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C2220C823KFRACAUTO

C2220C823KFRACAUTO

  • 厂商:

    KEMET(基美)

  • 封装:

    2220(5750 Metric)

  • 描述:

    0.082 µF ±10% 1500V(1.5kV) 陶瓷电容器 X7R 2220(5750 公制)

  • 数据手册
  • 价格&库存
C2220C823KFRACAUTO 数据手册
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Overview Applications KEMET’s Automotive Grade High Voltage surface mount MLCCs in X7R Dielectric feature a 125°C maximum operating temperature and are considered “temperature stable.” The Electronics Industries Alliance (EIA) characterizes X7R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from -55°C to +125°C. • Charging stations • LCD fluorescent backlight ballasts • Voltage multiplier circuits • DC/DC converters • Power supply • LAN/WAN interface • High voltage decoupling • Filters • DC blocking • ESD Protection Whether under-hood or in-cabin, these capacitors are designed to provide reliable performance in mission and safety critical automotive circuits. Stricter testing protocol and inspection criteria have been established for automotive grade products in recognition of potentially harsh environmental conditions. KEMET automotive grade series capacitors meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements. Ordering Information C Ceramic 1210 154 K C R A C AUTO Case Size Specification/ Capacitance Capacitance Rated Voltage Failure Rate/ Packaging/Grade Dielectric Termination Finish1 (L" x W") Series Code (pF) Tolerance (VDC) Design (C-Spec) 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225 1 C C = Standard Two significant digits and number of zeros. J = ±5% K = ±10% M = ±20% C = 500 B = 630 D = 1,000 F = 1,500 G = 2,000 Z = 2,500 H = 3,000 R = X7R A = N/A C = 100% Matte Sn See "Packaging C-Spec Ordering Options Table" Additional termination finish options may be available. Contact KEMET for details. Built Into Tomorrow © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 1 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Ordering Code (C-Spec)3 Packaging Type1 7" Reel 13" Reel/Unmarked 7" Reel/Unmarked/2 mm pitch2 13" Reel/Unmarked/2 mm pitch2 AUTO AUTO7411 (EIA 0603 and smaller case sizes) AUTO7210 (EIA 0805 and larger case sizes) 3190 3191 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information." 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information." 3 All automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking." 3 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information." 1 Benefits • AEC-Q200 automotive qualified • −55°C to +125°C operating temperature range • Industry-leading CV values • Exceptional performance at high frequencies • Lead (Pb)-free, RoHS and REACH compliant • EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220 & 2225 case sizes • DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV, 2.5 KV, and 3 KV • Capacitance offerings ranging from 10 pF to 560 nF • Available capacitance tolerances of ±5%, ±10%, and ±20% • Low ESR and ESL • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated termination finish allowing for excellent solderability Application Note X7R dielectric is not recommended for AC line filtering or pulse applications. These capacitors and/or the assembled circuit board containing these capacitors may require a protective surface coating to prevent external surface arcing. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 2 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET product change notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence Process/Product change Obsolescence* Days Prior To Implementation KEMET assigned Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 1 Customer Notification Due To: KEMET Automotive C-Spec KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. PPAP Level KEMET Automotive C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO 1 ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part number specific PPAP available with customer information included. ○ Product family PPAP only © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 3 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Dimensions – Millimeters (Inches) L W B T S B Bandwidth S Separation Minimum Mounting Technique 0.50 (0.020) ±0.05 (0.002) 0.30 (0.012) ±0.10 (0.004) 0.30 (0.012) Solder Reflow Only 1.60 (0.063) ±0.15 (0.006) 2.00 (0.079) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 4.70 (0.185) ±0.50 (0.020) 4.50 (0.177) ±0.30 (0.012) 4.50 (0.177) ±0.30 (0.012) 5.70 (0.224) ±0.40 (0.016) 0.80 (0.032) ±0.15 (0.006) 1.25 (0.049) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008) 2.50 (0.098) ±0.20 (0.008) 2.00 (0.079) ±0.20 (0.008) 3.20 (0.126) ±0.30 (0.012) 6.40 (0.252) ±0.40 (0.016) 5.00 (0.197) ±0.40 (0.016) 0.35 (0.014) ±0.15 (0.006) 0.50 (0.02) ±0.25 (0.010) 0.50 (0.02) ±0.25 (0.010) 0.50 (0.02) ±0.25 (0.010) 0.60 (0.024) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014) 5.60 (0.220) ±0.40 (0.016) 6.40 (0.248) ±0.40 (0.016) EIA Size Code Metric Size Code L Length W Width 0402 1005 1.00 (0.040) ±0.05 (0.002) 0603 1608 0805 2012 1206 3216 1210 3225 1808 4520 1812 4532 1825 4564 2220 5650 2225 5664 T Thickness See Table 2 for Thickness 0.70 (0.028) 0.75 (0.030) N/A Solder wave or Solder reflow Solder reflow only 0.60 (0.024) ±0.35 (0.014) Qualification/Certification Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 4 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC) ±15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% 1 2 3 4 Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit at 25°C Insulation Resistance (IR) Minimum Limit at 25°C See Dielectric Withstanding Voltage (DWV) Table (5 ±1 seconds and charge/discharge not exceeding 50 mA) 2.5% See Insulation Resistance Limit Table (500 VDC applied for 120 ±5 seconds at 25°C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 3 Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF 12 0Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF 4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." 1 2 DWV HV EIA Case Size 500V 630V ≥ 1000V 0402 120% of rated voltage N/A N/A 0603 0805 1206 1210 1808 150% of rated voltage 120% of rated voltage 1812 1825 2220 2225 © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 5 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) > 25 16/25 X7R Capacitance Shift Insulation Resistance ±20% 10% of Initial limit 3.0 5.0 All < 16 7.5 Insulation Resistance Limit Table (X7R Dielectric) EIA Case Size 1,000 Megohm Microfarads or 100 GΩ 100 Megohm Microfarads or 10 GΩ 0402 N/A All 0603 N/A All 0805 < 0.0039 µF ≥ .0039 µF 1206 < 0.012 µF ≥ 0.012 µF 1210 < 0.033 µF ≥ 0.033 µF 1808 < 0.018 µF ≥ 0.018 µF 1812 < 0.027 µF ≥ 0.027 µF 1825 < 0.120 µF ≥ 0.120 µF 2220 < 0.150 µF ≥ 0.150 µF 2225 < 0.180 µF ≥ 0.180 µF © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 6 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) 500 630 1000 1500 2000 500 630 1000 1500 2000 500 630 1000 1500 2000 2500 3000 500 630 2500 630 3000 H DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED EF EF EF EG ED ED ED ED ED ED ED ED 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GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GD GD GB GB GB GD GD GH GH GH GH GH GH GH GH GK GK GM GH GK GM GM GO GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GD GD GD GH GH GK GK GH GH GH GH GK GK GK GK GM GM GO GO GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GK GK GB GB GB GH GH GK GK GK GK GK 3000 Z 2000 G 2500 F 2000 D 1500 B 1000 C 1500 H 1000 Z 630 G 500 F 3000 D 2500 B 2000 C 1500 G 630 F 1000 D 500 B 2000 C 1500 G 630 F 1000 D 500 B 1500 C 2000 D 630 B 1000 C 500 D 1000 C1812C2 500 C1808C 630 C1210C 1000 C1206C B C B D F G C B D F G C B D F G Z H C B D F G Z H Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions 630 C 1000 Cap Voltage Code C Code Case Size/ C0402C Series 500 BB BB BD DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG CG CG CG DG CG CG DG CG CG DG CG DG CG DG CG DG CG DG CG DG DG DG DG DG DG DG 630 Cap C 1000 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 101 111 121 131 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 C 500 10 pF 11 pF 12 pF 13 pF 15 pF 16 pF 18 pF 20 pF 22 pF 24 pF 27 pF 30 pF 33 pF 36 pF 39 pF 43 pF 47 pF 51 pF 56 pF 62 pF 68 pF 75 pF 82 pF 91 pF 100 pF 110 pF 120 pF 130 pF 150 pF 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF Voltage Code Rated Voltage (VDC) Capacitance Tolerance J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M Rated Voltage (VDC) 500 Cap Code C0805C 500 Cap Case Size/ C0402C C0603C Series 500 Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) B D C B D C0603C C0805C C1206C C1210C C1808C C1812C2 KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). 