C2220Y332JGGACAUTO

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Overview KEMET’s Floating Electrode High Voltage with Flexible Termination capacitor (FF-CAP) combines two existing KEMET technologies– Floating Electrode and Flexible Termination. The floating electrode component utilizes a a cascading / serial electrode design configured to form multiple capacitors in series within a single monolithic structure. This unique configuration results in enhanced voltage and ESD performance over standard capacitor designs while allowing for a fail-open condition if mechanically damaged (cracked). The flexible termination component utilizes a conductive silver epoxy between the base metal and nickel barrier layers of KEMET’s standard termination system in order to establish pliability while maintaining terminal strength, solderability and electrical performance. Both technologies address the primary failure mode of MLCCs–flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. temperature. Capacitance change is limited to ±30 ppm/ºC from −55°C to +125°C. Whether under-hood or in-cabin, these capacitors are designed to provide reliable performance in mission and safety critical automotive circuits. Stricter testing protocol and inspection criteria have been established for automotive grade products in recognition of potentially harsh environmental conditions. KEMET automotive grade series capacitors meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements. Combined with the C0G (NP0) are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required, exhibit no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient Ordering Information C Ceramic 2225 Case Size Specification/ (L" x W") Series 0805 1206 1210 1808 1812 1825 2220 2225 1 1 Y Y = Floating Electrode with Flexible Termination 393 Capacitance Code (pF) Two significant digits and number of zeros J C G A C TU Failure Rate/ Capacitance Rated Voltage Packaging/ Termination Finish1 Dielectric Design Tolerance (VDC) Grade (C-Spec) B = ±0.10 pF C = ±0.25 pF D = ±0.5 pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% C = 500 B = 630 D = 1,000 F = 1,500 G = 2,000 Z = 2,500 H = 3,000 G = C0G A = N/A C = 100% Matte Sn L = SnPb (5% Pb minimum) See "Packaging C-Spec Ordering Options Table" Additional termination finish options may be available. Contact KEMET for details. SnPb termination finish option is not available on automotive grade product. Built Into Tomorrow © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Ordering Code (C-Spec) Packaging Type Commercial Grade1 Bulk Bag 7" Reel / Unmarked 13" Reel / Unmarked Not required (Blank) TU 7210 Automotive Grade2 7" Reel 13" Reel / Unmarked AUTO AUTO7210 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging. The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". 2 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information". 2 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". 2 All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". 1 1 Benefits • Floating Electrode/fail open design • AEC-Q200 automotive qualified • Operating temperature range of −55°C to +125°C • Superior flex performance (up to 5 mm) • Capacitance offerings ranging from 1 pF to 0.15 μF • DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV, 2.5 KV and 3 KV • EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220 and 2225 • Extremely low ESR and ESL • High ripple current capability • No capacitance shift with voltage • Negligible capacitance shift with respect to temperature • No piezoelectric noise • Lead (Pb)-Free, RoHS and REACH compliant Applications • EV/HEV (drive systems, charging) • High frequency power converters • Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems • Snubber (high dV/dT) • Resonant circuits (LLC, Wireless Charging, etc) • Timing • Filtering • ESD protection © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET product change notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence Process/Product change Obsolescence* Days Prior To Implementation KEMET assigned Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 1 Customer Notification Due To: KEMET Automotive C-Spec KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. PPAP Level KEMET Automotive C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO 1 ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part