Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric,
Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Overview
KEMET’s HiQ CBR Automotive RF Capacitor Series features
a copper electrode BME (Base Metal Electrode) system
that offers ultra-low ESR and High Q in the VHF, UHF, and
microwave frequency bands. Low ESR allows for higher
RF currents which are ideal for applications such as V2X,
safety systems, power train and automotive communication
systems.
KEMET's HiQ CBR RF capacitors are characterized using
ModelithicsTM substrate scalable models and is available
in most EDA software. Contact KEMET Sales for details on
accessing models.
CBR Series capacitors exhibit no change in capacitance with
respect to time and voltage, and boast a negligible change in
capacitance with reference to ambient temperature.
Benefits
Applications
• AEC-Q200 Qualified
• Ultra-low ESR and High Q
• High SRF
• High thermal stability
• 1 MHz to 50 GHz frequency range
• Operating temperature range of −55°C to +125°C
• Base metal electrode (BME) dielectric system
• Pb-free and RoHS compliant
• 0402 and 0603 case sizes (inches)
• DC voltage rating of 50 V
• Capacitance offerings ranging from 0.1 pF up to 100 pF
• Available capacitance tolerances of ±0.05 pF, ±0.1 pF,
• V2X
• Safety Systems
• Power Train
• Automotive Communication Systems
• Bypass, coupling, filtering, impedance matching,
DC blocking
±0.25 pF, ±0.5 pF, ±1%, ±2%, and ±5%
• Negligible capacitance change with respect to temperature
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
Built Into Tomorrow
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
1
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Ordering Information
CBR
04
C
330
F
5
G
A
C
AUTO
Series
Case Size
(L"x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance
Voltage
Dielectric
Termination
Style
Termination
Finish
Packaging/
Grade
(C-Spec)
04 = 0402
06 = 0603
C = Standard
Two significant digits
and number of zeros
Use 9 for 1.0 – 9.9 pF
Use 8 for 0.1 – 0.99 pF
ex. 2.2 pF = 229
ex. 0.5 pF = 508
A = ±0.05 pF
B = ±0.1 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
G = C0G
A = N/A
C = 100% Matte Sn
CBR
5 = 50 V
See
"Packaging
C-Spec
Ordering
Options
Table"
Tape & Reel Packaging Information
Packaging Type
Packaging Ordering Code
(C-SPEC)
7" Reel
AUTO
13" Reel
AUTO7411
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions
Lead-free
Qualification/Certification
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC-Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their
website at www.aecouncil.com.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
2
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days Prior To
Implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days minimum
AUTO
Yes (without approval)
Yes
90 days minimum
1
1
Customer Notification Due To:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
2
3
4
5
KEMET assigned1
●
●
●
●
●
AUTO
1
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
3
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Dimensions – Millimeters (Inches)
W
L
T
B
Case
Size (in.)
Case
Size (mm)
L
Length
W
Width
T
Thickness
B
Bandwidth
Mounting
Technique
0402
1005
0603
1608
1.00 ±0.05
(0.040 ±0.002)
1.60 ±0.10
(0.063 ±0.004)
0.50 ±0.05
(0.020 ±0.002)
0.80 ±0.10
(0.031 ±0.004)
0.50 ±0.05
(0.020 ±0.002)
0.80 ±0.10
(0.031 ±0.004)
0.25 ±0.10
(0.010 ±0.004)
0.40 ±0.20
(0.016 ±0.008)
Solder Wave
or Solder Reflow
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
1
2
Quality Factor (Q):
Insulation Resistance (IR) Limit at 25°C
−55°C to +125°C
±30 ppm/°C
0%
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
≥ 1,000 for capacitance values ≥ 30 pF
≥ 400 + 20C for capacitance values < 30 pF (C = Capacitance in pF)
10 GΩ minimum (rated voltage applied for 120 ±5 seconds)
