C1206H272J2GAC7800

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 200°C, C0G Dielectric, 10 – 200 VDC (Industrial Grade) Overview KEMET’s High Temperature surface mount C0G Multilayer Ceramic Capacitors (MLCCs) are constructed of a robust and proprietary C0G/NP0 base metal electrode (BME) dielectric system that offers industry-leading performance at extreme temperatures up to 200°C. These devices are specifically designed to withstand the demands of harsh industrial environments such as down-hole oil exploration and automotive/avionics engine compartment circuitry. elevated temperatures up to 200°C. They also exhibit low ESR at high frequencies and offer greater volumetric efficiency over competitive high temperature precious metal electrode (PME) and BME ceramic capacitor devices. These devices are Lead (Pb)-Free, RoHS and REACH compliant without the need of any exemptions. KEMET’s High Temperature C0G capacitors are temperature compensating and are well suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. They exhibit no change in capacitance with respect to time and voltage and boast a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30ppm/ºC from −55°C to +200°C. In addition, these capacitors exhibit high insulation resistance with low dissipation factor at Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Ordering Information C Ceramic 1210 Case Size Specification/ (L" x W") Series 0402 0603 0805 1206 1210 1812 2220 1 2 H H = High Temperature (200°C) 124 J 5 G A C TU Capacitance Code (pF) Capacitance Tolerance1 Voltage Dielectric Failure Rate/ Design Termination Finish2 Packaging/ Grade (C-Spec) Two significant digits + number of zeros. Use 9 for 1.0 – 9.9 pF Use 8 for 0.5 – 0.99 pF e.g., 2.2 pF = 229 e.g., 0.5 pF = 508 B = ±0.10 pF C = ±0.25 pF D = ±0.5 pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% 8 = 10 V 4 = 16 V 3 = 25 V 5 = 50 V 1 = 100 V 2 = 200 V G = C0G A = N/A C = 100% Matte Sn L = SnPb (5% Pb minimum) E = Gold (Au) 1.97 – 11.8 µin F = Gold (Au) 30 – 50 µin G = Gold (Au) 100 µin minimum See “Packaging C-Spec Ordering Options Table” below Additional capacitance tolerance offerings may be available. Contact KEMET for details. Additional termination finish options may be available. Contact KEMET for details. One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Benefits • −55°C to +200°C operating temperature range • Lead (Pb)-free, RoHS and REACH compliant • EIA 0402, 0603, 0805, 1206, 1210, 1812, and 2220 case sizes • DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 200 V • Capacitance offerings ranging from 0.5 pF up to 470 nF • Available capacitance tolerances of ±0.10 pF, ±0.25 pF, ±0.5 pF, ±1%, ±2%, ±5%, ±10% or ±20% • No piezoelectric noise • Extremely low ESR and ESL • High thermal stability • High ripple current capability • Preferred capacitance solution at line frequencies and into the MHz range • No capacitance change with respect to applied rated DC voltage • Negligible capacitance change with respect to temperature from −55°C to +200°C • No capacitance decay with time • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated termination finish allowing for excellent solderability • Gold (Au), Tin/Lead (Sn/Pb) and 100% pure matte Tin (Sn) termination finishes available Applications Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression, blocking and energy storage for use in extreme environments such as downhole exploration, aerospace engine compartments and geophysical probes. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Packaging C-Spec Ordering Options Table Termination Finish Options Packaging Type/Options Packaging Ordering Code (C-Spec) Standard Packaging – Unmarked3 Bulk Bag Waffle Tray 2 7" Tape & Reel C = 100% Matte Sn L = SnPb (5% Pb min.) F = Gold (Au) 30 – 50 µin G = Gold (Au) 100 µin minimum 13" Reel 7” Tape & Reel/2 mm pitch4 7" Tape & Reel – 50 pieces 7" Tape & Reel – 100 pieces 7" Tape & Reel – 250 pieces 7" Tape & Reel – 500 pieces 7" Tape & Reel – 1,000 pieces Blank1 7292 TU 7411 (EIA 0603 and smaller case sizes) 7210 (EIA 0805 and larger case sizes) 7081 T050 T100 T250 T500 T1K0 Moisture Sensitive Packaging5 – Unmarked3 E = Gold (Au) 1.97 – 11.8 µin F = Gold (Au) 30 – 50 µin G = Gold (Au) 100 µin minimum Waffle Tray 2 7" Tape & Reel 7" Tape & Reel – 50 pieces 7" Tape & Reel – 100 pieces 7" Tape & Reel – 250 pieces 7" Tape & Reel – 500 pieces 7" Tape & Reel – 1,000 pieces 7282 7130 Contact KEMET6 Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging. “Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric). 2 “Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric). 3 The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. 3 Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 through 2225 case size devices with chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options may be available. Contact KEMET for details. 4 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”. 5 Moisture sensitive packaging is required for Gold (Au) termination option “E” (1.97 – 11.8 µin) 6 Additional reeling or packaging options may be available. Contact KEMET for details. 1 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Dimensions – Millimeters (Inches) L W B T S EIA Size Code Metric Size Code 0402 1005 0603 1608 0805 2012 1206 3216 1210 3225 1812 4532 2220 5650 L Length W Width 1.00 (0.040) ±0.05 (0.002) 1.60 (0.063) ±0.15 (0.006) 2.00 (0.079) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 4.50 (0.177) ±0.30 (0.012) 5.70 (0.224) ±0.40 (0.016) 0.50 (0.020) ±0.05 (0.002) 0.80 (0.032) ±0.15 (0.006) 1.25 (0.049) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008) 2.50 (0.098) ±0.20 (0.008) 3.20 (0.126) ±0.30 (0.012) 5.00 (0.197) ±0.40 (0.016) T Thickness B Bandwidth See Table 2 for Thickness 0.30 (0.012) ±0.10 (0.004) 0.35 (0.014) ±0.15 (0.006) 0.50 (0.02) ±0.25 (0.010) 0.50 (0.02) ±0.25 (0.010) 0.50 (0.02) ±0.25 (0.010) 0.60 (0.024) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014) S Separation Minimum Mounting Technique 0.30 (0.012) Solder Reflow Only 0.70 (0.028) 0.75 (0.030) N/A Solder Wave or Solder Reflow Solder Reflow Only Qualification/Certification High temperature (200ºC) Industrial grade products meet or exceed the requirements outlined in Table 4, Performance & Reliability. Qualification packages are available for review and download on our website at www.kemet.com/hightemp Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) 1 2 3 Dissipation Factor (DF) Maximum Limit at 25ºC Insulation Resistance (IR) Minimum Limit at 25°C −55°C to +200°C ±30 ppm/ºC (up to 200ºC) 0% 250% of rated voltage (5±1 seconds and charge/discharge not exceeding 50 mA) 0.1% 1,000 megohm microfarads or 100 GΩ (Rated voltage applied for 120±5 seconds at 25°C) DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2 Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF 3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to “ON.” 1 Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) Capacitance Shift C0G All All 0.5 0.3% or ±0.25 pF Insulation Resistance 10% of Initial Limit © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Electrical Characteristics Delta Cap vs. Temperature (Typical) C1210H104J1GAC - Life Test IR Distribution (Lognormal) 20 99 15 10 80 70 60 50 40 30 20 Percent % 5 Delta Cap (%) 0 hrs 2000 hrs 95 90 0 −5 10 −10 −15 0 Vr 5 100% Vr 1 −20 0.1 1.0 10.0 100.0 200 180 160 140 120 100 80 60 40 20 0 −20 −40 −60 25°C IR (GOhms) Temperature (ºC) Capacitance vs. Temperature with 25 V DC Bias (Rated Voltage) DF vs. Temperature