C1812C204KDRLC7800

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Lead-free Overview KEMET's X7R with KONNEKT™ technology surface mount capacitors are designed for applications where higher capacitance and voltage are needed without requiring additional board space. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multichip solution for high density packaging. KEMET’s X7R dielectric features a 125°C maximum operating temperature and is considered temperature stable. The Electronics Components, Assemblies and Materials Association (EIA) characterizes X7R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequencydiscriminating circuits where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage, boasting a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from −55°C to +125°C. In addition to their use in power supplies, these capacitors can be used in industries related to automotive (hybrid), telecommunications, medical, military, aerospace, semiconductors and test/diagnostic equipment. Automotive Grade devices are also available which meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements For added reliability, KEMET's flexible termination technology is an available option that provides superior flex performance over standard termination systems. This technology was developed to address flex cracks, which are the primary failure mode of MLCCs and typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Flexible termination technology inhibits the transfer of board stress to the rigid body of the MLCC, therefore mitigating flex cracks which can result in low IR or short circuit failures. Benefits Applications • Commercial and Automotive Grade (AEC-Q200) • Industry-leading CV values • Capacitance offerings ranging from 2.4 nF – 20 µF • DC voltage ratings from 25 – 3,000 V • EIA 1812 and 2220 case sizes • Operating temperature range of −55°C to +125°C • Low ESR and ESL • Non-polar device, minimizing installation concerns • Lead (Pb)-free, RoHS, and REACH compliant • Surface mountable using standard MLCC reflow profiles • Flexible termination option available. • SMPS (Switch Mode Power Supplies) • Lighting ballasts, HID lighting • DC/DC Converters • Telecom equipment • Industrial and medical equipment • Filters • Snubbers • DC Blocking • Bypass Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Ordering Information C 1812 Ceramic C C 944 Case Size Specification/ Capacitance (L"x W") Series Code (pF) 1812 2220 C = Standard X = Flexible Termination Two single digits + number of zeros. K C R L C XXXX Orientation and Packaging (Suffix/C-Spec) Capacitance Tolerance Subclass Rated Dielectric Designation Voltage (V) Termination Finish K = ±10% M = ±20% 3 = 25 V 5 = 50 V 1 = 100 V 2 = 200 V A = 250 V C = 500 V B = 630 V D = 1,000 V F = 1,500 V G = 2,000 V Z = 2,500 V H = 3,000 V R= X7R C= 100% matte Sn L= KONNEKT See "Packaging and Orientation C-Spec Ordering Options Table" Additional termination finish options may be available. Contact KEMET for details. Packaging C-Spec Ordering Options Table Packaging Type Mounting Orientation1 Packaging/Grade Ordering Code (C-Spec) Commercial Grade 7" Reel/Unmarked TU 13" Reel/Unmarked 7210 Automotive Grade 7" Reel/Unmarked AUTO 13" Reel/Unmarked AUTO7210 1 All parts are shipped in standard orientation which refers to the positioning of the KONNEKT capacitors in the Tape and Reel pockets. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET product change notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence Process/Product change Obsolescence* Days Prior To Implementation KEMET assigned Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 1 Customer Notification Due To: KEMET Automotive C-Spec KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. PPAP (Product Part Approval Process) Level KEMET Automotive C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO 1 ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part number specific PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) Standard Mounting 2 Chips L W B T Number of Chips 2 2 EIA SIZE CODE 1812 2220 METRIC SIZE CODE TERMINATION L LENGTH W WIDTH Standard 4.50 (0.177) ±0.30 (0.012) 3.20 (0.126) ±0.30 (0.012) Flexible 4.50 (0.178) ±0.40 (0.016) 3.20 (0.126) ±0.30 (0.012) Standard 5.70 (0.224) ±0.40 (0.016) 5.00 (0.197) ±0.40 (0.016 Flexible 5.90 (0.232) ±0.75 (0.030) 5.00 (0.197) ±0.40 (0.016) 4532 5750 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T THICKNESS See Table 1A for Thickness See Table 1B for Thickness B BANDWIDTH 0.60 (0.024) ±0.35 (0.014) 0.70 (0.028) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014 0.70 (0.028) ±0.35 (0.014) Mounting Technique Solder Reflow Only Solder Reflow Only C1108_KONNEKT_X7R • 8/25/2021 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Table 1A - 1812 Product Ordering Codes, Ratings, and Package Quantities Thickness mm (inch) Typical Average Piece Weight (g) 25 V 3.30 (0.130) ±0.40 (0.16) 0.25 500 2,000 945 50 V 3.30 (0.130) ±0.40 (0.16) 0.25 500 2,000 6.6 µF 665 100 V 3.90 (0.153) ±0.40 (0.16) 0.28 275 1,050 C1812(a)944(b)2RLC(c) 0.94 µF 944 200 V 3.50 (0.138) ±0.30 (0.12) 0.25 500 2,000 C1812(a)944(b)ARLC(c) 0.94 µF 944 250 V 3.50 (0.138) ±0.30 (0.12) 0.25 500 2,000 C1812(a)664(b)CRLC(c) 0.66 µF 664 500 V 4.30 (0.169) ±0.20 (0.008) 0.30 250 1,000 C1812(a)304(b)BRLC(c) 0.3 µF 304 630 V 3.50 (0.138) ±0.40 (0.16) 0.25 500 2,000 C1812(a)204(b)DRLC(c) 0.2 µF 204 1,000 V 3.50 (0.138) ±0.30 (0.12) 0.25 500 2,000 C1812(a)663(b)FRLC(c) 0.066 µF 663 1,500 V 5.10 (0.201) ±0.40 (0.16) 0.35 200 900 C1812(a)203(b)GRLC(c) 0.044 µF 203 2,000 V 5.10 (0.201) ±0.40 (0.016) 0.35 200 900 C1812(a)942(b)ZRLC(c) 0.0094 µF 942 2,500 V 5.10 (0.201) ±0.40 (0.016) 0.35 200 900 C1812(a)242(b)HRLC(c) 0.0024 µF 242 3,000 V 3.50 (0.138) ±0.30 (0.12) 0.35 500 2,000 KEMET Part Number1 Capacitance Cap Code Voltage C1812(a)206(b)3RLC(c) 20 µF 206 C1812(a)945(b)5RLC(c) 9.4 µF C1812(a)665(b)1RLC(c) Number of Chips 2 Tape & Reel Quantity 7" Tape & 13" Tape & Reel Reel 1 Complete part number requires additional characters in the numbered positions provided in order to indicate capacitance tolerance and grade. For each numbered position, available options are as follows: (a) End Termination "C" or "X". (b) Capacitance tolerance character "K" or "M." (c) Product Grade: "TU" for Commercial or "AUTO" for Automotive © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Table 1B - 2220 Product Ordering Codes, Ratings, and Package Quantities KEMET Part Number1 Capacitance Cap Code Voltage C2220(a)206(b)5RLC(c) 20 µF 206 50 V C2220(a)205(b)1RLC(c) 2 µF 205 100 V C2220(a)205(b)2RLC(c) 2 µF 205 200 V C2220(a)205(b)ARLC(c) 2 µF 205 250 V C2220(a)944(b)CRLC(c) 0.94 µF 944 500 V C2220(a)664(b)BRLC(c) 0.66 µF 664 630 V C2220(a)244(b)DRLC(c) 0.24 µF 244 1,000 V C2220(a)164(b)FRLC(c) 0.16 µF 164 1,500 V C2220(a)443(b)GRLC(c) 0.044 µF 443 2,000 V C2220(a)303(b)ZRLC(c) 0.030 µF 303 2,500 V C2220(a)303(b)HRLC(c) 0.030 µF 303 3,000 V Number of Chips Thickness mm (inch) 2 4.90 (0.193) ±0.30 (0.11) 3.1 (0.122) ±0.30 (0.11) 3.1 (0.122) ±0.30 (0.11) 3.1 (0.122) ±0.30 (0.11) 5.1 (0.200) ±0.40 (0.016) 5.1 (0.200) ±0.40 (0.016) 5.1 (0.200) ±0.40 (0.016) 5.1 (0.200) ±0.40 (0.016) 5.1 (0.200) ±0.40 (0.016) 5.1 (0.200) ±0.40 (0.016) 5.1 (0.200) ±0.40 (0.016) Typical Average Piece Weight (g) Tape & Reel Quantity 7" Tape & Reel 13" Tape & Reel 0.78 225 900 0.47 500 1,925 0.47 500 1,925 0.47 500 1,925 0.81 300 1,250 0.80 300 1,250 0.80 300 1,250 0.79 300 1,250 0.80 300 1,250 0.80 300 1,250 0.80 300 1,250 1 Complete part number requires additional characters in the numbered positions provided in order to indicate capacitance tolerance and grade. For each numbered position, available options are as follows: (a) End Termination "C" or "X". (b) Capacitance tolerance character "K" or "M." (c) Product Grade: "TU" for Commercial or "AUTO" for Automotive © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Performance and Reliability: Test Methods and Conditions (Commercial Only) Test Reference Test Condition Limits Visual and Mechanical KEMET Internal No defects that may affect performance (10X) Dimensions according KEMET Spec Sheet C ≤ 10 µF 1 kHz ±50 Hz and 1.0 ±0.2 Vrms Capacitance (Cap) Dissipation Factor (DF) KEMET Internal KEMET Internal C > 10 µF 120 Hz ±10 Hz and 0.5 ±0.1 Vrms Within Tolerance Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours C ≤ 10 µF Frequency: 1 kHz ±50 Hz Voltage: 1.0 ±0.2 Vrms,0.5 ±0.2 Vrms C > 10 µF Frequency: 120 Hz ±10 Hz Voltage: 0.5 ±0.1 Vrms Within Specification EIA Case Size 1812 Rated DC Voltage ALL 2220 Capacitance Dissipation Factor (Maximum %) < 20 µF 2.5 20 µF 3.5 ALL 2.5 Within Specification To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. EIA Case Size Insulation Resistance (IR) KEMET Internal Apply rated voltage for 120 seconds at 25°C 1812 2220 Rated DC Voltage IR Limit 25 – 100 V 500 megaohm microfarads or 10 GΩ 200 – 250 V 1,000 megaohm microfarads or 100 GΩ 500 – 1,000 V 100 megaohm microfarads or 10 GΩ 1,500 – 3,000 V 1,000 megaohm microfarads or 100 GΩ 50 – 100 V 500 megaohm microfarads or 10 GΩ 200 – 250 V 1,000 megaohm microfarads or 100 GΩ 500 – 630 V 100 megaohm microfarads or 10 GΩ 1,000 – 3,000 V 1,000 megaohm microfarads or 100 GΩ C ≤ 10µF Frequency: 1 kHz ±50 Hz Voltage*: 1.0 ±0.2 Vrms Temperature Coefficient of Capacitance (TCC) C > 10µF Frequency: 120 Hz ±10 Hz Voltage: 0.5 ±0.1 Vrms KEMET Internal * See part number specification sheet for voltage Step Temperature (°C) 1 +25°C 2 −55°C 3 +25°C (Reference) 4 +125°C © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Capacitance ±15% over −55°C to +125°C C1108_KONNEKT_X7R • 8/25/2021 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Performance and Reliability: Test Methods and Conditions (Commercial Only) cont. Test Dielectric Withstanding Voltage (DWV) Reference Test Condition KEMET Internal Rated DC Voltage DWV Voltage (% of Rated) < 500 250% 500/630 150% ≥ 1,000 120% Limits Cap: Initial Limit DF: Initial Limit IR: Initial Limit Withstand test voltage without insulation breakdown or damage. (5 ±1 seconds and charge/discharge not exceeding 50 mA) Aging Rate (Maximum % Capacitance Loss/Decade Hour) KEMET Internal Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. Please refer to a part number specific datasheet for referee time details. 3% Loss/Decade Hour Shear stress test per specific case size, Time: 60±1 seconds Terminal Strength KEMET Internal Case Size 1812 2220 Board Flex AEC-Q200-005 Solderability KEMET Custom Test Temperature Cycling JESD22 Method JA-104 Force No evidence of mechanical damage 18N Standard Termination System 2.0 mm Flexible Termination System 3.0 mm Test time: 60± 5 seconds Ramp time: 1 mm/second 1. Board shear – SAC305 solder. Shear force of 1.8 kg (minimum) 2. Wetting balance – IEC 60068–2–69 1,000 cycles (−55°C to +125°C) 2 – 3 cycles per hour Soak Time 1 or 5 minutes © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com No evidence of mechanical damage Visual Inspection. 