional) cont.
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
Character
9
A
0.10
1.0
10
100
1,000
10,000
B
0.11
1.1
11
110
1,100
11,000
C
0.12
1.2
12
120
1,200
12,000
D
0.13
1.3
13
130
1,300
E
0.15
1.5
15
150
1,500
0
1
2
3
4
5
6
7
8
100,000
1,000,000
10,000,000
100,000,000
110,000
1,100,000
11,000,000
110,000,000
120,000
1,200,000
12,000,000
120,000,000
13,000
130,000
1,300,000
13,000,000
130,000,000
15,000
150,000
1,500,000
15,000,000
150,000,000
160,000,000
Capacitance (pF)
F
0.16
1.6
16
160
1,600
16,000
160,000
1,600,000
16,000,000
G
0.18
1.8
18
180
1,800
18,000
180,000
1,800,000
18,000,000
180,000,000
H
0.20
2.0
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
2.2
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M
0.30
3.0
30
300
3,000
30,000
300,000
3,000,000
30,000,000
300,000,000
N
0.33
3.3
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
3.6
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
3.9
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
4.3
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
470,000,000
S
0.47
4.7
47
470
4,700
47,000
470,000
4,700,000
47,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
5.6
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
6.2
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
6.8
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X
0.75
7.5
75
750
7,500
75,000
750,000
7,500,000
75,000,000
750,000,000
Y
0.82
8.2
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
2.5
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
3.5
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d
0.40
4.0
40
400
4,000
40,000
400,000
4,000,000
40,000,000
400,000,000
e
0.45
4.5
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.50
5.0
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.60
6.0
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.70
7.0
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t
0.80
8.0
80
800
8,000
80,000
800,000
8,000,000
80,000,000
800,000,000
y
0.90
9.0
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
punched paper carrier.
ET
KEM
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812
and 2220
16
12
12
Array 0612
8
4
4
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifications.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Double the parts on each reel results in fewer reel
changes and increased efficiency.
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
C1015_X7R_FF-CAP_SMD • 8/18/2023
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
P0
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
ØD1
Cover Tape
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
R Reference S1 Minimum
T
Note 2
Note 3
Maximum
25.0
(0.984)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
(0.024)
30
(1.181)
E1
P0
P2
T1
Maximum
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
B1 Maximum
Note 4
4.35
Single (4 mm)
(0.171)
Single (4 mm)
8.2
and double (8 mm)
(0.323)
12.1
Triple (12 mm)
(0.476)
Pitch
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
4.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
5.5 ±0.05
8.0 ±0.10
(0.217 ±0.002) (0.315 ±0.004)
7.5 ±0.05
12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Bending
Radius
R
C1015_X7R_FF-CAP_SMD • 8/18/2023
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
12.4 +2.0/−0.0
(0.488 +0.078/−0.0)
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
YAGEO Corporation and its affiliates do not recommend the use of commercial or automotive grade products for high reliability applications or manned space flight.
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 8/18/2023
21
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