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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive Grade) Overview KEMET's KC-LINK surface mount capacitors are designed to meet the growing demand for fast switching wide bandgap (WBG) semiconductors that operate at higher voltages, temperatures, and frequencies. By utilizing KEMET's robust and proprietary C0G/NPO base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators, where high efficiency is a primary concern. With extremely low effective series resistance (ESR) and very low thermal resistance, KC-LINK capacitors can operate at very high ripple currents with no change in capacitance versus DC voltage, and negligible change in capacitance versus temperature. With an operating temperature of 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. KC-LINK C0G dielectric technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of lead frames. This provides extremely low effective series inductance (ESL) increasing the operating frequency range allowing for further miniaturization. For added reliability, KC-LINK is now available with flexible termination technology that provides superior flex performance over standard termination systems, addressing the primary failure mode of MLCC's flex cracks. In addition to commercial grade, automotive grade devices are available and meet the demanding Automotive Electronics Council’s AEC–Q200 qualification requirements. Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Benefits Applications • EIA 1812, 2220, and 3640 case size • AEC–Q200 automotive qualified • Flexible termination option available • Very high ripple current capability • Extremely low equivalent series resistance (ESR) • Extremely low equivalent series inductance (ESL) • Operating temperature range of −55°C to +150°C • High frequency operation (> 10 MHz) • No capacitance shift with voltage • No piezoelectric noise • High thermal stability • RoHS compliant and Pb-free • Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems • EV/HEV (drive systems, charging) • Wireless charging • Photovoltaic systems • Power converters • Inverters • LLC resonant converters • DC link • Snubber Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Typical Performance 10.00 Capacitance Change (%) Capacitance Change (%) Capacitance Change vs DC Voltage Capacitance Change vs Temperature 10.00 5.00 0.00 -5.00 -10.00 -55 -35 -15 5 25 45 65 85 105 125 5.00 0.00 -5.00 -10.00 145 0 100 200 Typical AC Current Performance, EIA 1812 (CKC18) 350700 18 300 10 16 4.7nF 1000V 12 6 7.5nF 1000V 15nF 1000V 10 18nF 650V 4 8 47nF 650V 2 6 0 100 200 300 400 500 600 700 800 900 100 200 300 400 500 600 700 4.7 nF 1,700 V 7.5 nF 1,700 V 8.2 nF 1,700 V 22 nF 1,700 V 47 nF 1,200 V 56 nF 1,000 V 150 nF 650 V 220 nF 500 V 900 8 12 nF 1,200 V 6 15nF 1,000 V 33 nF 1,000 V 39 nF 650 V 100 nF 650 V 0 100 200 300 400 500 600 700 800 900 47nF 650V 0200 0 0 AC Voltage (Vrms) AC Current (Arms) 7.5 nF 1,200 V 2 18nF 650V 300 100 200 300 0 100 700 800 900 1000 200 300 400 500 600 Frequency (kHz) 700 800 4.7 nF 1,700 V 7.5 nF 1,700 V 8.2 nF 1,700 V 22 nF 1,700 V 47 nF 1,200 V 56 nF 1,000 V 150 nF 650 V 220 nF 500 V 900 6.8 nF 1,700 V 7.5 nF 1,200 V 300 12 nF 1,200 V 15nF 1,000 V 200 33 nF 1,000 V 39 nF 650 V 100 0 1000 1,000 4.7 nF 1,700 V 400 100 nF 650 V 0 100 200 300 400 500 600 700 800 900 1000 Frequency (kHz) Typical AC Current Performance, EIA 3640 (CKC33) Typical AC Voltage Performance, EIA 3640 (CKC33) 700 600 16 14 4.7nF 1700V 12 7.5nF 1700V 10 8.2nF 1700V 22nF 1700V 8 47nF 1200V 56nF 1000V 6 500 AC Voltage (Vrms) Ripple Current (Irms) 600 500 18 150nF 650V 4 220nF 500V 2 0 500 Typical AC Voltage Performance, EIA 