C3040H683JBGACT050

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Overview KEMET’s High Voltage-High Temperature (HV-HT) series surface mount C0G Multilayer Ceramic Capacitors (MLCCs) are constructed of a robust and proprietary base metal electrode (BME) dielectric system that offers industryleading performance at extreme temperatures. These surface mountable devices feature a 200ºC maximum operating temperature and are specifically designed to withstand the demands of harsh industrial environments such as oil exploration and automotive/avionics engine compartment circuitry. They also offer higher and more uniform breakdown voltage performance than competitive products, resulting in increased yields in customer field applications. When dealing with expensive high temperature circuitry and systems, higher yields can quickly result in significant cost savings. capacitance with respect to time and voltage and boast a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30ppm/ºC from −55°C to +200°C. In addition, these capacitors exhibit high insulation resistance with low dissipation factor at elevated temperatures up to 200°C. They also exhibit low ESR at high frequencies and offer superior volumetric efficiency over competitive high temperature precious metal electrode (PME) and base metal electrode (BME) dielectric system devices. These devices are Lead (Pb)-free, RoHS and REACH compliant without the need of any exemptions. KEMET’s HV-HT series MLCCs are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. They exhibit no change in Click image above for interactive 3D content Ordering Information C Ceramic 2225 Case Size Specification/ (L" x W") Series 0805 1206 1210 1808 1812 1825 2220 2225 2824 3040 3640 4540 1 2 H H = High Temperature (200°C) Open PDF in Adobe Reader for full functionality 393 Capacitance Code (pF) Two significant digits and number of zeros. J C G A Capacitance Rated Voltage Failure Rate/ Dielectric (VDC) Design Tolerance1 B = ±0.10 pF C = ±0.25 pF D = ±0.5 pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% C = 500 B = 630 D = 1,000 F = 1,500 G = 2,000 G = C0G A = N/A C TU Termination Finish2 Packaging/ Grade (C-Spec) C = 100% Matte Sn L = SnPb (5% Pb minimum) E = Gold (Au) 1.97 – 11.8 µin F = Gold (Au) 30 – 50 µin G = Gold (Au) 100 µin minimum See “Packaging C-Spec Ordering Options Table” below Additional capacitance tolerance offerings may be available. Contact KEMET for details. Gold(Au) termination finish options are not available on 2824, 3040, 3640 and 4540 case sizes. One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Packaging C-Spec Ordering Options Table Termination Finish Options Packaging Type/Options Packaging Ordering Code (C-Spec) Standard Packaging – Unmarked3 Bulk Bag Waffle Tray 2 7" Tape & Reel C = 100% Matte Sn L = SnPb (5% Pb min.) F = Gold (Au) 30 – 50 µin G = Gold (Au) 100 µin minimum 7” Tape & Reel/2 mm pitch4 7" Tape & Reel – 50 pcs 7" Tape & Reel – 100 pcs 7" Tape & Reel – 250 pcs Blank1 7292 TU 7411 (EIA 0603 and smaller case sizes) 7210 (EIA 0805 and larger case sizes) 7081 T050 T100 T250 7" Tape & Reel – 500 pcs 7" Tape & Reel – 1,000 pcs T500 T1K0 13" Reel Moisture Sensitive Packaging5 – Unmarked3 E = Gold (Au) 1.97 – 11.8 µin F = Gold (Au) 30 – 50 µin G = Gold (Au) 100 µin minimum Waffle Tray 2 7" Tape & Reel 7" Tape & Reel – 50 pcs 7" Tape & Reel – 100 pcs 7" Tape & Reel – 250 pcs 7" Tape & Reel – 500 pcs 7" Tape & Reel – 1,000 pcs 7282 7130 Contact KEMET6 Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging. “Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric). 