number specific PPAP available with customer information included. ○ Product family PPAP only © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) L W B T S EIA Size Code Metric Size Code 0805 2012 1206 3216 1210 3225 1808 4520 1812 4532 1825 4564 2220 5650 2225 5664 L Length W Width 2.00 (0.079) ±0.30 (0.012) 3.30 (0.130) ±0.40 (0.016) 3.30 (0.130) ±0.40 (0.016) 4.70 (0.185) ±0.50 (0.020) 4.50 (0.178) ±0.40 (0.016) 4.60 (0.181) ±0.40 (0.016) 5.90 (0.232) ±0.75 (0.030) 5.90 (0.232) ±0.75 (0.030) 1.25 (0.049) ±0.30 (0.012) 1.60 (0.063) ±0.35(0.013) 2.60(0.102) ±0.30(0.012) 2.00 (0.079) ±0.20 (0.008) 3.20 (0.126) ±0.30 (0.012) 6.40 (0.252) ±0.40 (0.016) 5.00 (0.197) ±0.40 (0.016) 6.40 (0.248) ±0.40 (0.016) T Thickness B Bandwidth See Table 2 for Thickness 0.50 (0.02) ±0.25 (0.010) 0.60 (0.024) ±0.25 (0.010) 0.60 (0.024) ±0.25 (0.010) 0.70 (0.028) ±0.35 (0.014) 0.70 (0.028) ±0.35 (0.014) 0.70 (0.028) ±0.35 (0.014) 0.70 (0.028) ±0.35 (0.014) 0.70 (0.028) ±0.35 (0.014) S Separation Minimum 0.75 (0.030) N/A Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) Case Size/ Series 630 1,000 500 630 1,000 1,500 2,000 500 630 1000 1500 2000 500 630 Capacitance Tolerance C G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K Rated Voltage (VDC) D M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M Voltage Code Case Size/Series 3000 Rated Voltage (VDC) DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES EF EF EF EU EU EU ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES ES EF EF EF EF EU EU EU EU EU EU EU EU EU FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FZ FZ FZ FZ FZ FZ FZ FZ FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FZ FZ FZ FZ FZ FZ FZ FZ FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FZ FZ FZ FZ FZ FZ FZ FZ FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FK FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FK LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LC LC LC LC LC LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LC LC LC LC LC LC LC LC LC LC LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LC LC LC LC 3000 H 2500 Z 2500 G 2000 F 2000 D 1500 B 1500 C 1000 G 1000 F 630 D 500 B 2000 C 1500 G 1000 F 630 D 500 B 2,000 C 1,500 D 1,000 B 630 Capacitance Code C 500 Capacitance B F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F Voltage Code 1,000 109 - 169* 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 101 111 121 131 151 161 181 201 221 241 C1808Y 630 1.0 - 9.1 pF* 10 pF 11 pF 12 pF 13 pF 15 pF 16 pF 18 pF 20 pF 22 pF 24 pF 27 pF 30 pF 33 pF 36 pF 39 pF 43 pF 47 pF 51 pF 56 pF 62 pF 68 pF 75 pF 82 pF 91 pF 100 pF 110 pF 120 pF 130 pF 150 pF 160 pF 180 pF 200 pF 220 pF 240 pF C1210Y 500 Capacitance Code C1206Y 500 Capacitance C0805Y C B D C B D F G C B D F G C B D F G Z H C0805Y Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions C1206Y C1210Y C1808Y These products are protected under US Patent 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) cont. Case Size/ Series 1,000 500 630 1,000 1,500 2,000 500 630 1000 1500 2000 500 630 3000 DG DG DG ES ES ES ES ES ES ES ES ES EU EU EU EU EU EU ES ES ES ES ES ES ES ES ES EU EU EU EU EU EU ES EF EF EF EF EU EU EU EU EU EU EU EU EU EU EU EU EU EU EU EU EU EU EU EU FZ FZ FZ FZ FZ FM FM FM FM FM FM FM FM FM FM FK FK FS FS FS FS FS FS FS FS FZ FZ FZ FZ FZ FM FM FM FM FM FM FM FM FM FM FK FK FS FS FS FS FS FS FS FS FZ FZ FZ FZ FZ FM FM FM FM FM FM FM FM FM FM FK FK FS FS FS FS FS FS FS FS FK FK FK FK FK FS FS FS FS FS FS FS FS FS FS FS FS FK FK FK FS FS FS FS FS FS FS FS LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LC LC LC LC LC LC LB LB LC LC LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LC LC LC LC LC LC LB LB LC LC LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LC LC LC LC LC LC LB LB LC LC LB LB LB LB LB LC LC LC LC LA LA LB LB LB LB LC LC LC LC LC LC LC LA LA LA LA LB LB LC LC LC LC LC LC LC 3000 630 2500 Rated Voltage (VDC) 2500 H 2000 Z 2000 G 1500 F 1500 D 1000 B 1000 C 630 G 500 F 2000 D 1500 B 1000 C 630 G 500 F 2,000 D 1,500 B 1,000 C 630 D 500 B 1,000 C 630 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 Capacitance Capacitance Code F F F F F F F F F F F F F F F F F F F F F F F F F C1808Y Voltage Code C B D C B D F G C B D F G C B D F G Z H Capacitance Tolerance 270 pF 300 pF 330 pF 360 pF 390 