2220 (CKC21) Frequency (kHz) 20 400 Frequency (kHz) 600 6.8 nF 1,700 V 4 7.5nF 1000V 700 4.7 nF 1,700 V 10 15nF 1000V 1,000 14 12 150400 100 Frequency (kHz) Typical AC Current Performance, EIA 2220 (CKC21) 16 4.7nF 1000V 50 1000 800 200500 100 Frequency (kHz) 0 18 0 600 250 8 14 0 AC Voltage (Vrms) AC Voltage (Vrms) AC Current (Arms)(Arms) AC Current 12 2 500 Typical AC Voltage Performance 400 20 04 400 Typical AC Voltage Performance, EIA 1812 (CKC18) Typical AC Current Performance 14 300 DC Voltage (V) Temperature (°C) 0 100 200 300 400 500 600 Frequency (kHz) 700 800 900 1000 4.7nF 1700V 400 7.5nF 1700V 300 22nF 1700V 200 56nF 1000V 8.2nF 1700V 47nF 1200V 150nF 650V 220nF 500V 100 0 0 100 200 300 400 500 600 Frequency (kHz) 700 800 900 1000 *Ripple current measurements conditions.- Ripple current measurement were took under ambient temperature. Ripple current measurements performed with a peak capacitor temperature of 150°C. Samples mounted to heat sink with no forced air cooling. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Ordering Information CKC Series CKC = KC-LINK 1 33 C 224 K C G A C TU Case Size Specification/ Capacitance (L"x W") Series Code (pF) Capacitance Tolerance Rated Subclass Dielectric Voltage (V) Designation Termination Finish Packaging (Suffix/C-Spec) 18 = 1812 21 = 2220 33 = 3640 F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% C = 500 V W = 650 V D = 1,000 V E = 1,200 V J = 1,700 V G = 2,000 V G = C0G C = 100% matte Sn See "Packaging C-Spec Ordering Options Table" C = Standard X = Flex1 Two single digits and number of zeros. Use 9 for 1.0 – 9.9 pF e.g., 2.2 pF = 229 A = N/A Flexible termination is only available for EIA 1812 and 2220 case sizes. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. Lead-free Packaging C-Spec Ordering Options Table Packaging/Grade Ordering Code (C-Spec) Packaging Type Commercial Grade Bulk Bag /Unmarked 7" Reel/Unmarked Not required (Blank) TU 1 13" Reel (Embossed Plastic Tape)/Unmarked Automotive Grade 7" Reel 13" Reel (Embossed Plastic Tape)/Unmarked 7210 2 AUTO AUTO7210 Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging. "Bulk Bag" packaging option is not available for case sizes larger than 2225 (5664 Metric). 2 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information." 1 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Dimensions – Millimeters (Inches) L W B T S Standard Termination EIA KC-LINK SIZE CODE CODE METRIC SIZE CODE 18 1812 4532 21 2220 5650 33 3640 9210 Flex Termination EIA KC-LINK SIZE CODE CODE METRIC SIZE CODE 18 1812 4532 21 2220 5650 T THICKNESS B BANDWIDTH S SEPARATION Minimum Mounting Technique 3.20 (0.126) ±0.30 (0.012) 5.00 (0.197) ±0.40 (0.016) 10.20 (0.402) ±0.40 (0.016) See Table 2 for Thickness 0.60 (0.024) ±0.35 (0.014) 0.60 (0.024) ±0.35 (0.014) 1.27 (0.050) ±0.40 (0.016) N/A Solder Reflow Only L LENGTH W WIDTH T THICKNESS B BANDWIDTH S SEPARATION Minimum Mounting Technique 4.50 (0.178) ±0.40 (0.016) 5.90 (0.232) ±0.75 (0.030) 3.20 (0.126) ±0.30 (0.012) 5.00 (0.197) ±0.40 (0.016) See Table 2 for Thickness 0.70 (0.028) ±0.35 (0.014) 0.70 (0.028) ±0.35 (0.014) N/A Solder Reflow Only L LENGTH W WIDTH 4.50 (0.177) ±0.30 (0.012) 5.70 (0.224) ±0.40 (0.016) 9.30 (0.366) ±0.60 (0.024) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Table 1 – Capacitance Range/Selection Waterfall Standard Termination C W D C W D E J C W D E J G 1200 1700 500 650 1000 1200 1700 2000 3640 1000 2220 650 1812 500 CKC33C 1000 Voltage Code Rated Voltage (VDC) CKC21C 650 Capacitance Capacitance Code CKC18C 500 Case Size/Series Product Availability and Chip Thickness Codes See Packaging Specs for Chip Thickness Dimensions M M M M M M M M M M