without DC Bias. 1.00 200 200ºC C0G 100nF no DC 0.50 DF (%) 150 Capacitance (nF) 200ºC C0G MLCC 100nF 200ºC C0G 100nF 25V DC 100 0.00 50 −0.50 0 −1.00 BME vs. PME/IR vs. Temperature with 25 V DC Bias (Rated Voltage) 1.E+08 1.E+08 1.E+07 1.E+07 1.E+06 1.E+06 IR (MOhms) 1.E+05 IR (MOhms) 200 180 160 140 120 100 80 60 40 IR vs. Temperature with 25 V DC Bias (Rated Voltage) 1.E+04 1.E+03 1.E+02 1.E+01 20 0 −20 −40 −60 200 180 160 140 120 100 80 60 40 20 0 −20 −40 −60 Temperature (°C) Temperature (°C) 1.E+05 1.E+04 1.E+03 PME C0G MLCC 1206/10nF 1.E+02 200ºC C0G MLCC 100nF BME C0G MLCC 1206/10nF 1.E+01 1.E+00 200 180 160 140 120 80 100 60 40 0 20 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com −20 −40 −60 200 180 160 140 120 80 100 60 40 0 20 −20 −40 −60 Temperature (°C) Temperature (°C) C1001_C0G_200C_SMD • 7/29/2016 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) 5 1 2 25 100 200 10 Case Size / Series 16 25 50 100 200 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EC EC ED EF EH EH EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EE EE EF EH EH EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC ED ED ED ED EE EC EC EC EE EE EF EC EC ED ED EB EB EB EB EB EB EB EB EB EC EE EE EH EH EB EB EB EB EB EB EB EB EB EB EB EB EE EB EB EC EC ED ED ED EE EC EC 2 8 4 3 5 1 2 DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DN DN DN DN DP DP DP DE DE DE DE DN DN DN DN DN DN DN DN DN DN DP DF DG DG DG DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DN DN DN DN DP DP DP DE DE DE DE DN DN DN DN DN DN DN DN DN DN DP DF DG DG DG DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DN DN DN DN DP DP DP DE DE DE DE DN DN DN DN DN DN DN DN DP DP DF DN DN DN DN DN DN DN DN DN DN DN DN DP DP DN DN DP DP DP DP DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DE DG DN DN DN DN DN DP DN DN DN DN DN DN DP DP 16 25 50 100 3 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EC EC ED EF EH EH DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DN DN DN DN DP DP DP DE DE DE DE DN DN DN DN DN DN DN DN DN DN DP DF DG DG DG 10 4 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EC EC ED EF EH EH CF CF CF CF 200 8 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 100 Voltage Code K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 25 Rated Voltage (VDC) J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 50 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 16 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 10 D D 50 C C Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 100 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 25 Cap Code BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 16 Capacitance B B 200 3 200 4 50 8 100 2 50 1 100 5 25 3 25 4 16 8 10 2 16 1 10 5 200 3 50 25 4 10 508 & 758 109 - 919* 100 - 910* 101 - 181* 201 - 431* 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 123 153 183 223 273 333 393 473 563 683 823 104 C1206H 8 Capacitance Tolerance 0.5 & 0.75 pF 1.0 - 9.0 pF* 10 - 91 pF* 100 - 180 pF* 200 - 430 pF* 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 µF C0805H 1 16 Rated Voltage (VDC) C0603H 5 10 3 50 4 100 8 16 Capacitance C0402H Voltage Code 10 Case Size / Series Cap Code 5 1 8 4 3 5 1 2 8 4 3 5 1 C0402H BB BB BB BB BB BB BB BB BB BB BB C0603H C0805H C1206H *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) 4 3 5 Rated Voltage (VDC) 50 100 200 10 16 25 50 100 200 10 16 Rated Voltage (VDC) Voltage Code 8 4 Case Size / Series FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FB FC FE FG FH FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FC FF FG FH FM FB FB FB FB FB FB FB FB FB FB FC FC FC FC FC FF FF FF FF FG FG FG FG FG FC FC FE FF FB FB FB FB FB FB FE FE FF FG FH FM JJ JJ JJ JJ 2 8 4 3 5 1 2 FB FB FB FB FB FB FC FE FE FE