C1825C200KFRAC

CERAMIC CHIP / HIGH VOLTAGE KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin (Sn) plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering applications. An insulating coating may be required to prevent surface arcing. These components are RoHS compliant. APPLICATIONS Applications • Switch Mode Power Supply • Input Filter • Resonators • Tank Circuit • Snubber Circuit • Output Filter • High Voltage Coupling • High Voltage DC Blocking • Lighting Ballast • Voltage Multiplier Circuits • Coupling Capacitor/CUK MARKETS Markets • Power Supply • High Voltage Power Supply • DC-DC Converter • LCD Fluorescent Backlight Ballast • HID Lighting • Telecommunications Equipment • Industrial Equipment/Control • Medical Equipment/Control • Computer (LAN/WAN Interface) • Analog and Digital Modems • Automotive OUTLINE DRAWING Outline Drawing W T S ELECTRODES L B TIN PLATE NICKEL PLATE TABLE 1 - DIMENSIONS - MILLIMETERS (in.) Metric Code 2012 3216 3225 4520 4532 4564 5650 5664 EIA Size Code 0805 1206 1210 1808 1812 1825 2220 2225 L - Length 2.0 (0.079) ± 0.2 (0.008) 3.2 (0.126) ± 0.2 (0.008) 3.2 (0.126) ± 0.2 (0.008) 4.5 (0.177) ± 0.3 (0.012) 4.5 (0.177) ± 0.3 (0.012) 4.5 (0.177) ± 0.3 (0.012) 5.6 (0.224) ± 0.4 (0.016) 5.6 (0.224) ± 0.4 (0.016) W - Width 1.2 (0.049) ± 0.2 (0.008) 1.6 (0.063) ± 0.2 (0.008) 2.5 (0.098) ± 0.2 (0.008) 2.0 (0.079 ± 0.2 (0.008) 3.2 (0.126) ± 0.3 (0.012) 6.4 (0.250) ± 0.4 (0.016) 5.0 (0.197) ± 0.4 (0.016) 6.4 (0.250) ± 0.4 (0.016) B - Bandwidth 0.5 (0.02 ±0.25 (0.010) 0.5 (0.02) ± 0.25 (0.010) 0.5 (0.02) ± 0.25 (0.010) 0.6 (0.024) ± 0.35 (0.014) 0.6 (0.024) ± 0.35 (0.014) 0.6 (0.024) ± 0.35 (0.014) 0.6 (0.024) ± 0.35 (0.014) 0.6 (0.024) ± 0.35 (0.014) Band Separation 0.75 (0.030) N/A N/A N/A N/A N/A N/A N/A ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 81 Ceramic Surface Mount CONDUCTIVE METALLIZATION CERAMIC CHIP / HIGH VOLTAGE C0G DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.) Series Cap pF Capacitance Tolerance Max Thickness (in) Cap Code/ Voltage p 0805 0.050 0.050 0.065 1206 0.065 0.065 0.065 0.101 1210 0.101 0.101 0.101 0.080 0.080 1808 0.080 0.080 g 1812 0.080 0.067 0.067 0.067 0.067 0.067 0.067 0.067 0.067 1825 0.067 0.067 0.067 0.067 0.067 0.067 2220 0.067 0.067 0.067 0.067 0.067 0.067 2225 0.067 0.067 2000 0.080 0.067 2500 1000 1000 1500 2000 1000 1500 2000 1000 1500 2000 2500 3000 1000 1500 2000 2500 3000 1000 1500 2000 2500 3000 1000 1500 2000 2500 3000 1000 1500 1.0-2.4 2.7-5.1 5.6-9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 10,000 C,D C,D K,M C,D J,K,M C,D J,K,M C,D J,K,M C,D J,K,M C,D J,K,M C,D G,J,K,M C,D G,J,K,M C,D G,J,K,M C,D G,J,K,M C,D G,J,K,M C,D G,J,K,M D,F,G,J,K,M D,F,G,J,K,M D,F,G,J,K,M D,F,G,J,K,M D,F,G,J,K,M D,F,G,J,K,M D,F,G,J,K,M D,F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M F,G,J,K,M 109-249 279-519 569-919 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 101 111 121 131 151 161 181 201 221 241 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 3000 500 500 500 500 500 500 500 500 * 0.067 * Contact KEMET Sales Representative for C, D, F & G Capacitance Tolerance availability. Note: Actual thickness dimensions may be less than stated maximum. Check the KEMET website, www.kemet.com, for additional values and chip sizes available. 