pF 430 pF 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF C1210Y 500 Capacitance Code C1206Y 500 Capacitance C0805Y G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K Rated Voltage (VDC) Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions M M M M M M M M M M M M M M M M M M M M M M M M M Voltage Code Case Size/Series C0805Y C1206Y C1210Y C1808Y These products are protected under US Patent 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) Case Size/ Series 2500 2500 1500 2000 3000 1000 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GK GK GK GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GK GK GK GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GK GK GK GB GB GB GB GB GB GD GD GD GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GK 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JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JL KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF 3000 500 630 2000 3000 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GK GK GK GB GB GB GB GB GB GB GB GB 2500 2500 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GK GK GK GB GB GB GB GB GB GB GB GB 2000 1500 2000 1500 1000 F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M Rated Voltage (VDC) 1500 500 630 H 1000 Z 630 G 1000 F 500 D 500 B 3000 C 2500 H 3000 Z 2000 G 1500 F 1000 D 630 B 500 C 3000 H 2500 Z 1500 G 2000 F 1000 D 630 2000 B 500 1500 C 630 1000 H 2500 500 630 Z 3000 G 3000 F 2500 Capacitance Code D 2000 Capacitance B 1500 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 101 111 121 131 151 161 181 201 221 241 271 301 331 361 391 431 Rated Voltage (VDC) C C2225Y 1000 10 pF 11 pF 12 pF 13 pF 15 pF 16 pF 18 pF 20 pF 22 pF 24 pF 27 pF 30 pF 33 pF 36 pF 39 pF 43 pF 47 pF 51 pF 56 pF 62 pF 68 pF 75 pF 82 pF 91 pF 100 pF 110 pF 120 pF 130 pF 150 pF 160 pF 180 pF 200 pF 220 pF 240 pF 270 pF 300 pF 330 pF 360 pF 390 pF 430 pF Voltage Code C2220Y 500 Capacitance Code C1825Y 630 Capacitance C1812Y Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H C B D F G Z H Capacitance Tolerance Case Size/ Series C1812Y Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions C1825Y C2220Y C2225Y These products are protected under US Patent 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont. Case Size/ Series 1000 1500 2000 2500 2500 500 630 3000 3000 HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HG HG HG HG HJ HJ HJ HJ HK HK HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HE HE HE HE HG HG HJ HJ HJ HJ HK HK HE HG HG HG HG HG HG HG HG HG HG HE HE HG HG HJ HJ HK HK HK HK HE HE HE HG HG HG HG HG HG HJ HJ HK HK HJ HJ HJ HK HK JE JK JK JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JL JL JL JL JN JE JK JK JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JL JL JL JL JN JE JK JK JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JL JL JL JL JN JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JK JK JK JK JL JL JN JN JN JN JE JK JK JK JK JK JK JK JK JK JK JE JE JE JE JK JK JL JL JN JN JN JN JK JK JK JK JK JK JK JK JK JL JL JL JL JN JN JL JL JL JL JL JN JN JN JN KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KH KH KH KJ KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KH KH KH KJ KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KH KH KH KJ KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KF KF KH KH KH KH KJ KJ KE KE KE KE KE KE KE KE KE KF KF KF KF KE KE KF KF KH KH KJ KJ KJ KJ KE KE KE KF KF KF KF KF KF KF KF KH KH KH KH KJ KJ KF KF KF KH KH KJ KJ KJ KJ 3000 2500 2000 1500 2000 HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HG HG HG HG HJ HJ HJ HJ HK HK 2500 1000 HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HG HG HG HG HJ HJ HJ HJ HK HK 2000 500 1500 H 1500 Z 630 G 1000 F 630 D 1000 B 500 C 500 H 3000 Z 2500 G 3000 F 2000 D 1500 B 1000 C 630 H 500 Z 3000 G 2500 F 1500 D 2000 B 1000 C 630 H H C B D F G Z H C B D F G Z H C B D F G Z H GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GH GH GK GK GK GK GM GM GO GO GO GO GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GH GH GK GK GK GK GM GM GO GO GO GO GB GD GD GD GD GD GD GH GH GH GH GH GH GM GM GO GO GO GO GD GH GH GH GH GK GK GM GM GO GO GO GO GK GM GM GO GO 1500 2000 2500 Capacitance Code GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GH GH GK GK GK GK GM GM GO GO GO GO 1000 Capacitance