Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC
(Automotive Grade)
Overview
Applications
KEMET’s Automotive Grade High Voltage surface mount
MLCCs in X7R Dielectric feature a 125°C maximum
operating temperature and are considered “temperature
stable.” The Electronics Industries Alliance (EIA)
characterizes X7R dielectric as a Class II material.
Components of this classification are fixed, ceramic
dielectric capacitors suited for bypass and decoupling
applications or for frequency discriminating circuits
where Q and stability of capacitance characteristics
are not critical. X7R exhibits a predictable change in
capacitance with respect to time and voltage and boasts a
minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±15% from
-55°C to +125°C.
• Charging stations
• LCD fluorescent backlight ballasts
• Voltage multiplier circuits
• DC/DC converters
• Power supply
• LAN/WAN interface
• High voltage decoupling
• Filters
• DC blocking
• ESD Protection
Whether under-hood or in-cabin, these capacitors are
designed to provide reliable performance in mission
and safety critical automotive circuits. Stricter testing
protocol and inspection criteria have been established for
automotive grade products in recognition of potentially
harsh environmental conditions. KEMET automotive
grade series capacitors meet the demanding Automotive
Electronics Council's AEC-Q200 qualification requirements.
Ordering Information
C
Ceramic
1210
154
K
C
R
A
C
AUTO
Case Size Specification/ Capacitance Capacitance Rated Voltage
Failure Rate/
Packaging/Grade
Dielectric
Termination Finish1
(L" x W")
Series
Code (pF)
Tolerance
(VDC)
Design
(C-Spec)
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
1
C
C = Standard
Two
significant
digits and
number of
zeros.
J = ±5%
K = ±10%
M = ±20%
C = 500
B = 630
D = 1,000
F = 1,500
G = 2,000
Z = 2,500
H = 3,000
R = X7R
A = N/A
C = 100% Matte Sn
See "Packaging
C-Spec Ordering
Options Table"
Additional termination finish options may be available. Contact KEMET for details.
Built Into Tomorrow
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
1
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Ordering Code (C-Spec)3
Packaging Type1
7" Reel
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
3
All automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking."
3
For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
1
Benefits
• AEC-Q200 automotive qualified
• −55°C to +125°C operating temperature range
• Industry-leading CV values
• Exceptional performance at high frequencies
• Lead (Pb)-free, RoHS and REACH compliant
• EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220 &
2225 case sizes
• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV,
2.5 KV, and 3 KV
• Capacitance offerings ranging from 10 pF to 560 nF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Low ESR and ESL
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
Application Note
X7R dielectric is not recommended for AC line filtering or pulse applications. These capacitors and/or the assembled circuit
board containing these capacitors may require a protective surface coating to prevent external surface arcing.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
2
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days Prior To
Implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days minimum
AUTO
Yes (without approval)
Yes
90 days minimum
1
1
Customer Notification Due To:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
PPAP Level
KEMET Automotive
C-Spec
1
2
3
4
5
KEMET assigned1
●
●
●
●
●
AUTO
1
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available with customer information included.