82 ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 Ceramic Surface Mount CERAMIC CHIP / HIGH VOLTAGE X7R DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.) Series Cap pF Capacitance Tolerance Max Thickness (in) Cap Code/ Voltage p 0805 0.050 0.050 0.065 1206 0.065 0.065 0.065 0.080 1210 0.080 0.080 0.080 0.080 0.080 g 1808 0.080 0.080 0.080 0.067 0.067 1812 0.067 0.067 0.067 0.067 0.067 0.067 1825 0.067 0.067 0.067 0.067 0.067 0.067 2220 0.067 0.067 0.067 0.067 0.067 0.067 2225 0.067 0.067 0.067 2500 0.067 3000 1000 1000 1500 2000 1000 1500 2000 1000 1500 0.080 2000 2500 3000 1000 1500 2000 2500 3000 1000 1500 2000 2500 3000 1000 1500 2000 2500 3000 1000 1500 Note: Actual thickness dimensions may be less than stated maximum. Check the KEMET website, www.kemet.com, for additional values and chip sizes available. KEMET HIGH VOLTAGE SURFACE MOUNT CHIP (VOLTAGE CODES C,D,F,G,H, and Z) THICKNESS AND REELING QUANTITIES Chip size EIA 0805 1206 1210 1808 1812/1813 1825 2220 2225 Metric 2012 3216 3225 4520 4532 4564 5650 5664 Max. Thickness (in) 0.055 0.065 0.101 0.080 0.067 0.067 0.067 0.067 Max. Thickness (mm) 1.27 1.65 2.57 2.03 1.70 1.70 1.70 1.70 Tape Width (mm) 8 8 8 12 12 12 12 12 Qty per Reel Qty per Reel 7" Plastic 13" Plastic 2,500 10,000 2,000 8,000 2,000 8,000 1,000 4,000 1,000 4,000 1,000 4,000 1,000 4,000 1,000 4,000 ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 83 Ceramic Surface Mount 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2000 2200 2700 3300 3900 4700 5600 6800 8200 10,000 12,000 15,000 18,000 22,000 27,000 33,000 39,000 47,000 56,000 62,000 68,000 82,000 100,000 120,000 150,000 180,000 220,000 J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M J,K,M 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 101 111 121 131 151 181 221 271 331 391 471 561 681 821 102 122 152 182 202 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 623 683 823 104 124 154 184 224 2000 500 500 500 500 500 500 500 500 CERAMIC CHIP / HIGH VOLTAGE CAPACITOR ORDERINGInformation Capacitor Ordering INFORMATION C Style Style C - Ceramic Chip Size Chip Size 0805; 1206; 1210; 1808; 1812; 1825; 2220; 2225 Specification Specification C - Standard Capacitance Code, pF Capacitance Code, pF First two digits represent significant figures. Third digit specifies number of zeros. 100 pF = 101. (Use “9” for 1.0 through 9.9 pF) (Use “8” for 0.1 through .99 pF) Capacitance Tolerance Capacitance Tolerance C = ±0.25pF* J = ±5% D = ±0.5pF* K = ±10% F = ±1%* M = ±20% G = ±2%* * Contact KEMET Sales for availability. 0805 C 102 K C R A C End Metallization Metallization C = Standard Failure Rate Level Failure A = Not Applicable Temperature Characteristic Characteristic Designated by Capacitance Change over Temperature Range G – (C0G) (±30ppm/C) (-55°C +125°C) R – X7R (±15%) (-55°C +125°C) C = 500V D = 1000V F = 1500V Voltage G = 2000V Z = 2500V H = 3000V ELECTRICAL PARAMETERS Electrical Parameters Property Capacitance Cap Tolerance DF Voltage Ratings Operating Temperature Range 25ºC IR @ 500V 125ºC IR @ 500V -55ºC TCC +125ºC TCC Dielectric Strength Ripple Current Specification C0G: 1 pF to 0.010 µF X7R: 10 pF to 0.22 µF pf 25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only) C0G: C*, D*, F*, G*, J, K, M * Contact KEMET Sales for availability. X7R: J, K, M C0G: 0.1% Max X7R: 2.5% Max 500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V From -55ºCto +125C -55C to +125ºC 100 