2 “Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric). 3 The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. 3 Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 through 2225 case size devices with chip thickness of ≥ 1.9mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options may be available. Contact KEMET for details. 4 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”. 5 Moisture sensitive packaging is required for Gold (Au) termination option “E” (1.97 µin min / 11.8 µin max.). Not available for case sizes larger than 2225 (5664 Metric). 6 Additional reeling or packaging options may be available. Contact KEMET for details. 1 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Benefits • Operating temperature range of −55°C to +200°C • Lead (Pb)-free, RoHS, and REACH compliant • EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225, 2824, 3040, 3640, and 4540 case sizes • DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, and 2 KV • Capacitance offerings ranging from 1 pF to 0.150 μF • Available capacitance tolerances of ±0.10 pF, ±0.25 pF, ±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20% • No piezoelectric noise • Extremely low ESR and ESL • High thermal stability • High ripple current capability • No capacitance change with respect to applied rated DC voltage • Negligible capacitance change with respect to temperature from −55°C to +125°C • No capacitance decay with time • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated termination finish allowing for excellent solderability • SnPb plated termination finish option available upon request (5% Pb minimum) • Gold (Au), Tin/Lead (Sn/Pb) and 100% pure matte Tin (Sn) termination finishes available Applications Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, switch mode power supplies (input filters, resonators, tank circuits, snubbed circuits, output filters), high voltage coupling, DC blocking and voltage multiplier circuits in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes. Markets include power supply, HID lighting, industrial equipment/control, automotive, aerospace, and munitions. Qualification/Certification High temperature (200ºC) Industrial grade products meet or exceed the requirements outlined in Table 4, Performance & Reliability. Qualification packages are available for review and download on our website at www.kemet.com/hightemp Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Dimensions – Millimeters (Inches) L W B T S EIA Size Code Metric Size Code 0805 2012 1206 3216 1210 3225 1808 4520 1812 4532 1825 4564 2220 5650 2225 5664 2824 7260 3040 7610 3640 9210 4540 - L Length W Width 2.00 (0.079) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 4.70 (0.185) ±0.50 (0.020) 4.50 (0.177) ±0.30 (0.012) 4.50 (0.177) ±0.30 (0.012) 5.70 (0.224) ±0.40 (0.016) 5.60 (0.220) ±0.40 (0.016) 7.10 (0.280) ±0.40 (0.016) 7.60 (0.300) ±0.40 (0.016) 9.10 (0.358) ±0.40 (0.016) 11.40 (0.449) ±0.40 (0.016) 1.25 (0.049) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008) 2.50 (0.098) ±0.20 (0.008) 2.00 (0.079) ±0.20 (0.008) 3.20 (0.126) ±0.30 (0.012) 6.40 (0.252) ±0.40 (0.016) 5.00 (0.197) ±0.40 (0.016) 6.40 (0.248) ±0.40 (0.016) 6.10 (0.240) ±0.40 (0.016) 10.20 (0.402) ±0.40 (0.016) 10.20 (0.402) ±0.40 (0.016) 10.20 (0.402) ±0.40 (0.016) T Thickness B Bandwidth See Table 2 for Thickness 0.50 (0.02) ±0.25 (0.010) 0.50 (0.02) ±0.25 (0.010) 0.50 (0.02) ±0.25 (0.010) 0.60 (0.024) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014) 1.27 (0.050) ±0.40 (0.016) 1.27 (0.050) ±0.40 (0.016) 1.27 (0.050) ±0.40 (0.016) 1.27 (0.050) ±0.40 (0.016) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com