CA064X473K5RACTU

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Overview KEMET’s Ceramic Chip Capacitor Array in X7R dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Array technology promotes reduced placement costs and increased throughput. This is achieved by alternatively placing one device rather than two or four discrete devices. Use of capacitor arrays also saves board space, which translates into increased board density and more functions per board. Arrays consume only a portion of the space required for standard chips resulting in savings in inventory and pick/place machine positions. For added reliability, KEMET's Flexible Termination technology has been incorporated in order to provides superior flex performance. This technology was developed to address flex cracks, which are the primary failure mode of MLCCs and typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Flexible Termination technology inhibits the transfer of board stress to the rigid body of the MLCC, therefore mitigating flex cracks which can result in low IR or short circuit failures. KEMET’s X7R dielectric features a 125°C maximum operating temperature and is considered “temperature stable.” The Electronics Industries Alliance (EIA) characterizes X7R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications, or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from −55°C to +125°C. KEMET automotive grade array capacitors meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements. Click image above for interactive 3D content Ordering Information CA 06 4 Open PDF in Adobe Reader for full functionality X 104 K Ceramic Case Size Number of Specification/ Capacitance Capacitance Series Code (pF) Tolerance Array (L" x W")1 Capacitors 06 = 0612 4=4 X = Flexible Termination Two significant digits and number of zeros J = ±5% K = ±10% M = ±20% 4 R A C TU Rated Voltage (VDC) Dielectric Failure Rate/ Design Termination Finish2 Packaging/ Grade (C-Spec) R = X7R A = N/A 8 = 10 4 = 16 3 = 25 5 = 50 1 = 100 2 = 200 C = 100% Matte Sn L = SnPb (5% minimum Pb content) See "Packaging C-Spec Ordering Options Table" All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of "0612". Please reference all new designs using the "0612" nomenclature. "CA064" replaces "C1632" in the ordering code. 2 Additional termination finish options may be available. Contact KEMET for details. 2 SnPb termination finish option is not available on automotive grade product. 1 Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/2020 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Ordering Code (C-Spec) Packaging Type Commercial Grade1 Bulk Bag 7" Reel/Unmarked 13" Reel/Unmarked Not Required (Blank) TU 7210 Automotive Grade2 7" Reel 13" Reel/Unmarked AUTO AUTO7210 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging. The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking." 2 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information." 2 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information." 2 All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For more information see "Capacitor Marking." 1 1 Benefits • −55°C to +125°C operating temperature range • Superior flex performance (up to 5 mm) • Saves both circuit board and inventory space • Reduces placement costs and increases throughput • Lead (Pb)-free, RoHS and REACH compliant • 0612 (4-element) case size • DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 200 V • Capacitance offerings ranging from 330 pF – 0.10 µF • Available capacitance tolerances of ±5%, ±10%, and ±20% • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated termination finish allowing for excellent solderability • SnPb termination finish option available upon request (5% Pb minimum) • Commercial and Automotive (AEC–Q200) grades available Applications Typical applications include those that can benefit from board area savings, cost savings and overall volumetric reduction such as telecommunications, computers, handheld devices and automotive. Flexible termination technology benefits applications subject to high levels of board flexure or temperature cycling. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/20202 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET product change notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence Process/Product change Obsolescence* Days Prior To Implementation KEMET assigned Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 1 Customer Notification Due To: KEMET Automotive C-Spec KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. PPAP (Product Part Approval Process) Level KEMET Automotive C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO 1 ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part number specific PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/20203 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) 0612 (4-CAP) Top View Profile View BW P L T P Ref W BL CL EIA Size Code Metric Size Code L Length W Width BW