GΩ or 1000 MΩ-µF, whichever is less 10 GΩ or 100 MΩ-µF, whichever is less X7R: + 15% C0G: + 30 ppm / ºC 150% of Rated Voltage for Rated Voltage =1000V Consult KEMET Sales Representative MARKING Marking These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost. Details on the marking format is located on page 97. Packaging PACKAGING KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk bag as outlined on page 83. Please consult factory for waffle packaging options. SOLDERING Process Soldering PROCESS The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of the termination. Recommended Solder PAD DIMENSIONS RECOMMENDED SOLDERPad Dimensions Chip Size 0805 1206 1210 1808 1812 1825 2220 2225 T (Total Length) mm 3.30 4.50 4.50 5.90 5.90 5.90 7.00 7.00 in. 0.130 0.177 0.177 0.232 0.232 0.232 0.276 0.276 S (Separation mm 0.70 1.50 1.50 2.30 2.30 2.30 3.30 3.30 in. 0.028 0.059 0.059 0.091 0.091 0.091 0.130 0.130 W (Pad Width) mm 1.60 2.00 2.90 2.40 3.70 6.90 5.50 6.80 in. 0.063 0.079 0.114 0.094 0.146 0.272 0.217 0.268 L (Pad Length) mm 1.30 1.50 1.50 1.80 1.80 1.80 1.85 1.85 in. 0.051 0.059 0.059 0.071 0.071 0.071 0.073 0.073 84 ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 CERAMIC CHIP CAPACITORS Packaging Information Tape & Reel Packaging KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm and 12mm plastic tape on 7" and 13" reels in accordance with EIA standard 481-1: Taping of surface mount components for automatic handling. This packaging system is compatible with all tape fed automatic pick and place systems. See page 78 for details on reeling quantities for commercial chips and page 87 for MIL-PRF-55681 chips. g handling. This packaging system is compatible with all tape fed automatic pick and place systems. See page 81 for details on reeling quantities for commercial chips and page 90 for MIL-PRF-55681 chips. Anti-Static Reel Embossed Carrier* 0402 and 0603 case sizes available on punched paper only. Chip Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military) ® KE ME T Embossment 8mm ±.30 (.315 ±.012") or 12mm ±.30 (.472 ±.012") 178mm (7.00") or 330mm (13.00") Anti-Static Cover Tape (.10mm (.004") Max Thickness) * Punched paper carrier used for 0402 and 0603 case size. SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM Grid Grid placement courtyard Placement Reflow Solder Dimension 0402 0603 0805 1206 1210 1812 1825 2220 2225 Z 2.14 2.78 3.30 4.50 4.50 5.90 5.90 7.00 7.00 G 0.28 0.68 0.70 1.50 1.50 2.30 2.30 3.30 3.30 X Y(ref) C(ref) 0.74 0.93 1.21 1.08 1.05 1.73 1.60 1.30 2.00 2.00 1.50 3.00 2.90 1.50 3.00 3.70 1.80 4.10 6.90 1.80 4.10 5.50 1.85 5.15 6.80 1.85 5.15 Z 3.18 3.70 4.90 4.90 G Wave Solder X 0.80 1.10 1.40 2.00 Y(ref) Smin 1.25 1.50 1.70 1.70 1.93 2.20 3.20 3.20 Not Recommended Courtyard C C 0.68 0.70 1.50 1.50 X X Not Recommended GG Y Z Z Y Calculation Formula Z = Lmin + 2Jt + Tt G = Smax - 2Jh -Th X = Wmin + 2Js + Ts Tt, Th, Ts = Combined tolerances ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 93 Packaging TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 Newton to 1.0 Newton (10g to 100g) 12 mm 0.1 Newton to 1.3 Newton (10g to 130g) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13") reels (with C-7280). Note that 13” reels are preferred. 