2 Available capacitance values available in X7R with KONNEKT Technology. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 7 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) 2000 500 630 1000 1500 2000 B D F G Z H 2500 1500 C 3000 630 1000 H 2500 500 Z 3000 G D F G Z H C1812C 2 1500 F 2000 D 2000 B 1000 C 1500 G 1000 F 500 D 630 B GB GB GB GH GH GH GH GH GE GB GB GE GE GF GJ GL GS GK GK GK GB GB GB GB GB GE GE GH GK GN GK GK GK GB GB GB GC GE GE GK GJ GH GM GM GO GO 500 C 630 G 2500 F 3000 D C1812C2 3000 B 2000 500 C 1500 1000 D 630 500 B 1000 C 500 D C1808C 630 B C1210C 1000 C 630 C H C B C0603C D C0805C C1206C 2500 B 2000 C 1500 G 630 F LC LC LE LE LA LA LA LB LB LC 1000 D LC LE LE LA LA LA LA LA LA LC LC 500 F B LA LA LA LA LC LC LC LC LA LA LA LA LB 2000 1500 C 630 D FL FM FM FK FS FS 1000 B FL FL FM FK FH FH FK FK FS 500 C FL FL FM FK FG FG FH FH FK FK FS 2000 D FL FL FL FM FM FK FK FG FG FH FK FK FK 1500 B EJ EJ EJ EJ EJ EJ EJ EJ 630 630 1000 C EG EJ EJ EJ EJ EJ EJ EJ EJ 1000 500 Cap Voltage Code C Code Case Size/ C0402C Series 1000 DG DG DG 500 Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions 500 Cap 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 Voltage Code Rated Voltage (VDC) Capacitance Tolerance J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M Rated Voltage (VDC) C1206C 630 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 µF 0.12 µF 0.15 µF 0.18 µF 0.22 µF 0.27 µF 0.33 µF C0805C 500 Cap Code Cap Case Size/ C0402C C0603C Series 500 Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) cont. G C B D F G Z C1210C C1808C Table 1B – Capacitance Range/Selection Waterfall (1825–2225 Case Sizes) HG HG HG HG HG HG HG HG Rated Voltage (VDC) 1000 1500 2000 Voltage Code C B D F G Case Size/Series 2500 3000 HG HG HG HG JK JK JK JK JK JK JK JK JE JE JE JK JE JE JK JK JK JK JK JK JK JK JE JE JE JK JE JE JK JK JK JK JK JK JK JK JE JE JE JK JE JE JK JK JK JK JK JK JK JK JE JE JE JK JK JK JK JK JK JK JK JK JK JK JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK KF KF KF KF KF KF KF KE KE KE KF KF KF KE KF KF KF KF KF KF KF KE KE KE KF KF KF KE KF KF KF KF KF KF KF KE KE KE KF KF KF KE KF KF KF KF KF KF KF KE KE KE KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KE KF KF KF KF KF KF KF KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 H 1000 Z 630 G 500 F 3000 D 2500 Cap Code B 2000 HG HG HG HG C 1500 HG HG HG HG H 1000 HG HG HG HG Z 630 HG HG HG HG G 500 HG HG HG HG HG HG HG HG F 3000 HG HG HG HG HG HG HE HE D 2500 HG HG HG HG HG HG HE HE B 2000 HG HG HG HG HG HG HE HE C 1500 HG HG HG HG HG HG HE HE H 1000 HG HG HG HG HG HG HE HE Z 630 HG HG HG HG HG HG HE HE G 500 630 101 111 121 131 151 181 221 271 331 391 471 561 681 821 Capacitance Tolerance J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M F 3000 Rated Voltage (VDC) D 2500 B 2000 C 1500 Voltage Code C2225C 1000 Cap Code 630 Capacitance C2220C 500 100 pF 110 pF 120 pF 130 pF 150 pF 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF C1825C 500 Capacitance Case Size/ Series Z H C B D F G Z H C B D F G Z H Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions C1825C C2220C C2225C KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). 2 Available capacitance values available in X7R with KONNEKT Technology. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 8 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall (1825 – 2225 Case Sizes) cont. 