S Separation Minimum 0.75 (.030) N/A Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only C1069_C0G_HV_HT_200C • 8/10/2016 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) 1 2 3 Dissipation Factor (DF) Maximum Limit at 25ºC Insulation Resistance (IR) Minimum Limit at 25°C −55°C to +200°C ±30 ppm/ºC (up to +200ºC) 0% 150% of rated voltage for voltage rating of < 1000 V 120% of rated voltage for voltage rating of ≥ 1000 V (5±1 seconds and charge/discharge not exceeding 50 mA) 0.1% 1000 megohm microfarads or 100 GΩ (500 VDC applied for 120±5 seconds at 25°C) DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2 Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF 1 kHz ± 50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF 3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." 1 Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) Capacitance Shift C0G All All 0.5 0.3% or ±0.25 pF Insulation Resistance 10% of Initial Limit © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) Case Size/Series C0805H 1000 1500 2000 LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LA LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LC LC LC LC LC LC LA LA LA LA LA LA LB LB LC LC LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LA LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LC LC LC LC LC LC LB LB LB LC LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LB LB LB LB LB LB LC LC LC LC LA LA LA LA LA LB LB LC LC LC LB LB LB LB LB LB LB LB LB LB LB LB LB LB LC LC LC LC LC LC LC LC LA LA LA LA LB LB LC LC 1500 2000 500 LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LA LA LA LA LA LA LA LA LA LA LA LB LB LB LB LB LC LC LC LC LC LC LC LC LC LC LA LA LA LA LA LA 1000 2000 630 G 630 F 500 D G C B D F G ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED EF EF EF EF EF EF EG EG EG EG ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED EF EF EF EF EG EG EG EG EG EG ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED ED EF EF EF EF EF EG EG EG EG EG EG EG EG EG ED ED ED ED ED ED ED ED ED ED ED ED EF EF EF EF EG EG EG EG EG EG EG EG EG EG EG ED ED ED ED ED EF EF EF EF EG EG EG EG EG EG EG EG EG EG FM FM FM FM FM FM FM FM FM FM FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FM FM FM FM FM FK FK FK FK FK FS FS FS FS FL FL FM FM FM FM FM FM FM FM FM FM FM FM FG FG FG FG FG FG FG FG FG FG FG FG FG FM FM FM FM FM FM FM FM FM FM FK FK FS FS FS FS FL FL FL FL FL FM FM FY FY FY FM FM FM FM FM FM FM FM FM FM FG FG FG FG FG FG FG FG FG FG FG FG FG FM FM FM FM FM FM FM FM FM FM FK FK FS FS FS FS FS FS FS FS FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FK FK FK FK FK FS FS FS FS FS FS FM FM FY FY FS FS FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FK FK FK FS FS FS FS FS FS FS FS 1000 1500 Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 630 B B 500 C C 2000 Voltage Code M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M G 1500 Rated Voltage (VDC) K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K F 1000 DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J D 2000 630 DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G B 1500 500 DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F C 1000 1000 D G 630 630 C Capacitance Tolerance F 500 Rated Voltage (VDC) D 2000 B 1500 C 1000 D 630 Capacitance Cap Code B B C1808H 500 109 - 919* 100 - 470* 510 560 620 680 750 820 910 101 111 121 131 151 161 181 201 221 241 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 C C1210H 1000 1.0 - 9.1 pF* 10 pF - 47pF* 51 pF 56 pF 62 pF 68 pF 75 pF 82 pF 91 pF 100 pF 110 pF 120 pF 130 pF 