4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556. Embossed Carrier Tape Configuration: Figure 1 Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern) Constant Dimensions — Millimeters (Inches) Tape Size 8 mm and 12 mm D0 E P0 4.0 ±0.10 (0.157 ±0.004) P2 2.0 ±0.05 (0.079 ±0.002) T Max 0.600 (0.024) T1 Max 0.100 (0.004) 1.5 1.75 ±0.10 +0.10 -0.0 (0.059 (0.069 ±0.004) +0.004, -0.0) Pitch Single (4 mm) B1 Max. Note 1 4.4 (0.173) 12 mm Double (8 mm) 8.2 (0.323) D1 Min. Note 2 1.0 Variable Dimensions — Millimeters (Inches) Tape Size 8 mm F 3.5 ±0.05 P1 4.0 ±0.10 R Min. Note 3 25.0 T2 Max 2.5 (0.098) W 8.0 ±0.30 (.315 ±0.012) A0B0K0 Note 4 (0.039) (0.138 ±0.002) 1.5 5.5 ±0.05 (0.059) (0.217 ±0.002) (0.157 ±0.004) (0.984) 8.0 ±0.10 30.0 (0.315 ±0.004) (1.181) 4.6 12.0 ±0.30 (0.181) (0.472 ±0.012) NOTES 1. B1 dimension is a reference dimension for tape feeder clearance only. 2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2) 4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not protrude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm maximum in the pocket (not applicable to vertical clearance.) 94 ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS Packaging Information Embossed Carrier Tape Configuration (cont.) 20° Sketch D: Tape Camber (Top View) 1mm (0.039) Max. 250mm (9.843) Allowable camber to be 1 mm/250 mm. 1mm (0.039) Max. 400mm (15.75) Min. Figure 2: Tape Leader & Trailer Dimensions (Metric Dimensions Will Govern) Figure 3: Reel Dimensions (Metric Dimensions will govern) Table 2 – REEL DIMENSIONS (Metric will govern) Tape Size 8 mm A Max 330.0 (12.992) B* Min 1.5 (0.059) C 13.0 ± 0.20 (0.512 ± 0.008) D* Min 20.2 (0.795) N Min 50.0 (1.969) See Note 3 Table 1 W1 8.4 +1.5, -0.0 (0.331 +0.059, -0.0) 12.4 +2.0, -0.0 (0.488 +0.078, -0.0) W2 Max 14.4 (0.567) W3 7.9 Min (0.311) 10.9 Max (0.429) 11.9 Min (0.469) 15.4 Max (0.606) 12 mm 330.0 (12.992) 1.5 (0.059) 13.0 ± 0.20 (0.512 ± 0.008) 20.2 (0.795) 18.4 (0.724) ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 95 Packaging CERAMIC CHIP CAPACITORS Packaging Information Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only): T P0 D0 Top Tape Cover P2 10 pitches cumulative tolerance on tape ±0.2 (±0.008) E Bottom Tape Cover A0 B0 G2 Max. Cavity Size See Note 1 Table 1 F W T1 User Direction of Feed P1 Center lines of cavity Table 1: 8 & 12mm Punched Tape (Metric Dimensions Will Govern) Constant Dimensions - Millimeters (Inches) Tape Size D0 E P0 P2 T1 G1 G2 R Min. 8mm 1.5 1.75 ±0.10 4.0 ± 0.10 2.0 ± 0.05 0.10 0.75 0.75 25 (.984) and +0.10, -0.0 (.004) (.030) (.030) See Note 2 12mm (.059 (.069 ±0.004) (.157 ± 0.004) (.079 ± 0.002) Max. Min. Min. Table 1 +0.004, -0.0) Table 1: 8 & 12mm Punched Tape (Metric Dimensions Will Govern) Variable Dimensions - Millimeters (Inches) Tape Size P1 F W A0B0 T 8mm 1/2 Pitch 8mm 12mm 2.0 ± 0.10 (.079 ±.004) 3.5 ± 0.05 See Requirements Section 3.3 (d) (.138 ± .002) 4.0 ± 0.10 (0.157 ± .004) 4.0 ± 0.10 (0.157 ± .004) 5.5 ± 0.05 8.0 ± 0.3 (.315 ± 0.012) See Note 1 Table 1 12.0 ± 0.3 (.472 ± .012) 1.1mm (.043) Max. for Paper Base Tape and 1.6mm (.063) Max. for NonPaper Base Compositions. See Note 3. 12mm 8.0 ± 0.10 (.217 ± .002) Double (0.315 ± .004) Pitch Note: 1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the body and/or the body dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002) minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A and B). 2. Tape with components shall pass around radius "R" without damage. 