FE FG FC FC FF FF FF FF FF FG FG FG GB GB GB GB GB GB GB GB GB GB GB GB GD GH GK GB GB GB GB GB GB GB GB GB GB GB GB GD GH GK GB GB GB GB GB GB GB GB GB GB GB GB GD GH GK GB GB GB GB GB GB GB GB GB GB GB GB GD GH GK GB GB GB GB GB GB GB GB GB GB GD GH GN 100 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FB FC FE FG FH 50 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FB FC FE FG FH 25 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 3 5 1 16 K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K 10 J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 200 G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G 100 F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F 50 D D 25 C C 16 Cap Code B B 2 Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 10 Capacitance 508 & 758 109 - 919* 100 - 910* 101 - 911* 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 474 1 200 8 200 2 100 1 100 5 50 3 50 4 25 8 25 2 16 1 10 5 200 3 Capacitance Tolerance 0.5 & 0.75 pF 1.0 - 9.1 pF* 10 - 91 pF* 100 - 910 pF* 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 µF 0.12 µF 0.15 µF 0.18 µF 0.22 µF 0.47 µF C2220H 4 25 Cap Code C1812H 8 16 Capacitance C1210H Voltage Code 10 Case Size / Series 3 5 1 2 8 4 C1210H C1812H C2220H *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity1 Plastic Quantity Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel BB CF DN DP DE DF DG EB EC ED EE EF EH FB FC FE FF FG FH FM GB GD GH GK GN JJ 0402 0603 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 2220 0.50±0.05 0.80±0.07 0.78±0.10 0.90±0.10 1.00±0.10 1.10±0.10 1.25±0.15 0.78±0.10 0.90±0.10 1.00±0.10 1.10±0.10 1.20±0.15 1.60±0.20 0.78±0.10 0.90±0.10 1.00±0.10 1.10±0.10 1.25±0.15 1.55±0.15 1.70±0.20 1.00±0.10 1.25±0.15 1.40±0.15 1.60±0.20 1.70±0.20 2.20±0.15 10,000 4,000 4,000 4,000 0 0 0 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 50,000 15,000 15,000 15,000 0 0 0 10,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2,500 2,500 2,500 4,000 4,000 2,500 2,500 2,500 2,000 4,000 4,000 2,500 2,500 2,500 2,000 2,000 1,000 1,000 1,000 1,000 1,000 500 0 0 0 0 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 10,000 10,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 2,000 Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity 1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2mm pitch option see “Tape & Reel Packaging Information”. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec1 Secure Packaging 2” x 2” Waffle Pack/ Tray3 N/A 2 7282/7292 Case Size EIA (in) Chip Thickness Packaging Quantities (pieces/unit packaging) (mm) Metric (mm) Minimum Maximum Minimum Maximum 0402 0603 0805 1206 1206 1005 1608 2012 3216 3216 1210 1808 1812 1825 2220 2225 3225 4520 4532 4564 5650 5664 368 368 100 126 50 All 50,000 ≤ 1.25 (nominal) > 1.25 (nominal) 1 All 1 20,000 80 50 42 20 20 20 The "Packaging C-Spec" is a 4-digit code which identifies the packaging type. When ordering, the proper code must be included in the 15th through 18th character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. 2 A packaging C-Spec (see note 1 above) is not required For "Bulk Bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. 3 Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection. 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0402 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1210 1 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 Only for capacitance values ≥ 22 µF Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). 