○ Product family PPAP only
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
3
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Dimensions – Millimeters (Inches)
L
W
B
T
S
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0.50 (0.020)
±0.05 (0.002)
0.30 (0.012)
±0.10 (0.004)
0.30 (0.012)
Solder Reflow
Only
1.60 (0.063)
±0.15 (0.006)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
4.70 (0.185)
±0.50 (0.020)
4.50 (0.177)
±0.30 (0.012)
4.50 (0.177)
±0.30 (0.012)
5.70 (0.224)
±0.40 (0.016)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
0.35 (0.014)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
5.60 (0.220)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
EIA Size
Code
Metric Size
Code
L
Length
W
Width
0402
1005
1.00 (0.040)
±0.05 (0.002)
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
1812
4532
1825
4564
2220
5650
2225
5664
T Thickness
See Table 2 for
Thickness
0.70 (0.028)
0.75 (0.030)
N/A
Solder wave or
Solder reflow
Solder reflow
only
0.60 (0.024)
±0.35 (0.014)
Qualification/Certification
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
4
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
−55°C to +125°C
Capacitance Change with Reference to
+25°C and 0 Vdc Applied (TCC)
±15%
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
3.0%
1
2
3
4
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit at 25°C
Insulation Resistance (IR) Minimum Limit at 25°C
See Dielectric Withstanding Voltage (DWV) Table
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
2.5%
See Insulation Resistance Limit Table
(500 VDC applied for 120 ±5 seconds at 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
12 0Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
4
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
1
2
DWV HV
EIA Case Size
500V
630V
≥ 1000V
0402
120% of rated
voltage
N/A
N/A
0603
0805
1206
1210
1808
150% of rated voltage
120% of rated
voltage
1812
1825
2220
2225
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
5
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
> 25
16/25
X7R
Capacitance
Shift
Insulation
Resistance
±20%
10% of Initial
limit
3.0
5.0
All
< 16
7.5
Insulation Resistance Limit Table (X7R Dielectric)
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
100 Megohm
Microfarads or 10 GΩ
0402
N/A
All
0603
N/A
All
0805
< 0.0039 µF
≥ .0039 µF
1206
< 0.012 µF
≥ 0.012 µF
1210
< 0.033 µF
≥ 0.033 µF
1808
< 0.018 µF
≥ 0.018 µF
1812
< 0.027 µF
≥ 0.027 µF
1825
< 0.120 µF
≥ 0.120 µF
2220
< 0.150 µF
≥ 0.150 µF
2225
< 0.180 µF
≥ 0.180 µF
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
6
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
500
630
1000
1500
2000
500
630
1000
1500
2000
500
630
1000
1500
2000
2500
3000
500
630
2500
630
3000
H
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
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DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
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DG
DG
DG
DG
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DG
DG
DG
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DG
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DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
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ED
ED
ED
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EF
EF
EF
EG
ED
ED
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ED
ED
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ED
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ED
ED
ED
ED
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ED
ED
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ED
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ED
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EF
EF
EG
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ED
ED
ED
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ED
ED
ED
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ED
ED
ED
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ED
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ED
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EF
EF
EG
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EF
EF
EF
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EG
EG
EG
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EG
EG
EG
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EG
EG
EG
EG
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EG
EG
EG
EG
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FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
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FM
FM
FM
FM
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FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FG
FM
FM
FK
FK
FK
FS
FS
FL
FL
FL
FL
FL
FL
FL
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
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FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
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FG
FG
FG
FG
FG
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FM
FM
FM
FM
FM
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FS
FS
FL
FL
FL
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FL
FL
FL
FL
FL
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FM
FM
FM
FM
FM
FM
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FM
FM
FM
FM
FM
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FM
FM
FM
FM
FM
FM
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FM
FM
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FG
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FG
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FG
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FM
FM
FM
FM
FM
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FS
FS
FL
FL
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FM
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FK
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FS