3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum. Sketch B: Max. Component Rotation - Front Cross Sectional View 20° Sketch C: Component Rotation - Top View Maximum 20° component rotation. Sketch A: Bending Radius See Note 2 Table 1 R (Min.) Typical component center line 96 ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 CERAMIC CHIP CAPACITORS Packaging Information Bulk Cassette Packaging (Ceramic Chips only) (Meets Dimensional Requirements IEC-286-6 and EIAJ 7201) 6.8 ± 0.1 8.8 ± 0.1 12.0 ± 0.1 Table 2 – Capacitance Values Available In Bulk Cassette Packaging Min. Max. Case Cap Cap Size Dielectric Voltage Value Value 0402 0603 0805 All All C0G All All 200 100 50 200 100 50 25 16 25 16 All All 109 109 109 221 221 221 221 221 104 104 All All 181 331 102 392 103 273 104 104 224 224 53.3* Unit: mm * Reference 10* 1.5 ± 2.0 ± 3.0 ± 0.1 0 0 0.1 0.2 0 X7R 31.5 ± 0.2 0 36 ± 0 0.2 19.0* 110 ± 0.7 5.0* Y5V Table 1 – Capacitor Dimensions for Bulk Cassette Packaging – Millimeters Metric Size Code 1005 1608 2012 EIA Size Code 0402 0603 0805 Length L Width W Thickness Bandwidth T B 0.5 ± .05 0.8 ± .07 0.6 ± .10 0.2 to 0.4 0.2 to 0.5 0.5 to 0.75 Minimum Separation S 0.3 0.7 0.75 Number of Pcs/Cassette 50,000 15,000 10,000 1.0 ± 0.05 0.5 ± 0.05 1.6 ± 0.07 0.8 ± 0.07 2.0 ± 0.10 1.25 ± 0.10 Terminations: KEMET nickel barrier layer with a tin overplate. CAPACITOR MARKING TABLE (Marking Optional - Not Available for 0402 Size or Y5V Dielectric) Numeral Alpha Character Capacitance (pF) For Various Numeral Identifiers 9 0 1 2 3 4 5 6 7 A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y 0.10 0.11 0.12 0.13 0.15 0.16 0.18 0.20 0.22 0.24 0.27 0.30 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.40 0.45 0.50 0.60 0.70 0.80 0.90 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 10,000 11,000 12,000 13,000 15,000 16,000 18,000 20,000 22,000 24,000 27,000 30,000 33,000 36,000 39,000 43,000 47,000 51,000 56,000 62,000 68,000 75,000 82,000 91,000 25,000 35,000 40,000 45,000 50,000 60,000 70,000 80,000 90,000 100,000 110,000 120,000 130,000 150,000 160,000 180,000 200,000 220,000 240,000 270,000 300,000 330,000 360,000 390,000 430,000 470,000 510,000 560,000 620,000 680,000 750,000 820,000 910,000 250,000 350,000 400,000 450,000 500,000 600,000 700,000 800,000 900,000 1,000,000 1,100,000 1,200,000 1,300,000 1,500,000 1,600,000 1,800,000 2,000,000 2,200,000 2,400,000 2,700,000 3,000,000 3,300,000 3,600,000 3,900,000 4,300,000 4,700,000 5,100,000 5,600,000 6,200,000 6,800,000 7,500,000 8,200,000 9,100,000 2,500,000 3,500,000 4,000,000 4,500,000 5,000,000 6,000,000 7,000,000 8,000,000 9,000,000 10,000,000 11,000,000 12,000,000 13,000,000 15,000,000 16,000,000 18,000,000 20,000,000 22,000,000 24,000,000 27,000,000 30,000,000 33,000,000 36,000,000 39,000,000 43,000,000 47,000,000 51,000,000 56,000,000 62,000,000 68,000,000 75,000,000 82,000,000 91,000,000 25,000,000 35,000,000 40,000,000 45,000,000 50,000,000 60,000,000 70,000,000 80,000,000 90,000,000 Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198 - see table below) to identify the capacitance value. Note that marking is not available for size 0402 nor for any Y5V chip. In addition, the 0603 marking option is limited to the K only. KA3 Example shown is 1,000 pF capacitor. ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 97 Packaging