Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric,
10 – 50 VDC (Commercial & Automotive Grade)
Overview
KEMET Power Solutions High Temperature (KPS HT)
stacked capacitors utilize a proprietary lead-frame
technology to vertically stack one or two multilayer
ceramic chip capacitors into a single compact surface
mount package. The attached lead-frame mechanically
isolates the capacitor(s) from the printed circuit board,
thereby offering advanced mechanical and thermal stress
performance. Isolation also addresses concerns for
audible, microphonic noise that may occur when a bias
voltage is applied. A two-chip stack offers up to double
the capacitance in the same or smaller design footprint
when compared to traditional surface mount MLCC
devices. Providing up to 10 mm of board flex capability,
KPS Series capacitors are environmentally friendly and
in compliance with RoHS legislation. Combined with X8L
dielectric, these devices are capable of reliable operation up
to 150°C and are well suited for high temperature filtering,
bypass and decoupling applications.
X8L exhibits a predictable change in capacitance with
respect to time and voltage, and boasts a minimal change in
capacitance with reference to ambient temperature up to 125°C.
Beyond 125°C, X8L displays a wider variation in capacitance.
Capacitance change is limited to ±15% from −55°C to +125°C and
+15, −40% from 125°C to 150°C.
In addition to Commercial grade, Automotive grade devices
are available and meet the demanding Automotive Electronics
Council's AEC-Q200 qualification requirements.
Benefits
• −55°C to +150°C operating temperature range
• Reliable and robust termination system
• EIA 1210 and 2220 case sizes
• DC voltage ratings of 10 V, 16 V, 25 V, and 50 V
• Capacitance offerings ranging from 0.47 μF up to 47 μF
• Available capacitance tolerances of ±10% and ±20%
• Higher capacitance in the same footprint
• Potential board space savings
• Advanced protection against thermal and mechanical stress
• Provides up to 10 mm of board flex capability
Ordering Information
C
Ceramic
2220
C
Case Size Specification/
(L"x W")
Series
1210
1812
2220
C = Standard
476
Capacitance
Code (pF)
Two significant
digits and
number of
zeros.
M
8
Rated
Capacitance
Voltage
Tolerance1
(VDC)
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
N
2
C
7186
Dielectric
FailureRate/
Design
Leadframe Finish2
Packaging/Grade
(C-Spec)
N = X8L
1 = KPS single
chip stack
2 = KPS double
chip stack
C = 100% Matte Sn
See “Packaging
C-Spec Ordering
Options Table”
Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance.
Single chip stacks ("1" in the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances.
2
Additional leadframe finish options may be available. Contact KEMET for details.
1
Built Into Tomorrow
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Ordering Code (C-Spec)2
Packaging Type1
Commercial Grade
7" Reel (Embossed Plastic Tape)/Unmarked
13" Reel (Embossed Plastic Tape)/Unmarked
7186
7289
Automotive Grade
7" Reel (Embossed Plastic Tape)/Unmarked
13" Reel (Embossed Plastic Tape)/Unmarked
AUTO
AUTO7289
The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".
2
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
1
Benefits cont.
• Reduces audible, microphonic noise
• Extremely low ESR and ESL
• Lead (Pb)-free, RoHS and REACH compliant
• Capable of Pb-free reflow profiles
• Non-polar device, minimizing installation concerns
• Tantalum and electrolytic alternative
• Commercial and Automotive (AEC-Q200) grades available
Applications
Typical applications include smoothing circuits, DC/DC converters, power supplies (input/output filters), noise reduction
(piezoelectric/mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits
without (integrated) current limitation and any application that is subject to extreme environments such as high temperature,
high levels of board flexure and/or temperature cycling. Markets include industrial, aerospace, automotive, and telecom.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days Prior To
Implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days minimum
AUTO
Yes (without approval)
Yes
90 days minimum
1
1
Customer Notification Due To:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
2
3
4
5
KEMET assigned1
●
●
●
●
●
AUTO
1
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
TOP VIEW
