Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC
(Commercial & Automotive Grade)
Lead-free
Overview
KEMET's C0G with KONNEKTTM technology surface mount
capacitors are designed for high-efficiency and high-density
power applications. KONNEKT high density packaging
technology uses an innovative Transient Liquid Phase
Sintering (TLPS) material to create a surface mount multichip solution for high density packaging. By utilizing
KEMET's robust and proprietary C0G base metal electrode
(BME) dielectric system, these capacitors are well suited for
power converters, inverters, snubbers, and resonators where
high efficiency is a primary concern.
With an operating temperature range up to 125°C, these
capacitors can be mounted close to fast switching
semiconductors in high power density applications, which
require minimal cooling. C0G with KONNEKT technology
also exhibits high mechanical robustness compared to
other dielectric technologies, allowing the capacitor to be
mounted without the use of metal frames.
Benefits
Applications
• Extremely high-power density and ripple current
capability
• Extremely low equivalent series resistance (ESR)
• Extremely low equivalent series inductance (ESL)
• Capacitance offerings ranging from 0.78 nF – 940 nF
• DC voltage ratings from 50 – 3,000 V
• EIA sizes 1812 and 2220
• Operating temperature range of −55°C to +125°C
• No capacitance shift with voltage
• No piezoelectric noise
• High thermal stability
• Surface mountable using standard MLCC reflow profiles
• Wide bandgap (WBG), silicon carbide (SiC)
and gallium nitride (GaN) systems
• Data centers
• EV/HEV (drive systems, charging)
• LLC resonant converters
• Switched tank converters
• Wireless charging systems
• Photovoltaic systems
• Power converters
• Inverters
• DC link
• Snubber
C0G with KONNEKT series compliments the KC-LINK with
KONNEKT series by offering a wider voltage range and
operating temperature range up to 125°C
Built Into Tomorrow
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Ordering Information
C
Ceramic
C
1812
C
943
Case Size Specification/ Capacitance
(L"x W")
Series
Code (pF)
1812
2220
C = Standard
Two single
digits +
number of
zeros.
K
C
G
L
C
XXXX
Orientation and
Packaging
(Suffix/C-Spec)
Capacitance
Tolerance
Subclass
Rated
Dielectric
Designation
Voltage (V)
Termination
Finish
K = ±10%
5 = 50 V
1 = 100 V
2 = 200 V
A = 250 V
C = 500 V
B = 630 V
D = 1,000 V
F = 1,500 V
G = 2,000 V
Z = 2,500 V
H = 3,000 V
G=
C0G
C=
100% matte Sn
L=
KONNEKT
See
"Packaging and
Orientation
C-Spec
Ordering
Options Table"
Additional termination finish options may be available. Contact KEMET for details.
Orientation and Packaging (Suffix/C-Spec) Options Table
Mounting Orientation1
Tape and Reel Illustration
Packaging Type
Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade
Standard
7" Reel/Unmarked
TU
13" Reel/Unmarked
7210
Automotive Grade
Standard
7" Reel/Unmarked
AUTO
13" Reel/Unmarked
AUTO7210
1 Orientation refers to the positioning of the KONNEKT capacitors in the Tape and Reel pockets. This allows pick and place machines to place
capacitors on the PCB in the correct orientation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days Prior To
Implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days minimum
AUTO
Yes (without approval)
Yes
90 days minimum
1
1
Customer Notification Due To:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
2
3
4
5
KEMET assigned1
●
●
●
●
●
AUTO
1
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
Standard Mounting
2 Chips
L
W
B
T
EIA
SIZE
CODE
METRIC
SIZE
CODE
Number
of Chips
1812
4532
2220
5750
Mounting
L
LENGTH
W
WIDTH
2
Standard
4.50 (0.177)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
2
Standard
5.70 (0.224)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T
