C2220C225M1R2CAUTO

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Overview KEMET Power Solutions (KPS) Automotive Series stacked capacitors utilize a proprietary lead-frame technology to vertically stack one or two multilayer ceramic chip capacitors into a single compact surface mount package. The attached lead-frame mechanically isolates the capacitor/s from the printed circuit board, therefore offering advanced mechanical and thermal stress performance. Isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. A two chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices. Providing up to 10 mm of board flex capability, KPS Series capacitors are environmentally friendly and in compliance with RoHS legislation. Available in X7R dielectric, these devices are capable of Pb-Free reflow profiles and provide lower ESR, ESL and higher ripple current capability when compared to other dielectric solutions. Combined with the stability of an X7R dielectric, KEMET’s KPS Series devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from −55°C to +125°C. KPS Series automotive grade capacitors meet the demanding Automotive Electronics Council's AEC–Q200 qualification requirements. Benefits • AEC–Q200 automotive qualified • −55°C to +125°C operating temperature range • Reliable and robust termination system • EIA 1210, 1812, and 2220 Case sizes • DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 250 V Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Ordering Information C Ceramic 2220 C Case Size Specification/ (L" x W") Series 1210 1812 2220 C = Standard 106 M 5 R 2 Rated Capacitance Capacitance Voltage Dielectric Failure Rate/Design Code (pF) Tolerance1 (VDC) Two significant digits + number of zeros K = ±10% M = ±20% 8 = 10 4 = 16 3 = 25 5 = 50 1 = 100 A = 250 R = X7R 1 = KPS Single Chip Stack 2 = KPS Double Chip Stack C AUTO Leadframe Finish2 Packaging/Grade (C-Spec) C = 100% Matte Sn See “Packaging C-Spec Ordering Options Table” below Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance. Single chip stacks ("1" in the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances. 2 Additional leadframe finish options may be available. Contact KEMET for details. 1 One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Packaging C-Spec Ordering Options Table Packaging Type1 Packaging/Grade Ordering Code (C-Spec)2 7" Reel (Embossed Plastic Tape)/Unmarked AUTO 13" Reel (Embossed Plastic Tape)/Unmarked AUTO 7289 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". 2 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". 1 Benefits cont'd • Capacitance offerings ranging from 0.1μF up to 47 μF • Available capacitance tolerances of ±10% and ±20% • Higher capacitance in the same footprint • Potential board space savings • Advanced protection against thermal and mechanical stress • Provides up to 10 mm of board flex capability • Reduces audible, microphonic noise • Extremely low ESR and ESL • Lead (Pb)-free, RoHS and REACH compliant • Capable of Pb-free reflow profiles • Non-polar device, minimizing installation concerns • Tantalum and electrolytic alternative Applications Typical applications include smoothing circuits, DC/DC converters, power supplies (input/output filters), noise reduction (piezoelectric/mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Qualification/Certification Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Automotive C-Spec Information KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “9170”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below). Product Change Notification (PCN) The KEMET Product Change Notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence Process/Product change Obsolescence* Days prior to implementation KEMET assigned Yes (with approval and sign off) Yes 180 days Minimum AUTO Yes (without approval) Yes 90 days Minimum 1 1 Customer Notification