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FM
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FM
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FM
FM
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FM
FM
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FK
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FS
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FM
FM
FM
FM
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FK
FK
FK
FS
LB
LB
LB
LB
LB
LB
LB
LB
LB
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LB
LB
LB
LB
LB
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LB
LB
LB
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LB
LB
LB
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LA
LA
LA
LA
LA
LA
LA
LA
LA
LA
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LB
LB
LC
LC
LC
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LA
LA
LA
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LA
LA
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LB
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LB
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LB
LB
LB
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LB
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LA
LA
LA
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LA
LA
LA
LA
LB
LB
LB
LB
LB
LC
LC
LC
LA
LA
LA
LA
LA
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LB
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LB
LB
LB
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LB
LB
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LB
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LA
LA
LA
LA
LA
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LC
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LA
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LA
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LC
LC
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LB
LB
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LC
LC
LC
LC
LC
LA
LB
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LB
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LB
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LB
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LC
LC
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LC
LC
LC
LC
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LB
LB
LB
LC
LC
LC
LA
LB
LC
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LB
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LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LC
LC
LC
LC
LC
LC
LC
LC
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GH
GH
GH
GH
GH
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GB
GB
GB
GH
GH
GH
GH
GH
GK
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GB
GB
GB
GH
GH
GH
GH
GH
GK
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GB
GB
GD
GD
GD
GB
GB
GB
GB
GB
GH
GH
GH
GH
GK
GK
GK
GK
GK
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GD
GD
GH
GH
GH
GH
GH
GH
GH
GH
GK
GK
GM
GH
GK
GM
GM
GO
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GD
GH
GH
GK
GK
GH
GH
GH
GH
GK
GK
GK
GK
GM
GM
GO
GO
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GK
GK
GB
GB
GB
GH
GH
GK
GK
GK
GK
GK
3000
Z
2000
G
2500
F
2000
D
1500
B
1000
C
1500
H
1000
Z
630
G
500
F
3000
D
2500
B
2000
C
1500
G
630
F
1000
D
500
B
2000
C
1500
G
630
F
1000
D
500
B
1500
C
2000
D
630
B
1000
C
500
D
1000
C1812C2
500
C1808C
630
C1210C
1000
C1206C
B
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
630
C
1000
Cap
Voltage Code
C
Code
Case Size/
C0402C
Series
500
BB
BB
BD
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
CG CG CG DG
CG CG
DG
CG CG
DG
CG
DG
CG
DG
CG
DG
CG
DG
CG
DG
DG
DG
DG
DG
DG
DG
630
Cap
C
1000
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
C
500
10 pF
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
39 pF
43 pF
47 pF
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
91 pF
100 pF
110 pF
120 pF
130 pF
150 pF
180 pF
220 pF
270 pF
330 pF
390 pF
470 pF
560 pF
680 pF
820 pF
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
Voltage Code
Rated Voltage
(VDC)
Capacitance
Tolerance
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
Rated Voltage
(VDC)
500
Cap
Code
C0805C
500
Cap
Case Size/
C0402C C0603C
Series
500
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes)
B
D
C
B
D
C0603C
C0805C
C1206C
C1210C
C1808C
C1812C2
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
2
Available capacitance values available in X7R with KONNEKT Technology.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
7
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
2000
500
630
1000
1500
2000
B
D
F
G
Z
H
2500
1500
C
3000
630
1000
H
2500
500
Z
3000
G
D
F
G
Z
H
C1812C
2
1500
F
2000
D
2000
B
1000
C
1500
G
1000
F
500
D
630
B
GB
GB
GB
GH
GH
GH
GH
GH
GE
GB
GB
GE
GE
GF
GJ
GL
GS
GK
GK
GK
GB
GB
GB
GB
GB
GE
GE
GH
GK
GN
GK
GK
GK
GB
GB
GB
GC
GE
GE
GK
GJ
GH
GM
GM
GO
GO
500
C
630
G
2500
F
3000
D
C1812C2
3000
B
2000
500
C
1500
1000
D
630
500
B
1000
C
500
D
C1808C
630
B
C1210C
1000
C
630
C
H
C
B
C0603C
D
C0805C
C1206C
2500
B
2000
C
1500
G
630
F
LC LC
LE
LE
LA
LA
LA
LB
LB
LC
1000
D
LC
LE
LE
LA
LA
LA
LA
LA
LA
LC
LC
500
F
B
LA
LA
LA
LA
LC
LC
LC
LC
LA
LA
LA
LA
LB
2000
1500
C
630
D
FL
FM
FM
FK
FS
FS
1000
B
FL
FL
FM
FK
FH
FH
FK
FK
FS
500
C
FL
FL
FM
FK
FG
FG
FH
FH
FK
FK
FS
2000
D
FL
FL
FL
FM
FM
FK
FK
FG
FG
FH
FK
FK
FK
1500
B
EJ EJ
EJ EJ
EJ EJ
EJ
EJ
630
630
1000
C
EG
EJ
EJ
EJ
EJ
EJ
EJ
EJ
EJ
1000
500
Cap
Voltage Code
C
Code
Case Size/
C0402C
Series
1000
DG
DG
DG
500
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
500
Cap
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
Voltage Code
Rated Voltage
(VDC)
Capacitance
Tolerance
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
J K M
Rated Voltage
(VDC)
C1206C
630
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
C0805C
500
Cap
Code
Cap
Case Size/
C0402C C0603C
Series
500
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) cont.