Bandwidth BL Bandlength T Thickness 0612 1632 1.60 (0.063) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 0.40 (0.016) ±0.20 (0.008) 0.30 (0.012) See Table 2 for ±0.20 (0.008) Thickness P Pitch P Reference 0.80 (0.031) ±0.10 (0.004) 0.40 (0.016) ±0.05 (0.002) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/20204 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% 1 2 3 4 Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit at 25°C Insulation Resistance (IR) Minimum Limit at 25°C 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50mA) See Dissipation Factor Limit Table 1,000 MΩ µF or 100GΩ (Rated voltage applied for 120 ±5 seconds at 25°C) Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 3 Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz ±50Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF 120 Hz ±10Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF 4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." 1 2 Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric X7R Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) < 16 All 7.5 16/25 All 5.0 ≤ 0.02 µF 3.0 > 0.02 µF 5.0 All 3.0 50 > 50 Capacitance Shift Insulation Resistance ±20% 10% of Initial Limit Dissipation Factor Limit Table Rated DC Voltage Capacitance Dissipation Factor (Maximum %) < 16 All 5.0 16/25 All 3.5 ≤ 0.022 µF 2.5 > 0.022 µF 3.5 All 2.5 50 > 50 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/20205 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Table 1 – Capacitance Range/Selection Waterfall (0612 Case Size) C0612C/X (CA064C/X 4-Cap Case Size) Case Size/Series Capacitance Capacitance Code 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 µF 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 Capacitance Capacitance Code Voltage Code Rated Voltage (VDC) Capacitance Tolerance J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 8 4 3 5 1 2 10 16 25 50 100 200 Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA MA Rated Voltage (VDC) 10 16 25 50 100 200 Voltage Code 8 4 3 5 1 2 Case Size/Series C0612C/X (CA064C/X 4-Cap Case Size) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/20206 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel MA 0612 0.80 ±0.10 4,000 10,000 0 0 Package quantity based on finished chip thickness specifications. Table 3 – Chip Capacitor Array Land Pattern Design Recommendations per IPC–7351 EIA SIZE CODE 0612/CA064 METRIC SIZE CODE 1632 Density Level A: Maximum (Most) Land Protrusion (mm) C Y 1.80 1.10 X P V1 Density Level B: Median (Nominal) Land Protrusion (mm) V2 C 0.50 0.80 3.90 4.40 1.80 Y X P V1 Density Level C: Minimum (Least) Land Protrusion (mm) V2 0.95 0.50 0.80 3.30 3.90 C 1.70 Y X P V1 V2 0.85 0.40 0.80 2.80 3.60 Density Level A: For low-density product applications. Provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations, the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 0612 case size. V2 P X Y V1 C Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/20207 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax Termination Finish SnPb TP 100% Matte Sn Ramp-Up Rate (TL to TP) 100°C 150°C 60 – 120 seconds 3°C/second maximum 150°C 200°C 60 – 120 seconds 3°C/second maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds 30 seconds maximum maximum 6°C/second 6°C/second Ramp-Down Rate (TP to TL) maximum maximum Time 25°C to Peak 6 minutes 8 minutes Temperature maximum maximum Note : All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/20208 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X. Conditions: Solderability J–STD–002 a) Method B, 4 hours at 155°C, dry heat at 235°C b) Method B at 215°C category 3 c) Method D, category 3 at 260°C Temperature Cycling JESD22 Method JA–104 Biased Humidity MIL–STD–202 Method 103 Moisture Resistance Thermal Shock High Temperature Life Storage Life MIL–STD–202 Method 106 MIL–STD–202 Method 107 MIL–STD–202 Method 108/EIA–198 MIL–STD–202 Method 108 Vibration Mechanical Shock Resistance to Solvents MIL–STD–202 Method 204 MIL–STD–202 Method 213 MIL–STD–202 Method 215 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours ±4 hours after test conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours ±4 hours after test conclusion. −55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell time – 15 minutes. Air – air. 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied. 150°C, 0 VDC for 1,000 hours. 5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz Figure 1 of Method 213, Condition F. Add aqueous wash chemical, OKEM clean or equivalent. Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/20209 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Construction Detailed Cross Section Inner Electrodes (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Barrier Layer (Ni) Epoxy Layer (Ag) End Termination/ External Electrode (Cu) End Termination/ Dielectric Material (CaZrO3) External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Inner Electrodes (Ni) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/202010 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Capacitor Marking (Optional) These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices, but must be requested using the correct ordering code identifier(s). If this option is requested, two sides of the ceramic body will be laser marked with a “K” to identify KEMET, followed by two characters (per EIA–198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited to the “K” character only. Marking appears in legible contrast. Illustrated below is an example of an MLCC with laser marking of “KA8”, which designates a KEMET device with rated capacitance of 100 µF. Orientation of marking is vendor optional. KEMET ID 2-Digit Capacitance Code Laser marking option is not available on: • C0G, ultra stable X8R and Y5V dielectric devices. • EIA 0402 case size devices. • EIA 0603 case size devices with flexible termination option. • KPS commercial and automotive grade stacked devices. • X7R dielectric products in capacitance values outlined below. EIA Case Size Metric Size Code Capacitance 0603 0805 1206 1210 1808 1812 1825 2220 2225 1608 2012 3216 3225 4520 4532 4564 5650 5664 ≤ 170 pF ≤ 150 pF ≤ 910 pF ≤ 2,000 pF ≤ 3,900 pF ≤ 6,700 pF ≤ 0.018 µF ≤ 0.027 µF ≤ 0.033 µF © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/20201 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Capacitor Marking (Optional) cont. Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral Alpha Character 9 A 0.10 1.0 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 1.2 12 120 1,200 12,000 D 0.13 1.3 13 130 1,300 E 0.15 1.5 15 150 1,500 0 1 2 3 4 5 6 7 8 100,000 1,000,000 10,000,000 100,000,000 110,000 1,100,000 11,000,000 110,000,000 120,000 1,200,000 12,000,000 120,000,000 13,000 130,000 1,300,000 13,000,000 130,000,000 15,000 150,000 1,500,000 15,000,000 150,000,000 160,000,000 Capacitance (pF) F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.20 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 470,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.50 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.60 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.70 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.90 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/2020 12 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel ® Embossed plastic* or punched paper carrier. ET KEM Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm or 16 mm carrier tape 180 mm (7.00") or 330 mm (13.00") Anti-static cover tape (0.10 mm (0.004") maximum thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel 13" Reel Pitch (P1)* Punched Paper 7" Reel 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 and 2220 16 12 12 Array 0612 8 4 4 *Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 and 7 for tolerance specifications. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) Packaging Type/Options C-3190 C-3191 C-7081 C-7082 Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefits of Changing from 4 mm to 2 mm Pitching Spacing • Lower placement costs. • Double the parts on each reel results in fewer reel changes and increased efficiency. • Fewer reels result in lower packaging, shipping and storage costs, reducing waste. C1017_X7R_ARRAY_SMD • 8/11/2020 13 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 (10 pitches cumulative tolerance on tape ±0.2 mm) P0 A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) R Reference S1 Minimum T Note 2 Note 3 Maximum 25.0 (0.984) 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.024) 30 (1.181) E1 P0 P2 T1 Maximum 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm 16 mm B1 Maximum Note 4 4.35 Single (4 mm) (0.171) Single (4 mm) 8.2 and double (8 mm) (0.323) 12.1 Triple (12 mm) (0.476) Pitch E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 ±0.05 4.0 ±0.10 (0.138 ±0.002) (0.157 ±0.004) 5.5 ±0.05 8.0 ±0.10 (0.217 ±0.002) (0.315 ±0.004) 7.5 ±0.05 12.0 ±0.10 (0.138 ±0.002) (0.157 ±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/202014 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.2 mm) A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) maximum R Reference Note 2 0.75 (0.030) 25 (0.984) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum F P1 T Maximum W Maximum A0 B 0 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/202015 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum Maximum Rotation ( 20 10 5 ° S) Figure 5 – Bending Radius Embossed Carrier 16 mm Tape Punched Carrier 1.0 mm maximum 1.0 mm maximum R © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R C1017_X7R_ARRAY_SMD • 8/11/2020 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/−0.0 (0.331 +0.059/−0.0) 12.4 +2.0/−0.0 (0.488 +0.078/−0.0) 16.4 +2.0/−0.0 (0.646 +0.078/−0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/2020 17 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/202018 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1017_X7R_ARRAY_SMD • 8/11/202019 19