F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M F G J K M Rated Voltage (VDC) 500 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 123 153 Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 630 Capacitance Tolerance 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF Voltage Code C B D F G Z Case Size/ Series C2225Y 500 2000 Z C2220Y 630 G 2500 F 3000 D C1825Y 3000 B 1500 Rated Voltage (VDC) C 1000 Voltage Code 500 Capacitance Code 630 Capacitance C1812Y C1812Y C1825Y C2220Y C2225Y These products are protected under US Patent 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity1 Plastic Quantity Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel DG ES EF EU FZ FM FK FS LA LB LC GB GD GH GK GM GO HE HG HJ HK JE JK JL JN KE KF KH KJ 805 1206 1206 1206 1210 1210 1210 1210 1808 1808 1808 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 2220 2220 2220 2220 2225 2225 2225 2225 1.25 ± 0.15 1.00 ± 0.20 1.20 ± 0.15 1.60 ± 0.25 1.25 ± 0.20 1.70 ± 0.20 2.10 ± 0.20 2.50 ± 0.30 1.40 ± 0.15 1.60 ± 0.15 2.00 ± 0.15 1.00 ± 0.10 1.25 ± 0.15 1.40 ± 0.15 1.60 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.40 ± 0.15 1.60 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.40 ± 0.15 1.60 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.40 ± 0.15 1.60 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2,500 2,500 2,500 2,000 2,500 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 500 1,000 1,000 500 500 1,000 1,000 500 500 1,000 1,000 500 500 10,000 10,000 10,000 8,000 10,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000 Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec1 N/A 2 Case Size Packaging Quantities (pieces/unit packaging) EIA (in) Metric (mm) 0402 0603 0805 1206 1210 1808 1005 1608 2012 3216 3225 4520 1812 1825 2220 2225 4532 4564 5650 5664 Minimum Maximum 50,000 1 20,000 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products. 2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. 1 © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0805 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81 1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16 1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11 1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00 2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60 2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7.20 7.00 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X C V2 X C Grid Placement Courtyard © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax Termination Finish SnPb TP 100% Matte Sn Ramp-Up Rate (TL to TP) 100°C 150°C 60 – 120 seconds 3°C/second maximum 150°C 200°C 60 – 120 seconds 3°C/second maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds 30 seconds maximum maximum 6°C/second 6°C/second Ramp-Down Rate (TP to TL) maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Visual and Mechanical KEMET Internal Capacitance (Cap) KEMET Internal Test Condition No defects that may affect performance (10X) C ≤ 1,000 pF Frequency: 1 MHz ±100 kHz Voltage*:1.0 Vrms ±0.2 V C > 1,000 pF Frequency: 1 kHz ±50 Hz Voltage: 1.0 Vrms ±0.2 V Limits Dimensions according KEMET Spec Sheet Within Tolerance * See part number specification sheet for voltage Dissipation Factor (DF) KEMET Internal C ≤ 1,000 pF Frequency: 1 MHz ±100 kHz Voltage*: 1.0 Vrms ±0.2 V C > 1,000 pF Frequency: 1 kHz ±50 Hz Voltage: 1.0 Vrms ±0.2 V Within Specification Dissipation factor (DF) maximum limit at 25°C = 0.1% * See part number specification sheet for voltage Insulation Resistance (IR) KEMET Internal 500 VDC applied for 120 ±5 seconds at 25°C Within Specification To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits: 1,000 megohm microfarads or 100 GΩ. Capacitance change with reference to +25°C and 0 VDC applied. Temperature Coefficient of Capacitance (TCC) * See part number specification sheet for voltage KEMET Internal Step Temperature (°C) 1 +25°C 2 −55°C 3 +25°C (Reference Temperature) 4 +125°C © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Within Specification: ±30 ppm / °C C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions cont. Stress Reference Test Condition Limits See Dielectric Withstanding Voltage (DWV) Table (5 ±1 seconds and charge/discharge not exceeding 50 mA) EIA Case Size Dielectric Withstanding Voltage (DWV) KEMET Internal 500 V 0603 130% of rated voltage 