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2
Capacitance and Quality Factor (Q) measured at 1 MHz ±100 kHz and 1.0 ±0.2 Vrms
1
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
4
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 1 – CBR AUTO Series, Capacitance Range Waterfall
Case Size – Inches (mm)
0402 (1005)
0603 (1608)
Rated Voltage (VDC)
50
50
Voltage Code
5
5
Capacitance
0.1 pF
0.2 pF
0.3 pF
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.1 pF
1.2 pF
1.3 pF
1.4 pF
1.5 pF
1.6 pF
1.7 pF
1.8 pF
1.9 pF
2.0 pF
2.1 pF
2.2 pF
2.3 pF
2.4 pF
2.5 pF
2.6 pF
2.7 pF
2.8 pF
2.9 pF
3.0 pF
3.1 pF
3.2 pF
3.3 pF
3.4 pF
3.5 pF
3.6 pF
3.7 pF
3.8 pF
3.9 pF
4.0 pF
4.1 pF
4.2 pF
4.3 pF
4.4 pF
4.5 pF
4.6 pF
4.7 pF
4.8 pF
4.9 pF
5.0 pF
Capacitance
Tolerance
B = ±0.1pF
Capacitance Code
(Available Capacitance)
108
208
308
408
508
608
708
808
908
109
119
129
139
149
159
169
179
189
199
209
219
229
239
249
259
269
279
289
299
309
319
329
339
349
359
369
379
389
399
409
419
429
439
449
459
469
479
489
499
509
208
308
408
508
608
708
808
908
109
119
129
139
149
159
169
179
189
199
209
219
229
239
249
259
269
279
289
299
309
319
329
339
349
359
369
379
389
399
409
419
429
439
449
459
469
479
489
499
509
Rated Voltage (VDC)
50
50
Voltage Code
5
5
A = ±0.05 pF
B = ±0.1 pF
C = ±0.25 pF
A = ±0.05 pF
B = ±0.1 pF
C = ±0.25 pF
D = ±0.5 pF
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
5
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 1 – CBR AUTO Series, Capacitance Range Waterfall cont.
Case Size – Inches (mm)
0402 (1005)
0603 (1608)
Rated Voltage (VDC)
50
50
Voltage Code
5
5
Capacitance
5.1 pF
5.2 pF
5.3 pF
5.4 pF
5.5 pF
5.6 pF
5.7 pF
5.8 pF
5.9 pF
6.0 pF
6.1 pF
6.2 pF
6.3 pF
6.4 pF
6.5 pF
6.6 pF
6.7 pF
6.8 pF
6.9 pF
7.0 pF
7.1 pF
7.2 pF
7.3 pF
7.4 pF
7.5 pF
7.6 pF
7.7 pF
7.8 pF
7.9 pF
8.0 pF
8.1 pF
8.2 pF
8.3 pF
8.4 pF
8.5 pF
8.6 pF
8.7 pF
8.8 pF
8.9 pF
9.0 pF
9.1 pF
9.2 pF
9.3 pF
9.4 pF
9.5 pF
9.6 pF
9.7 pF
9.8 pF
9.9 pF
Capacitance
Tolerance
Capacitance Code
(Available Capacitance)
519
529
539
549
559
569
579
589
599
609
619
629
639
649
659
669
679
689
699
709
719
729
739
749
759
769
779
789
799
809
819
829
839
849
859
869
879
889
899
909
919
929
939
949
959
969
979
989
999
519
529
539
549
559
569
579
589
599
609
619
629
639
649
659
669
679
689
699
709
719
729
739
749
759
769
779
789
799
809
819
829
839
849
859
869
879
889
899
909
919
929
939
949
959
969
979
989
999
Rated Voltage (VDC)
50
50
Voltage Code
5
5
B = ±0.1 pF
C = ±0.25 pF
D = ±0.5 pF
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
6
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 1 – CBR AUTO Series, Capacitance Range Waterfall cont.
Case Size – Inches (mm)
0402 (1005)
0603 (1608)
Rated Voltage (VDC)
50
50
Voltage Code
5
5
Capacitance
Capacitance
Tolerance
10 pF
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
39 pF
43 pF
47 pF
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
91 pF
100 pF
Capacitance Code
(Available Capacitance)
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
Rated Voltage (VDC)
50
50
Voltage Code
5
5
F = ±1%
G = ±2%
J = ±5%
Table 2 – Chip Thickness/Reeling Quantities
Reel Quantity
Chip Size
Inches (mm)
Chip Thickness
(mm)
7" Paper
13" Paper
0402 (1005)
0.50 ±0.05
10,000
50,000
0603 (1608)
0.80 ±0.10
4,000
15,000
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
7
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)
Case
Size
(Inches)
Case
Size
(mm)
0402
0603
Density Level A:
Maximum (Most) Land
Protrusion
Density Level B:
Median (Nominal) Land
Protrusion
Density Level C:
Minimum (Least) Land
Protrusion
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1005
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of 0603(1608) and 0805 (2012) case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1608 case size.