Single or Double Chip Stack
PROFILE VIEW
Double Chip Stack
Single Chip Stack
L
L
W
H
H
LW
Number
of Chips
EIA
Metric
Size Code Size Code
Single
Double
LW
L Length
W Width
H Height
LW Lead Width
3.50 (0.138)
±0.30 (0.012)
5.00 (0.197)
±0.50 (0.020)
6.00 (0.236)
±0.50 (0.020)
3.50 (0.138)
±0.30 (0.012)
2.60 (0.102)
±0.30 (0.012)
3.50 (0.138)
±0.50 (0.020)
5.00 (0.197)
±0.50 (0.020)
2.60 (0.102)
±0.30 (0.012)
3.35 (0.132)
±0.10 (0.004)
2.65 (0.104)
±0.35 (0.014)
3.50 (0.138)
±0.30 (0.012)
6.15 (0.242)
±0.15 (0.006)
5.00 (0.197)
−1.00/+0.50
(−0.040/+0.020)
5.00 (0.197)
±0.50 (0.020)
0.80 (0.032)
±0.15 (0.006)
1.10 (0.043)
±0.30 (0.012)
1.60 (0.063)
±0.30 (0.012)
0.80 (0.031)
±0.15 (0.006)
1210
3225
1812
4532
2220
5650
1210
3225
1812
4532
5.00 (0.197)
±0.50 (0.020)
3.50 (0.138)
±0.50 (0.020)
2220
5650
6.00 (0.236)
±0.50 (0.020)
5.00 (0.197)
±0.50 (0.020)
Mounting
Technique
Solder Reflow Only
1.10 (0.043)
±0.30 (0.012)
1.60 (0.063)
±0.30 (0.012)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
1
2
3
4
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit at 25°C
Insulation Resistance (IR) Minimum Limit at 25°C
−55°C to +150°C
±15% (−55ºC to 125ºC), +15, −40% (125ºC to 150ºC)
3.0%
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50 mA)
3.5% ( ≤ 16V) and 2.5% ( ≥ 25V)
500 megohm microfarads or 10 GΩ
(Rated voltage applied for 120±5 seconds at 25°C)
Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3
Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤ 10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance > 10µF
4
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
1
2
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Rated DC
Voltage
Dielectric
Capacitance
Value
≥ 25
X8L
Dissipation Factor
(Maximum %)
Insulation
Resistance
±20%
10% of
Initial Limit
3.0
All
≤ 16
Capacitance
Shift
5.0
Table 1 – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
Cap
Capacitance
Code
0.47 µF
1.0 µF
2.2 µF
3.3 µF
4.7 µF
10 µF
15 µF
22 µF
474
105
225
335
475
106
156
226
1.0 µF
2.2 µF
3.3 µF
4.7 µF
10 µF
22 µF
33 µF
47 µF
105
225
335
475
106
226
336
476
Cap
Capacitance
Code
Case Size/
Series
C1210C
C1812C
C2220C
Voltage Code
8
4
3
5
1
A
4
3
5
1
A
8
4
3
5
1
A
Rated Voltage (VDC)
Capacitance
Tolerance
10
16
25
50
100
250
16
25
50
100
250
10
16
25
50
100
250
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
M
M
M
M
M
M
M
M
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
Rated Voltage (VDC)
10
16
25
50
100
250
4
3
5
1
Voltage Code
8
4
3
5
1
A
16
25
50
100
Case Size/
Series
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
Single Chip Stack
FV
FV
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
A
10
16
25
50
100
250
250
8
4
3
5
1
A
Double Chip Stack
FW
FW
GR
C1210C
GR
GR
C1812C
C2220C
These products are protected under US Patent 8,331,078 other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
FV
FW
GR
JP
JR
1210
1210
1812
2220
2220
3.35 ± 0.10
6.15 ± 0.15
5.00 ± 0.50
3.50 ± 0.30
5.00 ± 0.50
0
0
0
0
0
0
0
0
0
0
600
300
400
300
200
2,000
1,000
1,700
1,300
800
Package quantity based on finished chip thickness specifications.
Table 3 – KPS Land Pattern Design Recommendations (mm)
Median (Nominal) Land
Protrusion
EIA SIZE
CODE
METRIC
SIZE
CODE
C
Y
X
V1
V2
1210
3225
1.50
1.14
1.75
5.05
3.40
2220
5650
2.69
2.08
4.78
7.70
6.00
V1
Y
Y
X
X
C
C
V2
Image at right based on an EIA 1210 case size.
Grid Placement Courtyard
KEMET’s KPS Series land pattern design recommendations have been evaluated through extensive internal testing and
validation. KPS lead frames are used to mechanically isolate the MLCC from the PCB and provide stress relief for increased
mechanical robustness. The land pattern dimensions for each EIA size code are designed to be encompassed within the end
terminations thus regulating solder wicking and maintaining lead frame flexibility. This design is optimized to enable durable
solder joint fillets which improve the mechanical integrity and reliability upon placement.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Soldering Process
To prevent degradation of temperature cycling capability,
care must be taken to prevent solder from flowing into
the inner side of the lead frames (inner side of "J" lead in
contact with the circuit board).
After soldering, the capacitors should be air cooled to
room temperature before further processing. Forced air
cooling is not recommended.