150 pF 160 pF 180 pF 200 pF 220 pF 240 pF 270 pF 300 pF 330 pF 360 pF 390 pF 430 pF 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF C1206H Voltage Code 630 Cap Code 500 Capacitance C0805H 500 Case Size/Series D C B D F G C B D F C1206H C1210H C1808H *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) cont’d 1500 2000 1500 2000 500 1000 2000 1000 1500 630 1000 630 630 500 G 2000 F 1500 D 1000 B 630 C 500 630 G 500 500 F 2000 1000 D 1500 630 B 2000 Capacitance Cap Code C 1500 512 562 622 682 752 822 G Rated Voltage (VDC) Voltage Code C B D C B D F G C B D F G C B D F G Capacitance Tolerance 5,100 pF 5,600 pF 6,200pF 6,800pF 7,500pF 8,200 pF C1808H F 1000 Rated Voltage (VDC) C1210H D 1000 B 630 C 500 D 1000 B 630 Cap Code C1206H C 500 Capacitance C0805H Voltage Code 500 Case Size/Series F F F F F F G G G G G G J J J J J J Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions K K K K K K Case Size/Series M M M M M M C0805H C1206H FY FY FY FY FS FS FS FS LA LB LC LC C1210H C1808H *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) 500 630 1000 1500 2000 500 630 1000 1500 2000 2000 2000 GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GH GH GH GH GH GH GK GK GK GK GH GH GH GH GH GH GH GH GK GK GK GK GK GK GK GK GH GH GH GH GH GH GH GH GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GH GH GH GH GH GH GK GK GK GK GH GH GH GH GH GH GH GH GK GK GK GK GK GK GK GK GK GK GK GK GM GM GO GO GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GH GH GH GH GH GH GK GK GK GK GK GK GK GK GK GK GH GH GH GH GH GK GK GM GM GO GO GO GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GH GH GH GH GH GH GH GK GK GK GH GH GH GH GK GK GM GM GO GO GO GO HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HG HG HJ HJ HJ HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HE HE HG HG HJ HJ HJ HK HK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JE JE JE JE JE JE JE JE JE JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JK JL JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JK JK JK JK JK JK JK JK JK JE JE JE JE JK JK JL JL JL JN JN JN KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KE KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KE KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KE KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KF KF KF KH KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KE KE KE KF KH KH KH KJ KJ KJ Rated Voltage (VDC) 2000 1500 1500 1000 GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GH GH GH GH GH GH GK GK GK GK GH GH GH GH GH GH GH GH GH GH GH GK GK GK GK GK GK GK GK GK GK GK GH GH 1500 630 1000 Rated Voltage (VDC) 1000 G 630 F 630 D 500 B 500 C 2000 G 1500 F 1000 D 630 B 500 C 2000 G 1500 F 1000 D 630 B 500 C 2000 G 1500 F 1000 100 - 470* 510 560 620 680 750 820 910 101 111 121 131 151 161 181 201 221 241 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 Capacitance Cap Code C2225H D Voltage Code C B D F G C B D F G C B D F G C B D F G Capacitance Tolerance 10 pF - 47pF* 51 pF 56 pF 62 pF 68 pF 75 pF 82 pF 91 pF 100 pF 110 pF 120 pF 130 pF 150 pF 160 pF 180 pF 200 pF 220 pF 240 pF 270 pF 300 pF 330 pF 360 pF 390 pF 430 pF 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF C2220H B 630 Cap Code C1825H C 500 Capacitance C1812H Voltage Code 500 Case Size/Series F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K Case Size/Series M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M C1812H Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions C1825H C2220H C2225H *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont’d G C B D F Rated Voltage (VDC) 1500 2000 500 630 