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 3000 2000 HG HG HG HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HJ HJ HK HG HG HG HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HJ HJ HK HE HE HG HJ HJ HG HG HG HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HJ HJ HK HG HG HG HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HE HG HJ HJ HK HG HG HG HE HE HE HE HE HE HE HE HE HJ HJ HK HG HG HG HG HG HG HG HG HG HG HJ HJ HK HG HG HG HG HG JE JE JE JE JE JK JK JK JK JK JK JK JE JE JE JE JE JE JE JE JE JE JE JE JE JE JK JK JK JK JL JN JN JK JK JK JK JK JK JK JK JK JK JE JE JE JK JK JK JK JK JK JK JK JE JK JL JN JN JE JE JK JL JN JK JK JK JK JK JK JK JK JK JK JE JE JE JK JK JK JK JK JK JK JK JE JK JL JN JN JK JK JK JK JE JE JE JE JE JE JE JE JE JK JK JK JK JK JK JE JK JL JL JN JK JK JK JK JE JE JE JE JK JK JK JK JL JL JL JN JN JK JK JK JK JK JK JK JK JE JE JE JK JL JL JN JK JK JK JK JK JK JE JE JE JE JE JK JL JL JN KE KE KE KE KF KE KE KE KE KE KE KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KH KH KJ KE KE KE KE KE KE KE KF KF KF KF KE KE KE KE KE KF KF KF KF KF KF KF KF KH KH KJ KE KF KH KH KJ KJ KE KE KE KE KE KE KE KF KF KF KF KE KE KE KE KE KF KF KF KF KF KF KF KF KH KH KJ KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KF KJ KJ KJ KE KF KF KF KF KE KE KE KE KE KF KF KF KF KF KH KJ KJ KF KF KF KF KF KF KF KF KF KF KE KF KH KH KJ KF KF KF KF KF KE KE KE KE KE KE KF KH KH KJ Rated Voltage (VDC) 3000 H 2500 Z 2500 G 2000 F 1500 D 1000 B 630 C 500 H 3000 Z 2500 G 2000 F 1500 D 1000 B 630 C 500 H 3000 Z 2500 Cap Code G 2000 630 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 564 Capacitance Tolerance J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M F 1500 Rated Voltage (VDC) D 1500 B 1000 C C2225C 1000 Voltage Code C2220C 630 Capacitance Cap Code 500 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 µF 0.12 µF 0.15 µF 0.18 µF 0.22 µF 0.27 µF 0.33 µF 0.39 µF 0.47 µF 0.56 µF 0.56 µF C1825C 500 Capacitance Case Size/ Series Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H Case Size/Series Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions C1825C C2220C C2225C KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 9 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity1 Plastic Quantity Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel BB BD CG DG ED EF EG EJ FG FL FH FM FK FS LE LA LB LC GB GC GE GH GF GK GJ GN GL GM GS GO HE HG HJ HK JE JK JL JN KE KF KH KJ 0402 0402 0603 0805 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 2220 2220 2220 2220 2225 2225 2225 2225 0.50 ± 0.05 0.55 ± 0.05 0.80 ± 0.10* 1.25 ± 0.15 1.00 ± 0.10 1.20 ± 0.15 1.60 ± 0.15 1.70 ± 0.20 1.25 ± 0.15 1.40 ± 0.15 1.55 ± 0.15 1.70 ± 0.20 2.10 ± 0.20 2.50 ± 0.30 1.00 ± 0.10 1.40 ± 0.15 1.60 ± 0.15 2.00 ± 0.15 1.00 ± 0.10 1.10 ± 0.10 1.30 ± 0.10 1.40 ± 0.15 1.50 ± 0.10 1.60 ± 0.20 1.70 ± 0.15 1.70 ± 0.20 1.90 ± 0.20 2.00 ± 0.20 2.10 ± 0.20 2.50 ± 0.20 1.40 ± 0.15 1.60 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.40 ± 0.15 1.60 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.40 ± 0.15 1.60 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 10,000 10,000 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 50,000 50,000 15,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2,500 2,500 2,500 2,000 2,000 2,500 2,000 2,000 2,000 2,000 1,000 2,500 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 500 500 500 1,000 1,000 500 500 1,000 1,000 500 500 1,000 1,000 500 500 0 0 0 10,000 10,000 10,000 8,000 8,000 10,000 8,000 8,000 8,000 8,000 4,000 10,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 2,000 2,000 2,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000 Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape & Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 10 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0402 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 1.50 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 11 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. The KEMET recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish SnPb TP 100% Matte Sn Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax 100°C 150°C 60 – 120 seconds 150°C 200°C 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second maximum 