THICKNESS
B
BANDWIDTH
Mounting
Technique
Typical
Average
Piece
Weight (g)
See Table 1A
and 1B for
Thickness
0.60 (0.024)
±0.35 (0.014)
Solder Reflow
Only
See Table 1A
and 1B for
Weights
C1113_KONNEKT_C0G • 8/25/2021
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Table 1A - 1812 Product Ordering Codes, Ratings, and Package Quantities
KEMET Part
Number1
Capacitance
Cap
Code
Voltage
C1812(a)444(b)5GLC(c)
440 nF
444
50 V
C1812(a)304(b)1GLC(c)
300 nF
304
100 V
C1812(a)204(b)2GLC(c)
200 nF
204
200 V
C1812(a)204(b)AGLC(c)
200 nF
204
250 V
C1812(a)943(b)CGLC(c)
94 nF
943
500 V
C1812(a)943(b)BGLC(c)
94 nF
943
630 V
C1812(a)303(b)DGLC(c)
30 nF
303
1,000 V
C1812(a)542(b)FGLC(c)
5.4 nF
542
1,500 V
C1812(a)302(b)GGLC(c)
3 nF
302
2,000 V
C1812(a)142(b)ZGLC(c)
1.4 nF
142
2,500 V
C1812(a)781b)HGLC(c)
0.78 nF
781
3,000 V
Number
of
Chips
Thickness
mm (inch)
2
3.3 (0.130)
±0.4 (0.016)
3.5 (0.138)
±0.4 (0.016)
4.1 (0.161)
±0.4 (0.016)
4.1 (0.161)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
Typical
Average
Piece
Weight
(g)
Tape & Reel Quantity
7"
Tape &
Reel
13"
Tape &
Reel
0.19
500
2,000
0.19
500
2,000
0.24
275
1,050
0.24
275
1,050
0.30
200
850
0.30
200
850
0.30
200
850
0.30
200
850
0.30
200
850
0.30
200
850
0.30
200
850
1 Complete part number requires additional characters in the numbered positions provided in order to indicate capacitance tolerance and grade.
For each numbered position, available options are as follows:
(a) End Termination "C".
(b) Capacitance tolerance character "K".
(c) C-Spec for Product Grade, Reeling and Mounting Orientation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Table 1B - 2220 Product Ordering Codes, Ratings, and Package Quantities
KEMET Part
Number1
Capacitance
Cap
Code
Voltage
C2220(a)944(b)5GLC(c)
940 nF
944
50 V
C2220(a)664(b)1GLC(c)
660 nF
664
100 V
C2220(a)444(b)2GLC(c)
440 nF
444
200 V
C2220(a)204(b)CGLC(c)
200 nF
204
500 V
C2220(a)204(b)BGLC(c)
200 nF
204
630 V
C2220(a)663(b)DGLC(c)
66 nF
663
1,000 V
C2220(a)143(b)FGLC(c)
14 nF
143
1,500 V
C2220(a)782(b)GGLC(c)
7.8 nF
782
2,000 V
C2220(a)362(b)ZGLC(c)
3.6 nF
362
2,500 V
C2220(a)202(b)HGLC(c)
2 nF
202
3,000 V
Number
of
Chips
Thickness
mm (inch)
2
3.5 (0.138)
±0.4 (0.016)
3.5 (0.138)
±0.4 (0.016)
4.1 (0.161)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
5.1 (0.200)
±0.4 (0.016)
Typical
Average
Piece
Weight
(g)
Tape & Reel Quantity
7"
Tape &
Reel
13"
Tape &
Reel
0.45
475
1825
0.45
475
1825
0.45
225
950
0.65
300
1,250
0.65
300
1,250
0.65
300
1,250
0.65
300
1,250
0.65
300
1,250
0.65
300
1,250
0.65
300
1,250
1 Complete part number requires additional characters in the numbered positions provided in order to indicate capacitance tolerance and grade.
For each numbered position, available options are as follows:
(a) End Termination "C".
(b) Capacitance tolerance character "K".
(c) C-Spec for Product Grade, Reeling and Mounting Orientation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Table 2 - Performance and Reliability: Test Methods and Conditions (Commercial Only)
Test
Reference
Test Condition
Limits
Visual and
Mechanical
KEMET
Internal
No defects that may affect performance (10X)
Dimensions according KEMET Spec Sheet
Capacitance
(Cap)
KEMET
Internal
Dissipation
Factor (DF)
KEMET
Internal
Insulation
Resistance (IR)
KEMET
Internal
1 kHz ±50 Hz and 1.0 ±0.2 Vrms of capacitance
Capacitance measurements (including tolerance)
are indexed to a referee time of 1,000 hours
Within Tolerance
1 kHz ±50 Hz and 1.0 ±0.2 Vrms
Dissipation factor (DF) maximum limit at 25°C = 0.1%
For < 500 VDC:
Rated voltage applied for 120 ±5 seconds at 25°C
Within Specification
For ≥ 500 VDC:
500 V applied for 120 ±5 seconds at 25°C
To obtain IR limit, divide MΩ-µF value by the capacitance and
compare to GΩ limit. Select the lower of the two limits.