G
C
B
D
F
G
Z
C1210C
C1808C
Table 1B – Capacitance Range/Selection Waterfall (1825–2225 Case Sizes)
HG
HG
HG
HG
HG
HG
HG
HG
Rated Voltage (VDC)
1000
1500
2000
Voltage Code
C
B
D
F
G
Case Size/Series
2500
3000
HG
HG
HG
HG
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JK
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JK
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JK
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KF
KF
KF
KE
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KF
KF
KF
KE
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KF
KF
KF
KE
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
H
1000
Z
630
G
500
F
3000
D
2500
Cap Code
B
2000
HG
HG
HG
HG
C
1500
HG
HG
HG
HG
H
1000
HG
HG
HG
HG
Z
630
HG
HG
HG
HG
G
500
HG
HG
HG
HG
HG
HG
HG
HG
F
3000
HG
HG
HG
HG
HG
HG
HE
HE
D
2500
HG
HG
HG
HG
HG
HG
HE
HE
B
2000
HG
HG
HG
HG
HG
HG
HE
HE
C
1500
HG
HG
HG
HG
HG
HG
HE
HE
H
1000
HG
HG
HG
HG
HG
HG
HE
HE
Z
630
HG
HG
HG
HG
HG
HG
HE
HE
G
500
630
101
111
121
131
151
181
221
271
331
391
471
561
681
821
Capacitance
Tolerance
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
F
3000
Rated Voltage (VDC)
D
2500
B
2000
C
1500
Voltage Code
C2225C
1000
Cap
Code
630
Capacitance
C2220C
500
100 pF
110 pF
120 pF
130 pF
150 pF
180 pF
220 pF
270 pF
330 pF
390 pF
470 pF
560 pF
680 pF
820 pF
C1825C
500
Capacitance
Case Size/
Series
Z
H
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
C1825C
C2220C
C2225C
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
2
Available capacitance values available in X7R with KONNEKT Technology.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
8
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Table 1B – Capacitance Range/Selection Waterfall (1825 – 2225 Case Sizes) cont.
2500
3000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
3000
2000
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HJ
HJ
HK
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HJ
HJ
HK
HE
HE
HG
HJ
HJ
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HJ
HJ
HK
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HE
HG
HJ
HJ
HK
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HJ
HJ
HK
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HJ
HJ
HK
HG
HG
HG
HG
HG
JE
JE
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JE
JE
JE
JE
JE
JE
JE
JE
JE
JK
JK
JK
JK
JL
JN
JN
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JE
JK
JL
JN
JN
JE
JE
JK
JL
JN
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JE
JK
JL
JN
JN
JK
JK
JK
JK
JE
JE
JE
JE
JE
JE
JE
JE
JE
JK
JK
JK
JK
JK
JK
JE
JK
JL
JL
JN
JK
JK
JK
JK
JE
JE
JE
JE
JK
JK
JK
JK
JL
JL
JL
JN
JN
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JK
JL
JL
JN
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JL
JL
JN
KE
KE
KE
KE
KF
KE
KE
KE
KE
KE
KE
KF
KF
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KH
KH
KJ
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KH
KH
KJ
KE
KF
KH
KH
KJ
KJ
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KH
KH
KJ
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KJ
KJ
KJ
KE
KF
KF
KF
KF
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KH
KJ
KJ
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KF
KH
KH
KJ
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KF
KH
KH
KJ
Rated Voltage (VDC)
3000
H
2500
Z
2500
G
2000
F
1500
D
1000
B
630
C
500
H
3000
Z
2500
G
2000
F
1500
D
1000
B
630
C
500
H
3000
Z
2500
Cap Code
G
2000
630
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
564
Capacitance
Tolerance
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
F
1500
Rated Voltage (VDC)
D
1500
B
1000
C
C2225C
1000
Voltage Code
C2220C
630
Capacitance
Cap
Code
500
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.56 µF
C1825C
500
Capacitance
Case Size/
Series
Voltage Code
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
Case Size/Series
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
C1825C
C2220C
C2225C
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