M M M M M M M M M M M M M M M GD GD GD GH GH GK GK GM GM GO GO GH GH GK GM GO GO GD GD GD GH GH GK GK GM GM GO GO GH GH GK GM GO GO GD GD GD GH GH GK GK GM GM GO GO JK JL JL JN JN JK JL JL JL JN JE JE JK JL JN JE JE JK JL JL JN JK JL JL JN JN JK JL JL JL JN JE JE JK JL JN JE JE JK JL JL JN JK JL JL JN JN JK JL JL JL JN JE JE JK JL JN JK JL JL JN JN JK JL JL JL JN JK JL JL JN JN MA MA MA MA MA MB MB MB MB MB MC MC MC MB MB MC MC MC MC MB MB MB MC MC MC MA MA MA MA MA MB MB MB MB MB MC MC MC MB MB MC MC MC MC MB MB MB MC MA MA MA MA MA MB MB MB MB MB MC MC MC MB MB MC MC MC MA MA MA MA MA MB MB MB MB MB MC MC MC MB MB MC MC MA MA MA MA MA MB MB MB MB MB MC MC MC MA MA MA MA MA MB MB MB MB MB MC Rated Voltage (VDC) 1000 500 650 1000 1200 1700 500 650 1000 1200 1700 2000 472 512 562 622 682 752 822 912 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 650 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.1 µF 0.12 µF 0.15 µF 0.18 µF 0.22 µF 500 Capacitance Tolerance F F F F F F F F F F F F F F F F F F F F F F F F F G G G G G G G G G G G G G G G G G G G G G G G G G Voltage Code C C W J C W J G Capacitance Code Capacitance J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K Case Size/Series W D 1812 CKC18C D E 2220 CKC22C D E 3640 CKC33C Note: Flexible termination available only for EIA 1812 and 2220. Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Plastic Quantity Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel GD GH GK GM GO JE JK 1812 1812 1812 1812 1812 2220 2220 1.25 ± 0.15 1.40 ± 0.15 1.60 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.40 ± 0.15 1.60 ± 0.20 1,000 1,000 1,000 500 500 1,000 1,000 Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel Plastic Quantity Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 4,000 4,000 4,000 2,000 2,000 4,000 4,000 JL JN MA MB MC 2220 2220 3640 3640 3640 2.00 ± 0.20 2.50 ± 0.20 1.40 ± 0.15 2.00 ± 0.20 2.50 ± 0.20 500 500 250 250 250 2,000 2,000 1,000 1,000 1,000 13" Reel Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel Plastic Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Table 3 – Performance & Reliability: Test Methods and Conditions Test Reference Test Condition Limits Visual and Mechanical KEMET Internal No defects that may affect performance (10X) Dimensions according KEMET Spec Sheet Capacitance (Cap) KEMET Internal Dissipation Factor (DF) KEMET Internal Insulation Resistance (IR) KEMET Internal 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours 1 kHz ±50 Hz and 1.0 ±0.2 Vrms 500 VDC applied for 120±5 seconds at 25°C Within Tolerance Dissipation factor (DF) maximum limit at 25°C = 0.1% Within Specification To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. 1,000 MΩ-µF or 100 GΩ Temperature Coefficient of Capacitance (TCC) Dielectric Withstanding Voltage (DWV) Frequency: 1 kHz ±50 Hz Capacitance change with reference to +25°C and 0 VDC applied. * See part number specification sheet for voltage KEMET Internal KEMET Internal Step Temperature (°C) 1 +25°C 2 −55°C 3 +25°C (Reference) 4 +150°C Rated DC Voltage DWV Voltage (% of Rated) 500 V 150% 650 V 130% ≥ 1,000 V 120% ±30 PPM / °C Cap: Initial Limit DF: Initial Limit IR: Initial Limit Withstand test voltage without insulation breakdown or damage. (5 ±1 seconds and charge/discharge not exceeding 50 mA) Aging Rate (Maximum % Capacitance Loss/Decade Hour) KEMET Internal Maximum % capacitance loss/decade hour 0% Loss/Decade Hour Shear stress test per specific case size, Time: 60±1 seconds Terminal Strength Case Size Force 3640 18N Kemet Internal © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com No evidence of mechanical damage C1039_KC-LINK_C0G • 3/12/2021 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Table 3 – Performance & Reliability: Test Methods and Conditions cont. Test Reference Test Condition Limits Standard Termination system 3.0 mm Test time: 60±5 seconds Ramp time: 1 mm/seconds Board Flex Solderability J-STD-002 JESD22 Temperature Method JA-104 Cycling Biased Humidity No evidence of mechanical damage AEC-Q200-005 MIL-STD-202 Method 103 Magnification 50X. Conditions: a) Method B, 4 hours at 155°C, dry heat at 235°C b) Method B at 215°C category 3 c) Method D, category 3 at 260°C Visual Inspection. 