Hand soldering should be performed with care due to the
difficulty in process control. If performed, care should be
taken to avoid contact of the soldering iron to the capacitor
body. The iron should be used to heat the solder pad,
applying solder between the pad and the lead, until reflow
occurs. Once reflow occurs, the iron should be removed
immediately. (Preheating is required when hand soldering
to avoid thermal shock.)
Profile Feature
SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (TSmax)
150°C
200°C
Time (ts) from Tsmin to Tsmax)
60 – 120 seconds
60 – 120 seconds
Ramp-up Rate (TL to TP)
3°C/seconds maximum 3°C/seconds maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
250°C
Time within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum
10 seconds maximum
Ramp-down Rate (TP to TL)
Time 25°C to Peak
Temperature
6°C/seconds maximum 6°C/seconds maximum
6 minutes maximum
8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
TP
TL
Temperature
KEMET’s KPS Series devices are compatible with IR
reflow techniques. Preheating of these components is
recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for IR reflow reflect the
profile conditions of the IPC/J–STD–020D standard for
moisture sensitivity testing.
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex
JIS–C–6429
Appendix 2, Note: 5.0 mm minimum
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 250°C
Temperature Cycling
JESD22
Method JA–104
Biased Humidity
MIL–STD–202
Method 103
Moisture Resistance
Thermal Shock
High Temperature Life
Storage Life
Vibration
Mechanical Shock
Resistance to Solvents
MIL–STD–202
Method 106
MIL–STD–202
Method 107
MIL–STD–202
Method 108
MIL–STD–202
Method 108
MIL–STD–202
Method 204
MIL–STD–202
Method 213
MIL–STD–202
Method 215
1,000 cycles (−55°C to +150°C). Measurement at 24 hours ±4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required.
Measurement at 24 hours ±4 hours after test conclusion.
−55°C/+150°C. Note: Number of cycles required – 300, Maximum transfer time – 20
seconds, Dwell time – 15 minutes. Air – Air.
1,000 hours at 150°C with rated voltage applied.
150°C, 0 VDC for 1,000 hours.
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB .031" thick,
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz.
Figure 1 of Method 213, Condition F.
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Construction
Detailed Cross Section
Dielectric Material
(BaTiO3)
Leadframe
(Phosphor Bronze - Alloy 510)
Leadframe Attach
(High Melting Point Solder)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Dielectric Material
(BaTiO3)
Termination Finish
(Sn)
Termination Finish
(Sn)
Inner Electrodes
Barrier Layer
(Ni)
(Ni)
End Termination/
External Electrode
(Cu)
Product Marking
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Embossed Carrier
Embossment
12 mm (0.472”)
or
16 mm (0.629”)
Top Tape Thickness
0.10 mm (0.004”)
Maximum Thickness
180 mm (7.0”)
or
330 mm (13.0”)
Table 4 – Carrier Tape Configuration – Embossed Plastic (mm)
EIA Case Size
Tape Size (W)*
Pitch (P1)*
01005 – 0402
8
2
0603 – 1210
8
4
1805 – 1808
12
4
≥ 1812
12
8
KPS 1210
12
8
KPS 1812 & 2220
16
12
Array 0508 & 0612
8
4
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 5 for tolerance specifications.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
P0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
E1
F
K0
B1
S1
W
E2
B0
P1
T1
Center Lines of Cavity
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
ØD1
Cover Tape
User Direction of Unreeling
Table 5 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5+0.10/0.0−0.0
(0.059+0.004/−0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
E1
P0
P2
1.75±0.10
4.0±0.10
2.0±0.05
(0.069±0.004) (0.157±0.004) (0.079±0.002)
R Reference
Note 2
25.0
(0.984)
30
(1.181)
S1 Minimum
Note 3
T
Maximum
T1
Maximim
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
E2 Minimum
Note 4
4.35
6.25
(0.171)
(0.246)
8.2
10.25
(0.323)
(0.404)
12.1
14.25
(0.476)
(0.561)
F
P1
3.5±0.05
4.0±0.10
(0.138±0.002) (0.157±0.004)
5.5±0.05
8.0±0.10
(0.217±0.002) (0.315±0.004)
7.5±0.05
12.0±0.10
(0.138±0.002) (0.157±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0 , B 0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 3).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 3 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 4 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Bending
Radius
R
C1038_X8L_KPS_150C_SMD • 6/28/2021
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Figure 5 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059)
13.0+0.5/−0.2
(0.521+0.02/−0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4+1.5/−0.0
(0.331+0.059/−0.0)
12.4+2.0/−0.0
(0.488+0.078/−0.0)
16.4+2.0/−0.0
(0.646+0.078/−0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Figure 6 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 7 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 6/28/2021
15