9
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
BD
CG
DG
ED
EF
EG
EJ
FG
FL
FH
FM
FK
FS
LE
LA
LB
LC
GB
GC
GE
GH
GF
GK
GJ
GN
GL
GM
GS
GO
HE
HG
HJ
HK
JE
JK
JL
JN
KE
KF
KH
KJ
0402
0402
0603
0805
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1808
1808
1808
1808
1812
1812
1812
1812
1812
1812
1812
1812
1812
1812
1812
1812
1825
1825
1825
1825
2220
2220
2220
2220
2225
2225
2225
2225
0.50 ± 0.05
0.55 ± 0.05
0.80 ± 0.10*
1.25 ± 0.15
1.00 ± 0.10
1.20 ± 0.15
1.60 ± 0.15
1.70 ± 0.20
1.25 ± 0.15
1.40 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
2.10 ± 0.20
2.50 ± 0.30
1.00 ± 0.10
1.40 ± 0.15
1.60 ± 0.15
2.00 ± 0.15
1.00 ± 0.10
1.10 ± 0.10
1.30 ± 0.10
1.40 ± 0.15
1.50 ± 0.10
1.60 ± 0.20
1.70 ± 0.15
1.70 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
2.10 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
10,000
10,000
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
50,000
50,000
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
2,000
2,000
2,500
2,000
2,000
2,000
2,000
1,000
2,500
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
500
500
500
1,000
1,000
500
500
1,000
1,000
500
500
1,000
1,000
500
500
0
0
0
10,000
10,000
10,000
8,000
8,000
10,000
8,000
8,000
8,000
8,000
4,000
10,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
2,000
2,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1
If ordering using the 2 mm Tape & Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
10
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
0402
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1005
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
1.50
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1808
4520
2.30
1.75
2.30
7.40
3.30
2.20
1.55
2.20
6.50
2.70
2.10
1.35
2.10
5.80
2.40
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
1825
4564
2.15
1.60
6.90
6.90
7.90
2.05
1.40
6.80
6.00
7.30
1.95
1.20
6.70
5.30
7.00
2220
5650
2.75
1.70
5.50
8.20
6.50
2.65
1.50
5.40
7.30
5.90
2.55
1.30
5.30
6.60
5.60
2225
5664
2.70
1.70
6.90
8.10
7.90
2.60
1.50
6.80
7.20
7.30
2.50
1.30
6.70
6.50
7.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
11
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. The KEMET recommended profile conditions for convection and IR reflow reflect the profile conditions of the
IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow
passes at these conditions.
Termination Finish
SnPb
TP
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
12
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Construction
Detailed Cross Section
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
Termination
Finish
(100% Matte Sn)
Dielectric
Material (BaTiO3)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination
Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
13
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Capacitor Marking (Optional)
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be
marked as an extra cost option. Marking is available
on most KEMET devices, but must be requested using
the correct ordering code identifier(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited
to the “K” character only.
Marking appears in legible contrast. Illustrated below
is an example of an MLCC with laser marking of “KA8”,
which designates a KEMET device with rated capacitance
of 100 µF. Orientation of marking is vendor optional.
KEMET
ID
2-Digit
Capacitance
Code
Laser marking option is not available on:
• C0G, ultra stable X8R and Y5V dielectric devices.
• EIA 0402 case size devices.
• EIA 0603 case size devices with flexible termination
option.
• KPS commercial and automotive grade stacked
devices.
• X7R dielectric products in capacitance values outlined
below.
EIA Case Size
Metric Size Code
Capacitance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
≤ 170 pF
≤ 150 pF
≤ 910 pF
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
14
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Capacitor Marking (Optional) cont.