95% coverage on termination. No leaching 1,000 cycles (−55°C to +150°C) 2-3 cycles per hour Soak Time 1 or 5 minutes Measurement at 24 hours ±4 hours after test conclusion. Cap: Initial Limit DF: Initial Limit IR: Initial Limit Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC. Add 100 K Ω resistor. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K Ω resistor. Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Moisture Resistance MIL-STD-202 Method 106 Number of cycles required 10, 24 hours per cycle. Steps 7a and 7b not required Measurement at 24 hours ±4 hours after test conclusion. Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Thermal Shock MIL-STD-202 Method 107 Number of cycles required 5, (−55°C to 125°C) Dwell time 15 minutes. Cap: Initial Limit DF: Initial Limit IR: Initial Limit High Temperature Life 1,000 hours at 150°C with 1.0 X rated voltage applied. MIL-STD-202 Method 108 Storage Life 1,000 hours at 150°C, Unpowered Within Post Environmental Limits Cap: ±0.3% or ±0.25 pF shift IR: 10% of Initial Limit DF Limits Maximum: 0.5% Vibration MIL-STD-202 Method 204 5 g's for 20 minutes, 12 cycles each of 3 orientations. Test from 10 – 2,000 Hz Cap: Initial Limit DF: Initial Limit IR: Initial Limit Mechanical Shock MIL-STD-202 Method 213 1,500 g’s 0.5ms Half-sine, Velocity Change 15.4 ft/second (Condition F) Cap: Initial Limit DF: Initial Limit IR: Initial Limit Add Aqueous wash chemical OKEMCLEAN (A 6% concentrated Oakite cleaner) or equivalent. Do not use banned solvents Visual Inspection 10X Readable marking, no decoloration or stains. No physical damage. Resistance to MIL-STD-202 Solvents Method 215 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Table 4 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 KCLINK CODE EIA METRIC SIZE SIZE CODE CODE Density Level A: Maximum (Most) Land Protrusion Density Level B: Median (Nominal) Land Protrusion Density Level C: Minimum (Least) Land Protrusion C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 18 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 21 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 33 3640 9210 4.45 1.70 10.70 11.60 11.70 4.35 1.50 10.60 10.70 11.10 4.25 1.30 10.50 10.00 10.80 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET product change notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence Process/Product change Obsolescence* Days Prior To Implementation KEMET assigned Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 1 Customer Notification Due To: KEMET Automotive C-Spec KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. PPAP (Product Part Approval Process) Level KEMET Automotive C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO 1 ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part number specific PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Soldering Process Recommended Reflow Soldering Profile KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J‐STD‐020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Termination Finish TP 100% matte Sn 150°C 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time Above Liquidous (tL) 60 – 150 