1 Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax Termination Finish SnPb TP 100% Matte Sn Ramp-Up Rate (TL to TP) 100°C 150°C 60 – 120 seconds 3°C/second maximum 150°C 200°C 60 – 120 seconds 3°C/second maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum 6°C/second maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum TL Temperature Profile Feature tP Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec tL Tsmax Tsmin 25 ts 25ºC to Peak Time Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Product Qualification Test Plan Reliability/Environmental Tests per MIL–STD–202//JESD22 High Temperature Life Load Humidity Low Voltage Humidity Temperature Cycling Thermal Shock Moisture Resistance 200°C rated voltage 1,000 hours 85°C/85%RH rated voltage 1,000 hours 85°C/85%RH, 1.5 V, 1,000 hours −55°C to +200°C, 50 Cycles −55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 cycles Cycled Temp/RH 0 V, 10 cycles at 24 hours each Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429 Resistance to Solvents Mechanical Shock and Vibration Resistance to Soldering Heat Terminal Strength Board Flex Include Aqueous wash chemical, OKEM Clean or equivalent Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes 12 cycles Condition B, no per-heat of samples, Single Wave Solder Force of 1.8 kg for 60 seconds Appendix 2, Note: 3.0 mm (minimum) Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within the time frame outlined in the table below: Termination Finish Termination Finish Ordering Code1 Storage Life 100% Matte Tin (Sn) C 1.5 years upon receipt L 1.5 years upon receipt E 6 months upon receipt2 Gold (Au) 30 – 50 µin F 1.5 years upon receipt Gold (Au) 100 µin min. G 1.5 years upon receipt SnPb (5% Pb min.) Gold (Au) 1.97 – 11.8 µin 2 The fourteenth (14th) character position of the KEMET part number is assigned to identify and/or define the termination finish. For more information, see “Ordering Information” section of this document. 2 Gold plating option “E” devices should remain in its factory sealed moisture sensitive packaging during storage. If the factory sealed packaging is disturbed please store any remaining packaged components in a dry box container to prevent oxidation of the termination finish. 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Construction Detailed Cross Section Termination Finish: C = 100% Matte Sn L = SnPb - 5% Pb min E = Gold (Au) 1.97 - 11.8 µin F = Gold (Au) 30 - 50 µin G = Gold (Au) 100 µin min Barrier Layer (Ni) Dielectric Material (CaZrO3) Dielectric Material (CaZrO3) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (See options at left) Inner Electrodes (Ni) Capacitor Marking (Optional): Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel ® Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel 13" Reel Pitch (P1)* Punched Paper 7" Reel 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 & 2220 16 12 12 Array 0508 & 0612 8 4 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) Packaging Type/Options C-3190 C-3191 C-7081 C-7082 Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefits of Changing from 4 mm to 2 mm Pitching Spacing • Lower placement costs • Double the parts on each reel results in fewer reel changes and increased efficiency • Fewer reels result in lower packaging, shipping and storage costs, reducing waste © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. 1 Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 1.0 (0.039) 8 mm 12 mm D1 Minimum Note 1 1.5+0.10 −0.0 (0.059+0.004 −0.0) 16 mm R Reference S1 Minimum T Note 2 Note 3 Maximum T1 Maximum 25.0 (0.984) 1.75±0.10 4.0±0.10 2.0±0.05 (0.069±0.004) (0.157±0.004) (0.079±0.002) 1.5 (0.059) 30 (1.181) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) T2 W Maximum Maximum 3.5±0.05 4.0±0.10 2.5 8.3 (0.138±0.002) (0.157±0.004) (0.098) (0.327) 5.5±0.05 8.0±0.10 4.6 12.3 (0.217±0.002) (0.315±0.004) (0.181) (0.484) 7.5±0.05 12.0±0.10 4.6 16.3 (0.138±0.002) (0.157±0.004) (0.181) (0.642) F P1 A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (See Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) Maximum