1,000 MΩ-µF or 100 GΩ
Frequency: 1 kHz ±50 Hz
Capacitance change with reference to +25°C
and 0 VDC applied
* See part number specification sheet for voltage
Temperature
Coefficient of
Capacitance
(TCC)
Dielectric
Withstanding
Voltage
(DWV)
KEMET
Internal
KEMET
Internal
Step
Temperature (°C)
1
+25°C
2
−55°C
3
+25°C
(Reference Temperature)
4
+125°C
Rated
DC Voltage
DWV Voltage
(% of Rated)
< 500
250%
500
150%
630
130%
≥ 1,000
120%
±30 PPM/°C
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Withstand test voltage without insulation
breakdown or damage.
(5 ±1 seconds and charge/discharge not exceeding
50 mA)
Aging Rate
(Maximum %
Capacitance
Loss/Decade
Hour)
KEMET
Internal
Maximum % capacitance loss/decade hour
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
0% Loss/Decade Hour
C1113_KONNEKT_C0G • 8/25/2021
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Table 2 - Performance and Reliability: Test Methods and Conditions (Commercial Only) cont.
Test
Reference
Test Condition
Limits
Shear stress test per specific case size, Time: 60±1 seconds
Terminal
Strength
KEMET
Internal
Case
Size
1812
2220
Board
Flex
Solderability
Temperature
Cycling
Biased
Humidity
Moisture
Resistance
AEC-Q200-005
J-STD-002
JESD22
Method JA-104
MIL-STD-202
Method 103
MIL-STD-202
Method 106
Force
No evidence of mechanical
damage
18N
Standard Termination System 3.0 mm
Test time: 60± 5 seconds
Ramp time: 1 mm/second
Magnification 10X. Conditions:
Category 2 (Dry Bake 155°C/4 hours ±15 minutes)
a) Method B, 245°C, SnPb
b) Method B1 at 245°C, Pb-Free
c) Method D, at 260°C, SnPb or Pb-Free
1,000 cycles (−55°C to +125°C)
2 – 3 cycles per hour
Soak Time 1 or 5 minutes
Load Humidity:
1,000 hours 85°C/85% RH and 200 VDC. Add 100 KΩ resistor.
Low Volt Humidity:
1,000 hours 85°C/85% RH and 1.5 V. Add 100 KΩ resistor.
Number of cycles required 10, 24 hours per cycle.
Steps 7a and 7b not required.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
No evidence of mechanical
damage
Visual Inspection.
95% coverage on termination.
No leaching
Measurement at 24 hours ±4
hours after test conclusion.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Measurement at 24 hours ±4
hours after test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Measurement at 24 hours ±4
hours after test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
C1113_KONNEKT_C0G • 8/25/2021
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Table 2 - Performance and Reliability: Test Methods and Conditions (Commercial Only) cont.
Test
Reference
Test Condition
Limits
Thermal Shock
MIL-STD-202
Method 107
Number of cycles required 5, (−55°C to 125°C)
Dwell time 15 minutes.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
High
Temperature
Life
1,000 hours at 125°C with 1.0 X rated voltage applied
MIL-STD-202
Method 108
Storage Life
1,000 hours at 125°C, Unpowered
Measurement at 24 hours ±4 hours after
test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Vibration
MIL-STD-202
Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations.
Test from 10 – 2,000 Hz
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Mechanical
Shock
MIL-STD-202
Method 213
1,500 g’s 0.5 ms Half-sine,
Velocity Change 15.4 feet/second
(Condition F)
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Resistance to
Solvents
MIL-STD-202
Method 215
Add Aqueous wash chemical OKEMCLEAN
(A 6% concentrated Oakite cleaner) or equivalent.
Do not use banned solvents.
Visual Inspection 10X
Readable marking,
no decoloration or stains.
No physical damage.