seconds Peak Temperature (TP) 260°C Time Within 5°C of Maximum Peak Temperature (tP) 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years upon receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Construction Standard Termination Detailed Cross Section Barrier Layer (Ni) Termination Finish (100% matte Sn) Dielectric Material (CaZrO3) Dielectric Material (CaZrO3) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% matte Sn) Inner Electrodes (Ni) Flex Termination Detailed Cross Section Dielectric Material (CaZrO3) End Termination/ Barrier Layer External Electrode (Ni) (Cu) Termination Finish Epoxy Layer (100% Matte (Ag) Sn/SnPb–5% Pb min) Dielectric Material (CaZrO3) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Inner Electrodes (Ni) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Termination Finish (100% Matte Sn/SnPb–5% Pb min) C1039_KC-LINK_C0G • 3/12/2021 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel ® Embossed plastic* or punched paper carrier. ET KEM Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm or 16 mm carrier tape 180 mm (7.00") or 330 mm (13.00") Anti-static cover tape (0.10 mm (0.004") maximum thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic (mm) Embossed Plastic Tape Size (W)* 7" Reel 1812, 2220 12 8 8 3640 24 16 16 EIA Case Size 13" Reel Pitch (P1)* *Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Tables 4 and 5 for tolerance specifications. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 B0 S1 E2 W P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size 12 mm 24 mm D1 Minimum R Reference S1 Minimum T T1 E1 P0 P2 Note 1 Note 2 Note 3 Maximum Maximum 1.5+0.10/−0.0 1.5 1.75±0.10 4.0±0.10 2.0±0.05 30 0.600 0.600 0.600 (0.059+0.004/−0.0) (0.059) (0.069±0.004) (0.157±0.004) (0.079±0.002) (1.181) (0.024) (0.024) (0.024) 1.5 +0.10/-0.0 1.5 1.75 ±0.10 4.0 ±0.10 2.0 ±0.10 30 5 0.250 0.350 (0.059 +0.004/-0.0) (0.059) (0.069 ±0.004) (0.157 ±0.004) (0.078 ±0.003) (1.181) (0.196) (0.009) (0.013) D0 Variable Dimensions — Millimeters (Inches) Tape Size Pitch 12 mm Single (4 mm) and Double (8 mm) 24 mm 16 mm B1 Maximum Note 4 22.25 (0.875) E2 F P1 Minimum 10.25 5.5±0.05 8.0±0.10 (0.404) (0.217±0.002) (0.315±0.004) 11.5 ±0.10 16.0 ±0.10 3 (0.452 ±0.003) (0.629 ±0.004) (0.118) T2 Maximum 4.6 (0.181) 24.3 (0.956) W Maximum 12.3 (0.484) 24.3 (0.956) A0,B0 and K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4) (e) For KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) 24 mm 0.1 to 1.6 Newton (10 to 160 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Typical Component Centerline Ao Figure 3 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum Maximum Rotation ( 20 10 5 ° S) Figure 4 – Bending Radius Embossed Carrier 16 mm Tape Punched Carrier 1.0 mm maximum 1.0 mm maximum R © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R C1039_KC-LINK_C0G • 3/12/2021 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Figure 5 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 7 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 12 mm 178±0.20 (7.008±0.008) or 330±0.20 (13.000±0.008) 1.5 (0.059) 13.0+0.5/−0.2 (0.521+0.02/−0.008) 20.2 (0.795) 1.2 (0.047) 13.0 ±0.2 (0.521 ±0.008) 21 (0.826) 24 mm Variable Dimensions — Millimeters (Inches) Tape Size 12 mm 24 mm N Minimum 50 (1.969) W1 W2 Maximum 12.4+2.0/−0.0 (0.488+0.078/−0.0) 18.4 (0.724) 25 +1.0/−0.0 (0.984 +0.039/−0.0) 27.4 ±1.0 (1.078 ±0.039) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com W3 Shall accommodate tape width without interference C1039_KC-LINK_C0G • 3/12/2021 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 7 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1039_KC-LINK_C0G • 3/12/2021 17