1000 1500 2000 500 630 1000 1500 2000 C1812H G C B D F JK JK JE JK JK JL JL JL JN JL JN JN JN 1500 F JK JK JE JE JE JE JE JE JK JL JL JN JN 1000 D JK JK JK JK JK JK JE JE JE JE JE JK JL JN 630 B HK HK 500 C HG HG HG HJ HJ HJ HK HK 2000 Voltage Code HE HE HE HE HE HE HG HG HG HJ HK 1500 Rated Voltage (VDC) HG HG HG HG HG HG HE HE HE HE HG HJ HJ HK 1000 GO GO Case Size/Series M M M M M M 630 K K K K K K 500 GK GK GK GM GM GO GO GO 1500 J J J J J J 2000 GH GH GH GH GH GK GM GM GO GO 1000 G G G G G G KE KE KE KE KF KF KF KF KE KE KE KF KF KH KJ KF KF KF KF KE KE KE KE KE KF KH KJ KJ KF KF KF KF KF KF KH KH KH KJ KH KH KJ KJ G C B D F G Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 630 Capacitance Cap Code F F F F F F G 2000 F 2000 D 1500 B 1500 C 1000 G 1000 F 630 D 630 B 500 C 500 G 2000 F 500 512 562 622 682 752 822 912 103 123 153 183 223 273 333 393 C2225H D Capacitance Tolerance 5,100 pF 5,600 pF 6,200pF 6,800pF 7,500pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF C2220H B 1000 Cap Code C1825H C 630 Capacitance C1812H Voltage Code 500 Case Size/Series G C B D F C1825H C2220H C2225H *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1C – Capacitance Range/Selection Waterfall (2824 – 4540 Case Sizes) 1500 2000 TA TA TA TA TA TA TA TA TA TA TA TA QB QB QB QB QB TA TA TA TA TB QB QB QB QB QB MA MA MA MA MA TA TA TA TB TB QB QB QB QB QB MA MA MA MA MA SA SA SA SA SA TA TA TA TB TC QB QB QB QB QB MA MA MA MA MA SA SA SA SA SA TA TA TA TB QB QB QB QB QC MA MA MA MA MA SA SA SA SA SA TA TA TA TC QB QB QB QC QC MA MA MA MA MB SA SA SA SA SA TA TA TA TA TA TA TB TB TB TC TA TA TA TA TB TB TB TC TA TA TB TB TC QB QB QB QB QB QB QB QB QB QC QC QC QD QB QB QB QB QB QB QC QC QC QD QD QB QB QB QB QC QC QC QD QC QD QD QD MA MA MA MA MA MA MA MA MA MA MB MB MC MC MA MA MA MA MA MA MA MA MB MB MC MA MA MA MA MA MA MB MB MC MA MB MB MC MB MB MC SA SA SA SA SA SA SA SA SA SA SA SA SB SB SC SA SA SA SA SA SA SA SA SA SA SB SB SC SA SA SA SA SA SA SA SB SB SB SC SA SA SB SB SB SC SB SB SB SC Rated Voltage (VDC) 1500 2000 2000 1000 1500 TA Voltage Code C B D F G C B D F G C B D F G C B D F G Case Size/Series 630 1000 TA 500 TA 1000 G 630 F 630 D 500 B 500 C 2000 G 1500 F 1000 D 630 B 500 2000 C 2000 1500 500 G 1500 2000 F 1000 1500 D 1000 1000 B 630 C 630 G 500 F 2000 D 1500 B C4540H 1000 Capacitance Cap Code C Rated Voltage (VDC) Capacitance Tolerance J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M 630 100 - 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 Voltage Code C3640H 630 10 - 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.1 µF 0.12 µF 0.15 µF C3040H 500 Cap Code C2824H 500 Capacitance Case Size/ Series Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions C2824H C3040H C3640H C4540H *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel DG ED EF EG FG FL FM FY FK FS LA LB LC GH GK GM GO HE HG HJ HK JE JK JL JN KE KF KH KJ TA TB TC QB QC QD MA MB MC SA SB SC 0805 1206 1206 1206 1210 1210 1210 1210 1210 1210 1808 1808 1808 1812 1812 1812 1812 1825 1825 1825 1825 2220 2220 2220 2220 2225 2225 2225 2225 2824 2824 2824 3040 3040 3040 3640 3640 3640 4540 4540 4540 1.25±0.15 1.00±0.10 1.20±0.15 1.60±0.15 1.25±0.15 1.40±0.15 1.70±0.20 2.00±0.20 2.10±0.20 2.50±0.30 1.40±0.15 1.60±0.15 2.00±0.15 1.40±0.15 1.60±0.20 2.00±0.20 2.50±0.20 1.40±0.15 1.60±0.20 2.00±0.20 2.50±0.20 1.40±0.15 1.60±0.20 2.00±0.20 2.50±0.20 1.40±0.15 1.60±0.20 2.00±0.20 2.50±0.20 1.40±0.15 2.00±0.20 2.50±0.20 1.40±0.15 2.00±0.20 2.50±0.20 1.40±0.15 2.00±0.20 2.50±0.20 1.40±0.15 2.00±0.20 2.50±0.20 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2,500 2,500 2,500 