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
Character
9
A
0.10
1.0
10
100
1,000
10,000
B
0.11
1.1
11
110
1,100
11,000
C
0.12
1.2
12
120
1,200
12,000
D
0.13
1.3
13
130
1,300
E
0.15
1.5
15
150
1,500
0
1
2
3
4
5
6
7
8
100,000
1,000,000
10,000,000
100,000,000
110,000
1,100,000
11,000,000
110,000,000
120,000
1,200,000
12,000,000
120,000,000
13,000
130,000
1,300,000
13,000,000
130,000,000
15,000
150,000
1,500,000
15,000,000
150,000,000
160,000,000
Capacitance (pF)
F
0.16
1.6
16
160
1,600
16,000
160,000
1,600,000
16,000,000
G
0.18
1.8
18
180
1,800
18,000
180,000
1,800,000
18,000,000
180,000,000
H
0.20
2.0
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
2.2
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M
0.30
3.0
30
300
3,000
30,000
300,000
3,000,000
30,000,000
300,000,000
N
0.33
3.3
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
3.6
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
3.9
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
4.3
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
470,000,000
S
0.47
4.7
47
470
4,700
47,000
470,000
4,700,000
47,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
5.6
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
6.2
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
6.8
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X
0.75
7.5
75
750
7,500
75,000
750,000
7,500,000
75,000,000
750,000,000
Y
0.82
8.2
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
2.5
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
3.5
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d
0.40
4.0
40
400
4,000
40,000
400,000
4,000,000
40,000,000
400,000,000
e
0.45
4.5
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.50
5.0
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.60
6.0
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.70
7.0
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t
0.80
8.0
80
800
8,000
80,000
800,000
8,000,000
80,000,000
800,000,000
y
0.90
9.0
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
15
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
punched paper carrier.
ET
KEM
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812
and 2220
16
12
12
Array 0612
8
4
4
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifications.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Double the parts on each reel results in fewer reel
changes and increased efficiency.
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
C1076_X7R_HV_AUTO_SMD • 12/12/2023
16
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
P0
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
ØD1
Cover Tape
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
R Reference S1 Minimum
T
Note 2
Note 3
Maximum
25.0
(0.984)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
(0.024)
30
(1.181)
E1
P0
P2
T1
Maximum
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
B1 Maximum
Note 4
4.35
Single (4 mm)
(0.171)
Single (4 mm)
8.2
and double (8 mm)
(0.323)
12.1
Triple (12 mm)
(0.476)
Pitch
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
4.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
5.5 ±0.05
8.0 ±0.10
(0.217 ±0.002) (0.315 ±0.004)
7.5 ±0.05
12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
17
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Bending
Radius
R
C1076_X7R_HV_AUTO_SMD • 12/12/2023
19
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
12.4 +2.0/−0.0
(0.488 +0.078/−0.0)
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
20
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
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Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Application Guide
Solder Fluxes and Cleaning
The use of water-soluble fluxes provides advantages of excellent solderability due to high activation. However, these fluxes
contain organic acids that can induce arcing under high DC or AC voltages. Notable problem areas are underneath the MLCC
where flux can be trapped between the ceramic material and PCB. It is therefore critical that PCBs are properly cleaned to
remove all flux residue to maintain reliability.
Coating for High Voltage MLCCs
For MLCC ratings ≥1500V, it is recommended to apply a conformal coating to MLCC to prevent surface arcing. To reduce
possibility of inducing cracks in the MLCC, select a coating with thermal expansions close to that of the MLCC.
Dielectric
CTE (ppm/°C)
Class II BaTiO3
10.7
Class I CaZrO3
9.8
Slits in PCB
It is recommended to apply a slit in the PCB under the MLCC to improve washing of flux residue that may get trapped
underneath. In some cases, it is not possible to slit entirely through the PCB due to underlying metal planes. It is also
acceptable to apply a recessed slit under the MLCC which will also promote cleaning.
• Recommended for case sizes ≥1206
• The width (w) of the slit should be 1mm
• Length of the slit should be as short as possible to prevent damaging the MLCC due to mechanical stress of the PCB.
• Slits also reduce the risk of solder balls under MLCC which decreased the creepage distance.
Solder Resist
If a slit cannot be applied as above, it is recommended to not use solder resist directly under the MLCC. The use of solder
resist material reduces the distance between MLCC ceramic material and PCB thus making it difficult to clean.
Solder Balls
Improper reflow techniques and/or improper washing can induce solder balls under or adjacent to the MLCC. Solder balls
reduce the creepage distance between the MLCC terminations and increase the risk of arcing or damage to the ceramic
material. To reduce the risk of solder balls:
• Follow KEMET’s solder recommendations as outlined in the datasheet.
• If performing a cleaning procedure, properly clean the PCB per KEMET’s cleaning recommendations.
• Add slit to the PCB as shown above.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
22
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
YAGEO Corporation and its affiliates do not recommend the use of commercial or automotive grade products for high reliability applications or manned space flight.
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 12/12/2023
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