V1
Y
Y
X V2
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
8
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Termination Finish
SnPb
TP
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (t S) from TSmin to TSmax
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (t L)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (t P)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
9
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degradedby high temperature – reels may soften or warp,
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C, and maximum
storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid
condensation on the parts, and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability, chip stock should be used promptly, preferably within 1.5 years of receipt.
Construction
Detailed Cross Section
Dielectric Material
(BaTiO3 Based)
Barrier Layer
(Ni)
Dielectric Material
(BaTiO3 Based)
Termination Finish
(100% Matte Sn)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Cu)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Cu)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
10
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Tape & Reel Packaging Information
KEMET offers RF and Microwave Multilayer Ceramic Chip Capacitors packaged in 8 mm tape on 7" reels. This packaging
system is compatible with all tape-fed automatic pick and place systems.
Bar Code Label
Anti-Static Reel
®
ET
KEM
Punched Paper Carrier
Sprocket Holes
Punched Cavity
8 mm Carrier Tape
180 mm (7.00")
Anti-Static Cover Tape
(0.10mm (0.004") Maximum Thickness)
Table 4 – Carrier Tape Configuration (mm)
EIA Case Size
Tape Size (W)*
Lead Space (P1)*
0402
8
2
0603
8
4
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 6 for tolerance specifications.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
11
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Figure 1 – Punched (Paper) Carrier Tape Dimensions
P0
T
E
P2
A0
D0
F
W
B0
D1
P1
K1
A0
Table 5 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
8 mm
1.55+0.05
(0.061+0.002)
1.55±0.05
(0.061±0.002)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
R Reference
Note 2
25.0
(0.984)
K0
-
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
8 mm
Pitch
Half (2 mm)
Single (4 mm)
A0
B0
0.37±0.03
(0.015±0.001)
0.62±0.05
(0.025±0.002)
1.00±0.10
(0.040±0.004)
1.50±0.10
(0.06±0.004)
0.67±0.03
(0.03±0.001)
1.12±0.05
(0.04±0.002)
1.80±0.10
(0.07±0.004)
2.30±0.10
(0.09±0.004)
F
3.5±0.05
(0.138±0.002)
P1
T
W
0.42±0.03
(0.017±0.001)
2.0±0.05
(0.079±0.002) 0.60±0.05
(0.024±0.002)
8.0±0.10
0.95±0.05 (0.315±0.004)
(0.037±0.002)
4.0±0.10
(0.157±0.004)
0.95±0.05
(0.037±0.002)
D1
-
2. The tape with or without components shall pass around R without damage (see Figure 3).
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
12
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Bending Radius
Punched
Carrier
Bending
Radius
R
Figure 3 – Tape Leader & Trailer Dimensions
Punched Carrier
8mm
END
Carrier Tape
Round Sprocket Holes
Leader
Top Cover Tape
Trailer
110mm minimum
Top Cover Tape
Components
20mm
minimum
400mm ~ 560mm
Minimum (empty
cavities and leader)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
13
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
Figure 4 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Figure 5 – Reel Dimensions
C
A
N
W1
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
Reel Size
A
C
8 mm
7
178 ±0.10
(7.008 ±0.004)
13.0 ±0.20
(0.512 ±0.008)
Variable Dimensions — Millimeters (Inches)
Tape Size
Reel Size
W1
8 mm
60 ±0.10
(2.4 ±0.04)
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
14
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Frequency Applications
HiQ-CBR Automotive Series, C0G Dielectric, Low ESR, 50 VDC, 1 MHz – 50 GHz (RF & Microwave)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1121_CBR_AUTO • 6/28/2022
15
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