95% coverage on termination. No leaching Measurement at 24 hours ±4 hours after test conclusion. Cap: Initial Limit DF: Initial Limit IR: Initial Limit C1108_KONNEKT_X7R • 8/25/2021 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Performance and Reliability: Test Methods and Conditions (Commercial Only) cont. Test Biased Humidity Reference MIL-STD-202 Method 103 Test Condition Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Limits Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits Cap: ±20% shift IR: 10% of Initial Limit DF Limits Maximum (%) Initial Post 2.5 3.0 3.5 5.0 Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits Cap: ±20% shift IR: 10% of Initial Limit Moisture Resistance Thermal Shock MIL-STD-202 Method 106 MIL-STD-202 Method 107 High Temperature Life Number of cycles required 10, 24 hours per cycle. Steps 7a and 7b not required. Number of cycles required 5, (−55°C to 125°C) Dwell time 15 minutes. 1,000 hours at 125°C with 1.0 X rated voltage applied Initial Post 2.5 3.0 3.5 5.0 Cap: Initial Limit DF: Initial Limit IR: Initial Limit Within Post Environmental Limits Cap: ±20% shift IR: 10% of Initial Limit DF Limits Maximum (%) MIL-STD-202 Method 108 Storage Life DF Limits Maximum (%) 1,000 hours at 125°C, Unpowered © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Initial Post 2.5 3.0 3.5 5.0 C1108_KONNEKT_X7R • 8/25/2021 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Performance and Reliability: Test Methods and Conditions (Commercial Only) cont. Test Reference Test Condition Limits Vibration MIL-STD-202 Method 204 5 g's for 20 minutes, 12 cycles each of 3 orientations. Test from 10 – 2,000 Hz Cap: Initial Limit DF: Initial Limit IR: Initial Limit Mechanical Shock MIL-STD-202 Method 213 1,500 g’s 0.5 ms Half-sine, Velocity Change 15.4 feet/second (Condition F) Cap: Initial Limit DF: Initial Limit IR: Initial Limit Resistance to Solvents MIL-STD-202 Method 215 Add Aqueous wash chemical OKEMCLEAN (A 6% concentrated Oakite cleaner) or equivalent. Do not use banned solvents. Visual Inspection 10X Readable marking, no decoloration or stains. No physical damage. Environmental Compliance Lead-free Lead (Pb)-free, RoHS, and REACH compliant without exemptions. Land Pattern Design Recommendations per IPC-7351 (mm) Chip Number 2 2 Mounting Standard Standard EIA SIZE CODE 1812 2220 METRIC SIZE CODE 4532 5750 Median (Nominal) Land Protrusion END TERMINATION C Y X V1 V2 Standard 2.05 1.40 3.50 6.00 4.00 Flexible 2.00 1.60 3.50 6.10 4.00 Standard 2.65 1.50 5.40 7.30 5.90 Flexible 2.75 1.90 5.40 7.90 5.90 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Soldering Process Recommended Reflow Soldering Profile KEMET's KONNEKT family of high density surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with convection and IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Termination Finish TP 100% matte Sn 150°C 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time Above Liquidous (tL) 60 – 150 seconds Peak Temperature (TP) 260°C Time Within 5°C of Maximum Peak Temperature (tP) 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Hand Soldering and Removal of KONNEKT Capacitors The preferred method of attachment for KEMET’s KONNEKT Capacitors is IR or convection reflow where temperature, time and air flow are well controlled. However, it is understood that the manual attachment of KONNEKT capacitors is necessary for prototype and lab testing. In these instances, care must be taken not to introduce excessive temperature gradients in the KONNEKT part type that may lead to cracking in the ceramic or separation of the TLPS material. Please see KEMET's KONNEKT Soldering Guidelines here. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years upon receipt. Construction – Standard Termination Detailed Cross Section Termination Finish (100% matte Sn) Dielectric Material (BaTiO3) Bonding Material (See Image Below) Dielectric Material (BaTiO3) Barrier Layer (Ni) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Termination Finish (100% matte Sn) C1108_KONNEKT_X7R • 8/25/2021 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Construction – Flexible Termination Bonding Material MLCC CuSn TLPS MLCC © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers X7R with KONNEKT technology capacitors packaged in 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. Bar code label Anti-static reel KONNEKT Standard orientation in pocket ® ET KEM Embossed plastic carrier Sprocket holes 16 mm carrier tape Embossment cavity Anti-static cover tape (0.10 mm (0.004") maximum thickness) 180 mm (7.00") or 330 mm (13.00") Table 4 – Carrier Tape Configuration, Embossed Plastic (mm) EIA Case Size KONNEKT 1812 KONNEKT 2220 Number of Chips 2 2 Chip Thickness Tape Size (W)1 ≤ 3.5 mm > 3.5 mm ≤ 3.5 mm >5.0 mm & ≤ 5.3 mm > 3.5 mm ≤ 5.0 16 16 Embossed Plastic 7" Reel 13" Reel Pitch (P1)2 8 8 12 12 8 8 12 12 1. Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. 2. Refer to Tables 4 and 5 for tolerance specifications. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 ØD1 Cover Tape User Direction of Unreeling Table 5 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 D1 Minimum Note 1 E1 P0 P2 R Reference Note 2 16 mm 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 1.5 (0.059) 1.75±0.10 (0.069±0.004) 4.0±0.10 (0.157±0.004) 2.0±0.05 (0.079±0.002) 30 (1.181) S1 Minimum T T1 Note 3 Maximum Maximum 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Case Size Number of Chips Tape Size 1812 2 16 mm 2220 2 16 mm Pitch Triple (12mm) Double (8mm) Triple (12mm) Double (8mm) B1 Maximum Note 4 7.9 (0.311) 7.5 (0.295) 8.5 (0.335) 9.2 (0.363) E2 Minimum 14.25 (0.561) 14.25 (0.561) F P1 12.0±0.10 (0.472±0.004) 7.5±0.05 (0.138±0.002) 8.0±0.10 (0.315±0.004) 12.0±0.10 (0.472±0.004) 7.5±0.05 (0.138±0.002) 8.0±0.10 (0.315±0.004) T2 Maximum W Maximum A0,B0 & K0 6.5 (0.256) 16.3 (0.642) Note 5 6.5 (0.256) 16.3 (0.642) Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied. See EIA Document 481, Paragraph 4.3 (b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) For KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) ° s Typical Component Centerline Ao Tape Width (mm) 8,12 16 – 56 72 – 200 Maximum Rotation ( 20 10 5 ° S) Figure 3 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape 1.0 mm maximum 1.0 mm maximum © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Figure 5 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 6 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 16 mm 178±0.20 (7.008±0.008) or 330±0.20 (13.000±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) Variable Dimensions — Millimeters (Inches) Tape Size 16 mm N Minimum See Note 2, Tables 2-3 50 (1.969) W1 W2 Maximum W3 16.4 +2.0/−0.0 (0.646 +0.078/−0.0) 22.4 (0.882) Shall accommodate tape width without interference © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 7 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1108_KONNEKT_X7R • 8/25/2021 19