2,000 2,500 2,000 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 500 500 1,000 1,000 500 500 1,000 1,000 500 500 1,000 1,000 500 500 750 300 300 500 500 350 250 250 250 200 200 200 10,000 10,000 10,000 8,000 10,000 8,000 8,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000 2,500 2,000 2,000 1,650 1,650 1,400 1,550 1,550 1,550 1,500 1,500 1,500 Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 2B – Bulk Packaging Quantities Packaging Type Loose Packaging Secure Packaging Bulk Bag (default) 2” x 2” Waffle Pack/Tray3 N/A 2 7282/7292 Packaging C-Spec1 Case Size EIA (in) Chip Thickness (mm) Metric (mm) 0402 0603 0805 1206 1206 1210 1005 1608 2012 3216 3216 3225 1808 1812 1825 2220 2225 4520 4532 4564 5650 5664 Packaging Quantities (pieces/unit packaging) Minimum Maximum Minimum Maximum 1 368 368 100 126 50 80 All 50,000 ≤ 1.25 (nominal) > 1.25 (nominal) 1 All 20,000 50 42 20 20 20 The "Packaging C-Spec" is a 4-digit code which identifies the packaging type. When ordering, the proper code must be included in the 15th through 18th character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. 2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. 3 Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection. 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0805 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00 2824 7260 3.45 1.70 6.60 9.60 7.60 3.35 1.50 6.50 8.70 7.00 3.25 1.30 6.40 8.00 6.70 3040 7610 3.70 1.70 10.70 10.10 11.70 3.60 1.50 10.60 9.20 11.10 3.50 1.30 10.50 8.50 10.80 3640 9210 4.45 1.70 10.70 11.60 11.70 4.35 1.50 10.60 10.70 11.10 4.25 1.30 10.50 10.00 10.80 4540 - 5.60 1.70 10.70 13.90 11.70 5.50 1.50 10.60 13.00 11.10 5.40 1.30 10.50 12.30 10.80 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/JSTD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish SnPb TP 100% Matte Sn Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax 100°C 150°C 60 – 120 seconds 150°C 200°C 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second maximum 3°C/second maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum 6°C/second maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum TL Temperature Profile Feature tP Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec tL Tsmax Tsmin 25 ts 25ºC to Peak Time Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Product Qualification Test Plan Reliability/Environmental Tests per MIL–STD–202//JESD22 Load Humidity Low Voltage Humidity Temperature Cycling Thermal Shock Moisture Resistance 85°C/85%RH and 200 VDC maximum, 1,000 Hours 85°C/85%RH, 1.5V, 1,000 Hours −55°C to +200°C, 50 Cycles −55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 Cycles Cycled Temp/RH 0 V, 10 cycles at 24 hours each Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429 Resistance to Solvents Mechanical Shock and Vibration Resistance to Soldering Heat Terminal Strength Board Flex Include Aqueous wash chemical – OKEM Clean or equivalent Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes, 12 cycles Condition B, no per-heat of samples, Single Wave Solder Force of 1.8 kg for 60 seconds Appendix 2, Note: 3.0 mm (minimum) Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within the time frame outlined in the table below: Termination Finish Termination Finish Ordering Code1 Storage Life 100% Matte Tin (Sn) C 1.5 years upon receipt L 1.5 years upon receipt E 6 months upon receipt2 Gold (Au) 30 – 50 µin F 1.5 years upon receipt Gold (Au) 100 µin min. G 1.5 years upon receipt SnPb (5% Pb min.) Gold (Au) 1.97 – 11.8 µin 2 The fourteenth (14th) character position of the KEMET part number is assigned to identify and/or define the termination finish. For more information, see “Ordering Information” section of this document. 