due to: KEMET Automotive C-Spec KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design record and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part 1 2 3 4 5 KEMET assigned ● ● ● ● ● AUTO ○ 1 1 PPAP (Product Part Approval Process) Level KEMET Automotive C-Spec ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part Number specific PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Dimensions – Millimeters (Inches) TOP VIEW Single or Double Chip Stack PROFILE VIEW Double Chip Stack Single Chip Stack L L W H H LW Number of Chips Single Double EIA Metric Size Code Size Code 1210 3225 1812 4532 2220 5650 1210 3225 1812 4532 2220 5650 LW L Length W Width H Height LW Lead Width Mounting Technique 3.50 (0.138) ±0.30 (0.012) 5.00 (0.197) ±0.50 (0.020) 6.00 (0.236) ±0.50 (0.020) 3.50 (0.138) ±0.30 (0.012) 5.00 (0.197) ±0.50 (0.020) 6.00 (0.236) ±0.50 (0.020) 2.60 (0.102) ±0.30 (0.012) 3.50 (0.138) ±0.50 (0.020) 5.00 (0.197) ±0.50 (0.020) 2.60 (0.102) ±0.30 (0.012) 3.50 (0.138) ±0.50 (0.020) 5.00 (0.197) ±0.50 (0.020) 3.35 (0.132) ±0.10 (0.004) 2.65 (0.104) ±0.35 (0.014) 3.50 (0.138) ±0.30 (0.012) 6.15 (0.242) ±0.15 (0.006) 5.00 (0.197) ±0.50 (0.020) 5.00 (0.197) ±0.50 (0.020) 0.80 (0.032) ±0.15 (0.006) 1.10 (0.043) ±0.30 (0.012) 1.60 (0.063) ±0.30 (0.012) 0.80 (0.031) ±0.15 (0.006) 1.10 (0.043) ±0.30 (0.012) 1.60 (0.063) ±0.30 (0.012) Solder Reflow Only Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit at 25ºC Insulation Resistance (IR) Limit at 25°C 250% of rated voltage (5±1 seconds and charge/discharge not exceeding 50 mA) 5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V) See Insulation Resistance Limit Table (Rated voltage applied for 120±5 seconds at 25°C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF 120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) > 25 X7R 16/25 Capacitance Shift Insulation Resistance ±20% 10% of Initial Limit 3.0 All 5.0 < 16 7.5 Insulation Resistance Limit Table EIA Case Size 1,000 Megohm Microfarads or 100 GΩ 500 Megohm Microfarads or 10 GΩ 1210 < 0.39 µF ≥ 0.39 µF 1812 < 2.2 µF ≥ 2.2 µF 2220 < 10 µF ≥ 10 µF © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Electrical Characteristics Z and ESR C2220C476M3R2C Z and ESR C1210C475M5R1C C1210C475M5R1C Z and ESR 10 3 10 4 ESR ESR Z Z Magnitude Ohms 10 10 10 10 10 10 2 1 Magnitude Ohms 10 2 0 -1 10 10 10 -2 -3 10 0 10 2 10 4 10 6 10 8 10 10 10 -2 -4 -6 10 Frequency (Hz) 0 10 2 10 4 10 6 10 8 10 10 Frequency (Hz) ESR – 1812, .10 µF, 50 V X7R Impedance – 1812, .10 µF, 50 V X7R ESR vs. Frequency 10 0 Impedance vs. Frequency 10000 C1812C104K5R2C (2 Chip Stack) C1812C104K5R1C (1 Chip Stack) C1812C104K5R2C (2 Chip Stack) C1812C104K5R1C (1 Chip Stack) 1000 Impedance (Ohms) 100 ESR (Ohms) 1 0.1 10 1 0.1 0.01 1.E+03 1.E+04 1.E+05 1.E+06 Frequency (Hz) 1.E+07 1.E+08 0.01 1.E+03 ESR – 1210, .22 µF, 50 V X7R 1.E+05 1.E+06 Frequency (Hz) 1.E+07 1.E+08 Impedance – 1210, .22 µF, 50 V X7R ESR vs. Frequency 10 1.E+04 C1210C224K5R2C (2 Chip Stack) C1210C224K5R1C (1 Chip Stack) ESR (Ohms) C1210C224K5R2C (2 Chip Stack) C1210C224K5R1C (1 Chip Stack) 100 Impedance (Ohms) 1 Impedance vs. Frequency 1000 10 0.1 1 0.1 0.01 1.E+03 1.E+04 1.E+05 1.E+06 Frequency (Hz) 1.E+07 1.E+08 0.01 1.E+03 1.E+04 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com 1.E+05 1.E+06 Frequency (Hz) 1.E+07 1.E+08 C1021_X7R_KPS_AUTO_SMD • 8/11/2016 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Electrical Characteristics cont'd Microphonics – 1210, 4.7 µF, 50 V, X7R Microphonics – 2220, 22 µF, 50 V, X7R Sound Pressure (dB) 50 Sound Pressure (dB) 60 50 40 30 20 10 0 40 30 20 Standard SMD MLCC KPS - 1 Chip Stack 0 5 Vp-p 10 Standard SMD MLCC KPS - 2 Chip Stack 10 15 0 0 Microphonics – 2220, 47 µF, 25 V, X7R 6 50 Sound Pressure (dB) Sound Pressure (dB) 4 Vp-p Microphonics – 1210, 22 µF, 25 V, X7R 50 40 40 30 30 20 20 Standard SMD MLCC KPS - 2 Chip Stack 10 0 2 0 5 10 Vp-p 15 Standard SMD MLCC KPS - 2 Chip Stack 10 0 0 20 2 Vp-p 4 6 Competitive Comparision 60 50 40 30 20 10 0 Ripple Current (Arms) 2220, 22 µF, 50 V 120 Absolute Temperature (C) Sound Pressure (dB) Microphonics – 1210, 4.7 µF, 50 V, X7R 100 Competitor KEMET - KPS 0 5 Vp-p 10 15 80 60 40 KEMET KPS, 2220, 22µF, 50V rated (2 Chip Stack) 20 0 Competitor 2220, 22µF, 50V rated (2 Chip Stack) 0 10 20 Ripple Current (Arms) 30 Note: Refer to Table 4 for test method. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Electrical Characteristics cont'd Board Flex vs. Termination Type Board Flex vs. Termination Type Weibull X7R 1210 10 uF – (22uF KPS Stacked) 2 80 70 60 50 40 Percent 80 70 60 50 40 Standard Termination KPS – 2 Chip Stack 90 Standard Termination KPS – 2 Chip Stack 90 Percent Weibull X7R 2220 22uF 25V – (47uF KPS Stacked) 2 30 20 30 20 10 10 2.0 1.5 1 .0 3 .0 4 .0 Board Flexure (mm) 1 .0 7. 0 8 .0 9.0 10 .0 6 .0 5.0 1.5 0 4. 0 0 5. 6. 0 0 0 7. 8 . 9.0 10 .0 Board Flexure to 10 mm Weibull X7R 1210 4.7 uF 50V 2 90 80 70 60 50 40 30 Weibull X7R 1812 47uF 16V 90 80 70 60 50 40 20 Percent Percent 3. Board Flexure (mm) Board Flexure to 10 mm 2 2.0 10 30 20 10 0 1. 1. 5 2. 0 0 3. 0 4. 5. 0 6. 0 7. 0 8. 0 0 0 9. 10. Board Flexure (mm) 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com Board Flexure (mm) 10 C1021_X7R_KPS_AUTO_SMD • 8/11/2016 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Table 1 – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) 4 3 5 1 A 4 3 5 1 A Rated Voltage (VDC) 25 50 100 250 16 25 50 100 250 16 JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR GR UD UD UD UD UD UD UD UD UD UD JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR JR UD UD FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW 250 UD UD UD 100 UD UD UD UD 50 GP GP GP GP GP GP GP 25 GP GP GP GP GP GP GP GP 16 8 Double Chip Stack GP GP GP GP GP GP GP GP 250 Voltage Code FV 100 Rated Voltage (VDC) FV FV FV FV 50 FW FW FW FW FW FW FW FW FW FV FV FV FV FV FV FV 25 FW FW FW FW FW FW FW FW FW FV FV FV FV FV FV FV FV 16 M M M M M M M M M M M Single Chip Stack 250 FV FV FV FV FV FV FV FV 100 FV FV FV FV FV FV FV FV 50 Capacitance Cap Code M M M M M M M M M M 25 104 224 474 105 225 335 475 106 226 336 476 JP JP JP JP JP JP JP JP JP JP Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 16 0.10 µF 0.22 µF 0.47 µF 1.0 µF 2.2 µF 3.3 µF 4.7 µF 10 µF 22 µF 33 µF 47 µF K K K K K K K K K K 250 A 100 1 50 5 25 3 10 104 224 474 105 225 335 475 106 156 226 C2220C 4 Capacitance Tolerance 0.10 µF 0.22 µF 0.47 µF 1.0 µF 2.2 µF 3.3 µF 4.7 µF 10 µF 15 µF 22 µF C1812C 8 16 Capacitance C1210C Voltage Code 10 Case Size/Series Cap Code 4 3 5 1 A 4 3 5 1 A 4 3 5 1 A Case Size/Series C1210C C1812C JR JR JR JR JR JR UD C2220C UD = Under development These products are protected under US Patent 8,331,078 other patents pending, and any foreign counterparts. Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel FV FW GP GR JP JR 1210 1210 1812 1812 2220 2220 3.35 ± 0.10 6.15 ± 0.15 2.65 ± 0.35 5.00 ± 0.50 3.50 ± 0.30 5.00 ± 0.50 0 0 0 0 0 0 0 0 0 0 0 0 600 300 500 400 300 200 2,000 1,000 2,000 1,700 1,300 800 Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Table 3 – KPS Land Pattern Design Recommendations (mm) V1 Median (Nominal) Land Protrusion EIA SIZE CODE METRIC SIZE CODE C Y X V1 V2 1210 3225 1.50 1.14 1.75 5.05 3.40 1812 4532 2.20 1.35 2.87 6.70 4.50 2220 5650 2.69 2.08 4.78 7.70 6.00 Y Y Image at right based on an EIA 1210 case size. X X C C V2 Grid Placement Courtyard Soldering Process To prevent degradation of temperature cycling capability, care must be taken to prevent solder from flowing into the inner side of the lead frames (inner side of "J" lead in contact with the circuit board). After soldering, the capacitors should be air cooled to room temperature before further processing. Forced air cooling is not recommended. Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the capacitor body. The iron should be used to heat the solder pad, applying solder between the pad and the lead, until reflow occurs. Once reflow occurs, the iron should be removed immediately. (Preheating is required when hand soldering to avoid thermal shock.) Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (TSmin) 100°C 150°C Temperature Maximum (TSmax) 150°C 200°C Time (ts) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds Ramp-up Rate (TL to TP) 3°C/seconds maximum 3°C/seconds maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 250°C Time within 5°C of Maximum 20 seconds maximum 10 seconds maximum Peak Temperature (tP) Ramp-down Rate (TP to TL) 6°C/seconds maximum 6°C/seconds maximum Time 25°C to Peak 6 minutes maximum 8 minutes maximum Temperature Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. TP TL Temperature KEMET’s KPS Series devices are compatible with IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for IR reflow reflect the profile conditions of the IPC/J–STD–020D standard for moisture sensitivity testing. tP Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec tL Tsmax Tsmin 25 ts 25ºC to Peak Time © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Construction (Typical) Detailed Cross Section Dielectric Material (BaTiO3) Leadframe (Phosphor Bronze - Alloy 510) Leadframe Attach (High Melting Point Solder) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Dielectric Material (BaTiO3) Termination Finish (Sn) Termination Finish (Sn) Inner Electrodes Barrier Layer (Ni) (Ni) End Termination/ External Electrode (Cu) Product Marking Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Table 4 – Carrier Tape Configuration – Embossed Plastic (mm) EIA Case Size Tape Size (W)* Pitch (P1)* 01005 – 0402 8 2 0603 – 1210 8 4 1805 – 1808 12 4 ≥ 1812 12 8 KPS 1210 12 8 KPS 1812 & 2220 16 12 Array 0508 & 0612 8 4 *Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 5 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØDo Po [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 Ao F Ko B1 Bo S1 W E2 P1 T1 Center Lines of Cavity ØD Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 1 User Direction of Unreeling Table 5 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5+0.10/0.0−0.0 (0.059+0.004/−0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 1.75±0.10 4.0±0.10 2.0±0.05 (0.069±0.004) (0.157±0.004) (0.079±0.002) R Reference Note 2 25.0 (0.984) 30 (1.181) S1 Minimum Note 3 T Maximum T1 Maximim 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum E2 Minimum Note 4 4.35 6.25 (0.171) (0.246) 8.2 10.25 (0.323) (0.404) 12.1 14.25 (0.476) (0.561) F P1 3.5±0.05 4.0±0.10 (0.138±0.002) (0.157±0.004) 5.5±0.05 8.0±0.10 (0.217±0.002) (0.315±0.004) 7.5±0.05 12.0±0.10 (0.138±0.002) (0.157±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0 , B 0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) Typical Component Centerline Ao Figure 3 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Maximum Rotation ( 20 10 5 Figure 4 – Bending Radius Embossed Carrier 16 mm Tape ° S) Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com R C1021_X7R_KPS_AUTO_SMD • 8/11/2016 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Figure 5 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 6 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178±0.20 (7.008±0.008) or 330±0.20 (13.000±0.008) 1.5 (0.059) 13.0+0.5/−0.2 (0.521+0.02/−0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4+1.5/−0.0 (0.331+0.059/−0.0) 12.4+2.0/−0.0 (0.488+0.078/−0.0) 16.4+2.0/−0.0 (0.646+0.078/−0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 7 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade) KEMET Electronic Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1021_X7R_KPS_AUTO_SMD • 8/11/2016 18