R Reference Note 2 0.75 (0.030) 25 (0.984) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum F P1 T Maximum W Maximum A0 B 0 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Maximum Rotation ( 20 10 5 Figure 5 – Bending Radius Embossed Carrier 16 mm Tape ° S) Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com R C1001_C0G_200C_SMD • 7/29/2016 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 19 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 20 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Waffle Tray Packaging Information – 2" x 2" w/ Static Protection Figure 9 – Waffle Tray Dimensions – Inches (Millimeters) M 0.10 (2.54) X 45° M3 M1 Y M2 X X A Z 0.156 +0.002/-0.003 (3.962 +0.051/-0.076) 0.098 (2.489) 0.086 (2.184) 2.000 ±0.004 SQ (50.800 ±0.102 SQ) 90° 0.004 (0.102) 1.800 ±0.004 SQ (45.720 ±0.102 SQ) 1.812 ±0.004 SQ (46.025 ±0.102 SQ) STANDARD RIB MATRIX © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 21 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 9A – Waffle Tray Dimensions – Inches Case Size EIA (in) 0402 0504 0603 0805 1005 12061,2 12061,3 1210 1808 1812 1825 2220 2225 Metric (mm) 1005 1210 1608 2012 2512 3216 3216 3225 4520 4532 4564 5650 5664 2" x 2" Waffle Tray Dimensions – Inches M ±0.003 0.175 0.235 0.175 0.232 0.230 0.194 0.250 0.217 0.271 0.271 0.318 0.318 0.318 M1 ±0.003 0.153 0.226 0.153 0.186 0.240 0.228 0.250 0.244 0.285 0.285 0.362 0.362 0.362 M2 ±0.002 0.077 0.172 0.077 0.181 0.190 0.193 0.375 0.215 0.286 0.286 0.424 0.424 0.424 M3 ±0.002 0.110 0.170 0.110 0.171 0.140 0.124 0.167 0.174 0.243 0.243 0.34 0.34 0.34 X ±0.002 0.073 0.080 0.073 0.062 0.060 0.067 0.100 0.110 0.150 0.150 0.24 0.24 0.24 Y ±0.002 0.042 0.090 0.042 0.092 0.110 0.130 0.200 0.145 0.200 0.200 0.32 0.32 0.32 Z ±0.003 0.041 0.055 0.041 0.036 0.075 0.065 0.070 0.080 0.075 0.075 0.032 0.032 0.032 A° ± 1/2° 7 5 7 10 5 5 5 5 5 5 5 5 5 MATRIX (X x Y) 16 X 23 10 X 10 16 X 23 10 X 10 12 X 9 14 X 9 10 X 5 10 X 8 7X6 7X6 5X4 5X4 5X4 Packaging Quantity (pcs/unit packaging) 368 100 368 100 108 126 50 80 42 42 20 20 20 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall" and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor. 2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches). 3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches). 1 Table 9B – Waffle Tray Dimensions – Millimeters Case Size EIA (in) 0402 0504 0603 0805 1005 12061,2 12061,3 1210 1808 1812 1825 2220 2225 Metric (mm) 1005 1210 1608 2012 2512 3216 3216 3225 4520 4532 4564 5650 5664 2" x 2" Waffle Tray Dimensions – Millimeters M ±0.08 4.45 5.97 4.45 5.89 5.84 4.93 6.35 5.51 6.88 6.88 8.08 8.08 8.08 M1 ±0.08 3.89 5.74 3.89 4.72 6.10 5.79 6.35 6.20 7.24 7.24 9.19 9.19 9.19 M2 ±0.05 1.96 4.37 1.96 4.60 4.83 4.90 9.53 5.46 7.26 7.26 10.77 10.77 10.77 M3 ±0.05 2.79 4.32 2.79 4.34 3.56 3.15 4.24 4.42 6.17 6.17 8.64 8.64 8.64 X ±0.05 1.85 2.03 1.85 1.57 1.52 1.70 2.54 2.79 3.81 3.81 6.10 6.10 6.10 Y ±0.05 1.07 2.29 1.07 2.34 2.79 3.30 5.08 3.68 5.08 5.08 8.13 8.13 8.13 Z ±0.08 1.04 1.40 1.04 0.91 1.91 1.65 1.78 2.03 1.91 1.91 0.81 0.81 0.81 A° ± 1/2° 7 5 7 10 5 5 5 5 5 5 5 5 5 MATRIX (X x Y) 16 X 23 10 X 10 16 X 23 10 X 10 12 X 9 14 X 9 10 X 5 10 X 8 7X6 7X6 5X4 5X4 5X4 Packaging Quantity (pcs/unit packaging) 368 100 368 100 108 126 50 80 42 42 20 20 20 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall" and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor. 2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches). 3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches). 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 22 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) KEMET Electronic Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/29/2016 23