3°C/second maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum 6°C/second maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 12 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Construction Detailed Cross Section Dielectric Material (BaTiO3) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Dielectric Material (BaTiO3) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 13 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Capacitor Marking (Optional) These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices, but must be requested using the correct ordering code identifier(s). If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters (per EIA–198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited to the “K” character only. Marking appears in legible contrast. Illustrated below is an example of an MLCC with laser marking of “KA8”, which designates a KEMET device with rated capacitance of 100 µF. Orientation of marking is vendor optional. KEMET ID 2-Digit Capacitance Code Laser marking option is not available on: • C0G, ultra stable X8R and Y5V dielectric devices. • EIA 0402 case size devices. • EIA 0603 case size devices with flexible termination option. • KPS commercial and automotive grade stacked devices. • X7R dielectric products in capacitance values outlined below. EIA Case Size Metric Size Code Capacitance 0603 0805 1206 1210 1808 1812 1825 2220 2225 1608 2012 3216 3225 4520 4532 4564 5650 5664 ≤ 170 pF ≤ 150 pF ≤ 910 pF ≤ 2,000 pF ≤ 3,900 pF ≤ 6,700 pF ≤ 0.018 µF ≤ 0.027 µF ≤ 0.033 µF © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 14 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Capacitor Marking (Optional) cont. Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral Alpha Character 9 A 0.10 1.0 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 1.2 12 120 1,200 12,000 D 0.13 1.3 13 130 1,300 E 0.15 1.5 15 150 1,500 0 1 2 3 4 5 6 7 8 100,000 1,000,000 10,000,000 100,000,000 110,000 1,100,000 11,000,000 110,000,000 120,000 1,200,000 12,000,000 120,000,000 13,000 130,000 1,300,000 13,000,000 130,000,000 15,000 150,000 1,500,000 15,000,000 150,000,000 160,000,000 Capacitance (pF) F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.20 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 470,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.50 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.60 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.70 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.90 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 15 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel ® Embossed plastic* or punched paper carrier. ET KEM Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm or 16 mm carrier tape 180 mm (7.00") or 330 mm (13.00") Anti-static cover tape (0.10 mm (0.004") maximum thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel 13" Reel Pitch (P1)* Punched Paper 7" Reel 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 and 2220 16 12 12 Array 0612 8 4 4 *Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 and 7 for tolerance specifications. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) Packaging Type/Options C-3190 C-3191 C-7081 C-7082 Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefits of Changing from 4 mm to 2 mm Pitching Spacing • Lower placement costs. • Double the parts on each reel results in fewer reel changes and increased efficiency. • Fewer reels result in lower packaging, shipping and storage costs, reducing waste. C1076_X7R_HV_AUTO_SMD • 12/12/2023 16 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 (10 pitches cumulative tolerance on tape ±0.2 mm) P0 A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 ØD1 Cover Tape User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) R Reference S1 Minimum T Note 2 Note 3 Maximum 25.0 (0.984) 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.024) 30 (1.181) E1 P0 P2 T1 Maximum 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm 16 mm B1 Maximum Note 4 4.35 Single (4 mm) (0.171) Single (4 mm) 8.2 and double (8 mm) (0.323) 12.1 Triple (12 mm) (0.476) Pitch E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 ±0.05 4.0 ±0.10 (0.138 ±0.002) (0.157 ±0.004) 5.5 ±0.05 8.0 ±0.10 (0.217 ±0.002) (0.315 ±0.004) 7.5 ±0.05 12.0 ±0.10 (0.138 ±0.002) (0.157 ±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 17 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.2 mm) A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) maximum R Reference Note 2 0.75 (0.030) 25 (0.984) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum F P1 T Maximum W Maximum A0 B 0 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 18 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Maximum Rotation ( 20 10 5 Figure 5 – Bending Radius Embossed Carrier 16 mm Tape ° S) Punched Carrier 1.0 mm maximum 1.0 mm maximum R © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R C1076_X7R_HV_AUTO_SMD • 12/12/2023 19 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/−0.0 (0.331 +0.059/−0.0) 12.4 +2.0/−0.0 (0.488 +0.078/−0.0) 16.4 +2.0/−0.0 (0.646 +0.078/−0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 20 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 21 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Application Guide Solder Fluxes and Cleaning The use of water-soluble fluxes provides advantages of excellent solderability due to high activation. However, these fluxes contain organic acids that can induce arcing under high DC or AC voltages. Notable problem areas are underneath the MLCC where flux can be trapped between the ceramic material and PCB. It is therefore critical that PCBs are properly cleaned to remove all flux residue to maintain reliability. Coating for High Voltage MLCCs For MLCC ratings ≥1500V, it is recommended to apply a conformal coating to MLCC to prevent surface arcing. To reduce possibility of inducing cracks in the MLCC, select a coating with thermal expansions close to that of the MLCC. Dielectric CTE (ppm/°C) Class II BaTiO3 10.7 Class I CaZrO3 9.8 Slits in PCB It is recommended to apply a slit in the PCB under the MLCC to improve washing of flux residue that may get trapped underneath. In some cases, it is not possible to slit entirely through the PCB due to underlying metal planes. It is also acceptable to apply a recessed slit under the MLCC which will also promote cleaning. • Recommended for case sizes ≥1206 • The width (w) of the slit should be 1mm • Length of the slit should be as short as possible to prevent damaging the MLCC due to mechanical stress of the PCB. • Slits also reduce the risk of solder balls under MLCC which decreased the creepage distance. Solder Resist If a slit cannot be applied as above, it is recommended to not use solder resist directly under the MLCC. The use of solder resist material reduces the distance between MLCC ceramic material and PCB thus making it difficult to clean. Solder Balls Improper reflow techniques and/or improper washing can induce solder balls under or adjacent to the MLCC. Solder balls reduce the creepage distance between the MLCC terminations and increase the risk of arcing or damage to the ceramic material. To reduce the risk of solder balls: • Follow KEMET’s solder recommendations as outlined in the datasheet. • If performing a cleaning procedure, properly clean the PCB per KEMET’s cleaning recommendations. • Add slit to the PCB as shown above. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 22 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer YAGEO Corporation and its affiliates do not recommend the use of commercial or automotive grade products for high reliability applications or manned space flight. All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 12/12/2023 23
C2220C823KFRACAUTO 价格&库存

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C2220C823KFRACAUTO
  •  国内价格 香港价格
  • 1+27.794561+3.37483
  • 10+21.3719910+2.59500
  • 50+19.6312050+2.38363
  • 100+16.27659100+1.97631

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C2220C823KFRACAUTO
  •  国内价格 香港价格
  • 500+13.08691500+1.58902
  • 1000+11.451101000+1.39040
  • 2500+11.042122500+1.34074
  • 5000+10.633145000+1.29108

库存:0