2 Gold plating option “E” devices should remain in its factory sealed moisture sensitive packaging during storage. If the factory sealed packaging is disturbed please store any remaining packaged components in a dry box container to prevent oxidation of the termination finish. 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Construction (Typical) Detailed Cross Section Termination Finish: C = 100% Matte Sn L = SnPb - 5% Pb min E = Gold (Au) 1.97 - 11.8 µin F = Gold (Au) 30 - 50 µin G = Gold (Au) 100 µin min Barrier Layer (Ni) Dielectric Material (CaZrO3) Dielectric Material (CaZrO3) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (See options at left) Inner Electrodes (Ni) Capacitor Marking (Optional): Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel ® Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel 13" Reel Pitch (P1)* Punched Paper 7" Reel 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 2824 16 12 12 3040 – 4540 24 16 16 KPS 1210 12 8 8 KPS 1812 & 2220 16 12 12 Array 0508 & 0612 8 4 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) Packaging Type/Options C-3190 C-3191 C-7081 C-7082 Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefits of Changing from 4 mm to 2 mm Pitching Spacing • Lower placement costs • Double the parts on each reel results in fewer reel changes and increased efficiency • Fewer reels result in lower packaging, shipping and storage costs, reducing waste © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. 1 Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 1.5+0.10/−0.0 (0.059+0.004/−0.0) 1.75±0.10 (0.069±0.004) 4.0±0.10 (0.157±0.004) 2.0±0.05 (0.079±0.002) 1.5+0.10/−0.0 (0.059+0.004/−0.0) 1.75±0.10 (0.069±0.004) 4.0±0.10 (0.157±0.004) 2.0±0.10 (0.078±0.003) 8 mm 12 mm 16 mm 24 mm R Reference Note 2 25.0 (0.984) 30 (1.181) 30 (1.181) S1 Minimum Note 3 T Maximum T1 Maximum 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) 5 (0.196) 0.250 (0.009) 0.350 (0.013) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) 24 mm 16 mm E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) 22.25 (0.875) F P1 3.5±0.05 (0.138±0.002) 5.5±0.05 (0.217±0.002) 7.5±0.05 (0.138±0.002) 11.5±0.10 (0.452±0.003) 4.0±0.10 (0.157±0.004) 8.0±0.10 (0.315±0.004) 12.0±0.10 (0.157±0.004) 16.0±0.10 (0.629±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) 3 (0.118) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) 24.3 (0.956) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5+0.10/−0.0 (0.059+0.004/−0.0) 1.75±0.10 (0.069±0.004) 4.0±0.10 (0.157±0.004) 2.0±0.05 (0.079±0.002) 0.10 (0.004) Maximum R Reference Note 2 0.75 (0.030) 2 (0.984) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum F P1 T Maximum W Maximum A0 B 0 6.25 (0.246) 3.5±0.05 (0.138±0.002) 2.0±0.05 (0.079±0.002) 4.0±0.10 (0.157±0.004) 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 19 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) 24 mm 0.1 to 1.6 Newton (10 to 160 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Maximum Rotation ( 20 10 5 Figure 5 – Bending Radius Embossed Carrier 16 mm Tape ° S) Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com R C1069_C0G_HV_HT_200C • 8/10/2016 20 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm 16 mm 24 mm A B Minimum C D Minimum 178±0.20 (7.008±0.008) or 330±0.20 (13.000±0.008) 1.5 (0.059) 13.0+0.5/−0.2 (0.521+0.02/−0.008) 20.2 (0.795) 1.2 (0.047) 13.0 + −0.2 (0.521 + −0.008) 21 (0.826) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4+1.5/−0.0 (0.331+0.059/−0.0) 