Environmental Compliance
Lead-free
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Table 3 – KONNEKT Land Pattern Design Recommendations per IPC-7351 (mm)
Chip
Number
Mounting
EIA SIZE
CODE
Median (Nominal) Land
Protrusion
METRIC
SIZE CODE
C
Y
X
V1
V2
2
Standard
1812
4532
2.05
1.40
3.50
6.00
4.00
2
Standard
2220
5750
2.65
1.50
5.40
7.30
5.90
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid
condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability chip stock should be used promptly, preferably within 1.5 years upon receipt.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Reflow Soldering Profile
KEMET's KONNEKT family of high density surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with
convection and IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress.
KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020
standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these
conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Termination Finish
TP
100% matte Sn
150°C
200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second maximum
Liquidous Temperature (TL)
217°C
Time Above Liquidous (tL)
60 – 150 seconds
Peak Temperature (TP)
260°C
Time Within 5°C of Maximum Peak
Temperature (tP)
30 seconds maximum
Ramp-Down Rate (TP to TL)
6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Hand Soldering and Removal of KONNEKT Capacitors
The preferred method of attachment for KEMET’s KONNEKT Capacitors is IR or convection reflow where temperature, time
and air flow are well controlled.
However, it is understood that the manual attachment of KONNEKT capacitors is necessary for prototype and lab testing. In
these instances, care must be taken not to introduce excessive temperature gradients in the KONNEKT part type that may
lead to cracking in the ceramic or separation of the TLPS material.
Please see KEMET's KONNEKT Soldering Guidelines here.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Dielectric Material
(CaZrO3)
Bonding Material
(See Image Below)
Termination Finish
(100% matte Sn)
Dielectric Material
(CaZrO3)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% matte Sn)
Inner Electrodes
(Ni)
Bonding Material
MLCC
CuSn TLPS
MLCC
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers X7R with KONNEKT technology capacitors packaged in 16 mm tape on 7" and 13" reels in accordance
with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems.
Bar code label
Anti-static reel
KONNEKT
Standard
orientation
in pocket
®
ET
KEM
Embossed
plastic carrier
Sprocket
holes
16 mm carrier tape
Embossment
cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
180 mm (7.00")
or
330 mm (13.00")
Table 4 – Carrier Tape Configuration, Embossed Plastic (mm)
EIA Case Size
KONNEKT 1812
KONNEKT 2220
Number of
Chips
2
2
Chip Thickness
Tape Size
(W)1
≤ 3.5 mm
> 3.5 mm
≤ 3.5 mm
>5.0 mm & ≤ 5.3 mm
> 3.5 mm ≤ 5.0
16
16
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)2
8
8
12
12
8
8
12
12
1. Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
2. Refer to Tables 4 and 5 for tolerance specifications.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
P0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
ØD1
Cover Tape
User Direction of Unreeling
Table 5 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape
Size
D0
D1 Minimum
Note 1
E1
P0
P2
R Reference
Note 2
16 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.5
(0.059)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
30
(1.181)
S1 Minimum
T
T1
Note 3
Maximum Maximum
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Case
Size
Number
of Chips
Tape
Size
1812
2
16 mm
2220
2
16 mm
Pitch
B1 Maximum
Note 4
Triple
(12mm)
Double
(8mm)
Triple
(12mm)
Double
(8mm)
7.9
(0.311)
7.5
(0.295)
8.5
(0.335)
9.2
(0.363)
E2
Minimum
14.25
(0.561)
14.25
(0.561)
F
P1
12.0±0.10
(0.472±0.004)
7.5±0.05
(0.138±0.002)
8.0±0.10
(0.315±0.004)
12.0±0.10
(0.472±0.004)
7.5±0.05
(0.138±0.002)
8.0±0.10
(0.315±0.004)
T2
Maximum
W
Maximum
A0,B0 & K0
6.5
(0.256)
16.3
(0.642)
Note 5
6.5
(0.256)
16.3
(0.642)
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied. See EIA Document 481, Paragraph 4.3 (b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4).
(e) For KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
16 mm
0.1 to 1.3 newton (10 to 130 gf)
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
16 mm
178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
Variable Dimensions — Millimeters (Inches)
Tape Size
16 mm
N Minimum
See Note 2, Tables 2-3
50
(1.969)
W1
W2 Maximum
W3
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
22.4
(0.882)
Shall accommodate tape
width without interference
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G with KONNEKT™ Technology, 50 – 3,000 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1113_KONNEKT_C0G • 8/25/2021
16
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