0805 < 620pF 150% of rated voltage ≥ 620pF 130% of rated voltage < 5.1nF 150% of rated voltage ≥ 5.1nF 130% of rated voltage < 7.5nF 150% of rated voltage ≥ 7.5nF 130% of rated voltage < 5.1nF 150% of rated voltage ≥ 5.1nF 130% of rated voltage < 12nF 150% of rated voltage ≥ 12nF 130% of rated voltage < 22nF 150% of rated voltage ≥ 22nF 130% of rated voltage < 27nF 150% of rated voltage ≥ 27nF 130% of rated voltage < 33nF 150% of rated voltage ≥ 33nF 130% of rated voltage 1206 1210 1808 1812 150% of rated voltage 1825 2220 2225 Aging Rate (Maximum % Capacitance Loss/Decade Hour) 630 V KEMET Internal ≥ 1,000 V Cap: Initial Limit DF: Initial Limit IR: Initial Limit 120% of rated voltage Maximum % capacitance loss/decade hour Withstand test voltage without insulation breakdown or damage. 0% Loss/Decade Hour Shear stress test per specific case size, Time: 60 ±1 second. Terminal Strength KEMET Internal Case Size Force 0603 5N 0805 9N ≥ 1206 18N Standard Termination System 2.0 mm Flexible Termination System 3.0 mm Test Time: 60± 5 seconds Ramp Time: 1 mm/second Board Flex AEC-Q200-005 Solderability J-STD-002 Condition: 4 hours ±15 minutes at 155°C dry bake apply all methods Test 245 ±5°C (SnPb & Pb-Free) Temperature Cycling JESD22 Method JA-104 1,000 cycles (−55°C to +125°C) 2 - 3 cycles per hour Soak Time: 1 or 5 minute © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com No evidence of mechanical damage No evidence of mechanical damage Visual Inspection. 95% coverage on termination. No leaching Measurement at 24 hours ±4 hours after test conclusion. Cap: Initial Limit DF: Initial Limit IR: Initial Limit C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions cont. Stress Reference Test Condition Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum Biased Humidity MIL-STD-202 Method 103 Moisture Resistance MIL-STD-202 Method 106 Number of Cycles Required: 10, 24 hours per cycle. Steps 7a and 7b not required Thermal Shock MIL-STD-202 Method 107 Number of Cycles Required: 5, (−55°C to 125°C) Dwell time 15 minutes. High Temperature Life Storage Life MIL-STD-202 Method 108 Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Limits Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Cap: Initial Limit DF: Initial Limit IR: Initial Limit Cap: Initial Limit DF: Initial Limit IR: Initial Limit 1,000 hours at 150°C, Unpowered Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% 1,000 hours at 125°C with 1.2 X rated voltage applied. Vibration MIL-STD-202 Method 204 5 g's for 20 minutes, 12 cycles each of 3 orientations. Test from 10 – 2,000 Hz Cap: Initial Limit DF: Initial Limit IR: Initial Limit Mechanical Shock MIL-STD-202 Method 213 1,500 g’s 0.5 millisecond Half-sine, Velocity Change: 15.4 feet/second (Condition F) Cap: Initial Limit DF: Initial Limit IR: Initial Limit Resistance to Solvents MIL-STD-202 Method 215 Add Aqueous wash chemical OKEMCLEAN (A 6% concentrated Oakite cleaner) or equivalent. Do not use banned solvents. Visual Inspection 10X Readable marking, no decoloration or stains. No physical damage. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Construction Detailed Cross Section Dielectric Material (CaZrO3) Barrier Layer End Termination/ (Ni) External Electrode Termination Finish (Cu) (100% Matte Sn / Epoxy Layer SnPb - 5% Pb min) (Ag) Dielectric Material (CaZrO3) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Inner Electrodes (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Capacitor Marking (Optional) Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel ® Embossed plastic* or punched paper carrier. ET KEM Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm or 16 mm carrier tape 180 mm (7.00") or 330 mm (13.00") Anti-static cover tape (0.10 mm (0.004") maximum thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel 13" Reel Pitch (P1)* Punched Paper 7" Reel 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 and 2220 16 12 12 Array 0612 8 4 4 *Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 and 7 for tolerance specifications. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) Packaging Type/Options C-3190 C-3191 C-7081 C-7082 Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefits of Changing from 4 mm to 2 mm Pitching Spacing • Lower placement costs. • Double the parts on each reel results in fewer reel changes and increased efficiency. • Fewer reels result in lower packaging, shipping and storage costs, reducing waste. C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 (10 pitches cumulative tolerance on tape ±0.2 mm) P0 A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 ØD1 Cover Tape User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) R Reference S1 Minimum T Note 2 Note 3 Maximum 25.0 (0.984) 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.024) 30 (1.181) E1 P0 P2 T1 Maximum 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm 16 mm B1 Maximum Note 4 4.35 Single (4 mm) (0.171) Single (4 mm) 8.2 and double (8 mm) (0.323) 12.1 Triple (12 mm) (0.476) Pitch E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 ±0.05 4.0 ±0.10 (0.138 ±0.002) (0.157 ±0.004) 5.5 ±0.05 8.0 ±0.10 (0.217 ±0.002) (0.315 ±0.004) 7.5 ±0.05 12.0 ±0.10 (0.138 ±0.002) (0.157 ±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.2 mm) A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) maximum R Reference Note 2 0.75 (0.030) 25 (0.984) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum F P1 T Maximum W Maximum A0 B 0 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 19 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Maximum Rotation ( 20 10 5 Figure 5 – Bending Radius Embossed Carrier 16 mm Tape ° S) Punched Carrier 1.0 mm maximum 1.0 mm maximum R © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 20 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/−0.0 (0.331 +0.059/−0.0) 12.4 +2.0/−0.0 (0.488 +0.078/−0.0) 16.4 +2.0/−0.0 (0.646 +0.078/−0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 21 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 22 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) Application Guide Solder Fluxes and Cleaning The use of water-soluble fluxes provides advantages of excellent solderability due to high activation. However, these fluxes contain organic acids that can induce arcing under high DC or AC voltages. Notable problem areas are underneath the MLCC where flux can be trapped between the ceramic material and PCB. It is therefore critical that PCBs are properly cleaned to remove all flux residue to maintain reliability. Coating for High Voltage MLCCs For MLCC ratings ≥1500V, it is recommended to apply a conformal coating to MLCC to prevent surface arcing. To reduce possibility of inducing cracks in the MLCC, select a coating with thermal expansions close to that of the MLCC. Dielectric CTE (ppm/°C) Class II BaTiO3 10.7 Class I CaZrO3 9.8 Slits in PCB It is recommended to apply a slit in the PCB under the MLCC to improve washing of flux residue that may get trapped underneath. In some cases, it is not possible to slit entirely through the PCB due to underlying metal planes. It is also acceptable to apply a recessed slit under the MLCC which will also promote cleaning. • Recommended for case sizes ≥1206 • The width (w) of the slit should be 1mm • Length of the slit should be as short as possible to prevent damaging the MLCC due to mechanical stress of the PCB. • Slits also reduce the risk of solder balls under MLCC which decreased the creepage distance. Solder Resist If a slit cannot be applied as above, it is recommended to not use solder resist directly under the MLCC. The use of solder resist material reduces the distance between MLCC ceramic material and PCB thus making it difficult to clean. Solder Balls Improper reflow techniques and/or improper washing can induce solder balls under or adjacent to the MLCC. Solder balls reduce the creepage distance between the MLCC terminations and increase the risk of arcing or damage to the ceramic material. To reduce the risk of solder balls: • Follow KEMET’s solder recommendations as outlined in the datasheet. • If performing a cleaning procedure, properly clean the PCB per KEMET’s cleaning recommendations. • Add slit to the PCB as shown above. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 23 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode (FF-CAP), High Voltage with Flexible Termination C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer YAGEO Corporation and its affiliates do not recommend the use of commercial or automotive grade products for high reliability applications or manned space flight. All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1126_C0G_HV_FF-CAP_SMD • 12/12/2023 24