12.4+2.0/−0.0 (0.488+0.078/−0.0) 16.4+2.0/−0.0 (0.646+0.078/−0.0) 25+1.0/−0.0 (0.984+0.039/−0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 27.4+1.0/−1.0 (1.078+0.039/−0.039) Shall accommodate tape width without interference 8 mm 12 mm 16 mm 24 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 21 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 22 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Waffle Tray Packaging Information – 2" x 2" w/ Static Protection Figure 9 – Waffle Tray Dimensions – Inches (Millimeters) M 0.10 (2.54) X 45° M3 M1 Y M2 X X A Z 0.156 +0.002/-0.003 (3.962 +0.051/-0.076) 0.098 (2.489) 0.086 (2.184) 2.000 ±0.004 SQ (50.800 ±0.102 SQ) 90° 0.004 (0.102) 1.800 ±0.004 SQ (45.720 ±0.102 SQ) 1.812 ±0.004 SQ (46.025 ±0.102 SQ) STANDARD RIB MATRIX © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 23 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 9A – Waffle Tray Dimensions – Inches Case Size EIA (in) 0402 0504 0603 0805 1005 12061,2 12061,3 1210 1808 1812 1825 2220 2225 Metric (mm) 1005 1210 1608 2012 2512 3216 3216 3225 4520 4532 4564 5650 5664 2" x 2" Waffle Tray Dimensions – Inches M ±0.003 0.175 0.235 0.175 0.232 0.230 0.194 0.250 0.217 0.271 0.271 0.318 0.318 0.318 M1 ±0.003 0.153 0.226 0.153 0.186 0.240 0.228 0.250 0.244 0.285 0.285 0.362 0.362 0.362 M2 ±0.002 0.077 0.172 0.077 0.181 0.190 0.193 0.375 0.215 0.286 0.286 0.424 0.424 0.424 M3 ±0.002 0.110 0.170 0.110 0.171 0.140 0.124 0.167 0.174 0.243 0.243 0.34 0.34 0.34 X ±0.002 0.073 0.080 0.073 0.062 0.060 0.067 0.100 0.110 0.150 0.150 0.24 0.24 0.24 Y ±0.002 0.042 0.090 0.042 0.092 0.110 0.130 0.200 0.145 0.200 0.200 0.32 0.32 0.32 Z ±0.003 0.041 0.055 0.041 0.036 0.075 0.065 0.070 0.080 0.075 0.075 0.032 0.032 0.032 A° ± 1/2° 7 5 7 10 5 5 5 5 5 5 5 5 5 MATRIX (X x Y) 16 X 23 10 X 10 16 X 23 10 X 10 12 X 9 14 X 9 10 X 5 10 X 8 7X6 7X6 5X4 5X4 5X4 Packaging Quantity (pcs/unit packaging) 368 100 368 100 108 126 50 80 42 42 20 20 20 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall" and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor. 2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches). 3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches). 1 Table 9B – Waffle Tray Dimensions – Millimeters Case Size EIA (in) 0402 0504 0603 0805 1005 12061,2 12061,3 1210 1808 1812 1825 2220 2225 Metric (mm) 1005 1210 1608 2012 2512 3216 3216 3225 4520 4532 4564 5650 5664 2" x 2" Waffle Tray Dimensions – Millimeters M ±0.08 4.45 5.97 4.45 5.89 5.84 4.93 6.35 5.51 6.88 6.88 8.08 8.08 8.08 M1 ±0.08 3.89 5.74 3.89 4.72 6.10 5.79 6.35 6.20 7.24 7.24 9.19 9.19 9.19 M2 ±0.05 1.96 4.37 1.96 4.60 4.83 4.90 9.53 5.46 7.26 7.26 10.77 10.77 10.77 M3 ±0.05 2.79 4.32 2.79 4.34 3.56 3.15 4.24 4.42 6.17 6.17 8.64 8.64 8.64 X ±0.05 1.85 2.03 1.85 1.57 1.52 1.70 2.54 2.79 3.81 3.81 6.10 6.10 6.10 Y ±0.05 1.07 2.29 1.07 2.34 2.79 3.30 5.08 3.68 5.08 5.08 8.13 8.13 8.13 Z ±0.08 1.04 1.40 1.04 0.91 1.91 1.65 1.78 2.03 1.91 1.91 0.81 0.81 0.81 A° ± 1/2° 7 5 7 10 5 5 5 5 5 5 5 5 5 MATRIX (X x Y) 16 X 23 10 X 10 16 X 23 10 X 10 12 X 9 14 X 9 10 X 5 10 X 8 7X6 7X6 5X4 5X4 5X4 Packaging Quantity (pcs/unit packaging) 368 100 368 100 108 126 50 80 42 42 20 20 20 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall" and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor. 2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches). 3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches). 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 24 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) KEMET Electronic Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 25