Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency,
High-Density Power Applications (Commercial & Automotive Grade)
Lead-free
Overview
KEMET's KC-LINK™ with KONNEKT™ technology surface
mount capacitors are designed for high-efficiency and
high-density power applications. KONNEKT high density
packaging technology uses an innovative Transient Liquid
Phase Sintering (TLPS) material to create a surface
mount multi-chip solution for high density packaging. By
utilizing KEMET's robust and proprietary C0G base metal
electrode (BME) dielectric system, these capacitors are
well suited for power converters, inverters, snubbers, and
resonators where high efficiency is a primary concern.
KONNEKT technology enables a low-loss, low-inductance
package capable of handling extremely high ripple
currents with no change in capacitance versus DC voltage
and negligible change in capacitance versus temperature.
With an operating temperature range up to 150°C, these
capacitors can be mounted close to fast switching
semiconductors in high power density applications, which
require minimal cooling. KC-LINK with KONNEKT technology
also exhibits high mechanical robustness compared to
other dielectric technologies, allowing the capacitor to be
mounted without the use of metal frames.
These capacitors can also be mounted in a low-loss
orientation to further increase power handling capability.
The low-loss orientation lowers ESR (Effective Series
Resistance) and ESL (Effective Series Inductance) which
increases ripple current handling capability.
Benefits
Applications
• Extremely high-power density and ripple current
capability
• Extremely low equivalent series resistance (ESR)
• Extremely low equivalent series inductance (ESL)
• Low-loss orientation option for higher current handling
capability
• Capacitance offerings ranging from 30 – 880 nF
• DC voltage ratings from 500 – 2,000 V
• Operating temperature range of −55°C to +150°C
• No capacitance shift with voltage
• No piezoelectric noise
• High thermal stability
• Surface mountable using standard MLCC reflow profiles
• Wide bandgap (WBG), silicon carbide (SiC) and gallium
nitride (GaN) systems
• Data centers
• EV/HEV (drive systems, charging)
• LLC resonant converters
• Switched tank converters
• Wireless charging systems
• Photovoltaic systems
• Power converters
• Inverters
• DC link
• Snubber
Standard
Low Loss
Built Into Tomorrow
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Ordering Information
CKC
Series
CKC =
KC-LINK
33
C
884
Case Size Specification/ Capacitance
(L"x W")
Series
Code (pF)
33 = 3640
C=
Standard
Two single
digits and
number of
zeros.
K
C
Capacitance
Tolerance
K = ±10%
G
C
XXXX
Subclass
Rated
Dielectric
Designation
Voltage (V)
Termination
Finish
Orientation and
Packaging
(Suffix/C-Spec)
G=
C0G
C = 100% matte Sn
C = 500 V
W = 650 V
D = 1,000 V
E = 1,200 V
J = 1,700 V
G = 2,000 V
L
L=
KONNEKT
See
"Packaging
C-Spec
Ordering
Options
Table"
Orientation and Packaging (Suffix/C-Spec) Options Table
Mounting Orientation1
Tape and Reel
Illustration
Packaging Type
Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade
7" Reel/Unmarked
TU
13" Reel/Unmarked
7210
7" Reel/Unmarked
7805
13" Reel/Unmarked
7810
Standard
Low Loss
Automotive Grade
7" Reel/Unmarked
AUTO
13" Reel/Unmarked
AUTO7210
7" Reel/Unmarked
AUTO7805
13" Reel/Unmarked
AUTO7810
Standard
Low Loss
1
Orientation refers to the positioning of the KONNEKT capacitors in the Tape and Reel pockets. This allows pick and place machines to place capacitors
on the PCB in the correct orientation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days Prior To
Implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days minimum
AUTO
Yes (without approval)
Yes
90 days minimum
1
1
Customer Notification Due To:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
1
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
2
3
4
5
KEMET assigned1
●
●
●
●
●
AUTO
○
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
Standard Mounting
2 Chips
Standard Mounting
3 Chips
Low Loss Mounting
3 Chips
L
W
W
L
Mounting
2
Standard
3
4
EIA
SIZE
CODE
METRIC
SIZE
CODE
3640
Standard
Low Loss
9210
L
L
B
W
T
T
L
LENGTH
W
WIDTH
T
THICKNESS
9.30 (0.366)
±0.60 (0.024)
10.20 (0.402)
±0.40 (0.016)
10.20 (0.402)
±0.40 (0.016)
7.70 (0.303)
±0.60 (0.24)
10.20 (0.402)
±0.40 (0.016)
10.30 (0.405)
±0.80 (0.031)
5.10 (0.201)
±0.40 (0.016)
7.70 (0.303)
±0.60 (0.24)
10.20 (0.402)
±0.40 (0.016)
10.30 (0.405)
±0.80 (0.031)
10.20 (0.402)
±0.40 (0.016)
Standard
Low Loss
W
Low Loss Mounting
4 Chips
B
T
T
Number
of Chips
W
B
B
T
B
L
Standard Mounting
4 Chips
B
BANDWIDTH
Mounting
Technique
Typical
Average
Piece Weight
(g)
2.2
3.3
1.27 (0.050) Solder Reflow
±0.40 (0.016)
Only
3.3
4.3
4.3
Environmental Compliance
Lead-free
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Typical Performance
Number of Chips
Mounting
Configuration
Typical ESR at
25°C, 100 kHz
Typical ESL
at 25°C
2
Standard
< 2.5 mΩ
< 1.5 nH
3
Standard
< 2.5 mΩ
< 2.2 nH
3
Low Loss
< 1.6 mΩ
< 0.75 nH
4
Standard
< 2.5 mΩ
< 2.7 nH
4
Low Loss
< 1.1 mΩ
< 0.45 nH
Capacitance Change (%)
Capacitance Change (%)
10.00
5.00
0.00
-5.00
-10.00
-55
-35
-15
5
25
45
65
85
105
See Typical Performance
Curves Below
Capacitance Change vs DC Voltage
Capacitance Change vs Temperature
10.00
125
5.00
0.00
-5.00
-10.00
145
0
100
200
Typical AC Current Performance
Standard Orientation
500
700
18
600
16
14
12
(Vrms)
Typical AC Current Performance
1700V Standard Orientation
20
10
168
6
12
4
44nF 2-Chip
82
66nF 3-Chip
0
88nF 4-Chip
4 0
0
100
200
300
400
500
600
700
800
Frequency (kHz)
100
2004.7 nF 1,700
300 V
47 nF 1,200 V
1,700 V
400 7.5 nF500
600
56 nF 1,000 V
Frequency (kHz)
8.2 nF 1,700 V
22 nF 1,700 V
150 nF 650 V
220 nF 500 V
700
800
900
900
1,000
AC Voltage
AC Voltage (Vrms)
(Arms)
400
Typical AC Voltage Performance
20
AC Current
AC Current (Arms)
300
DC Voltage (V)
Temperature (°C)
0
Typical Ripple Current
Typical AC Voltage Performance
1700V Standard Orientation
500
700
400
600
300
500
200
400
44nF 2-Chip
100
300
66nF 3-Chip
88nF 4-Chip
2000
0
100
1000
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
0
0
100
100
200
200
300V
4.7 nF 1,700
47 nF 1,200 V
300
400
500
600
Frequency (kHz)
4007.5 nF500
1,700 V 600
Frequency
56 nF 1,000 V(kHz)
700
800
8.2700
nF 1,700 V800
900
1000
22 nF 1,700
V
150 nF 650 V
220 nF 500 V
900
1,000
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Typical Performance cont.
Standard Orientation
Typical AC Voltage Performance
1,200 V Standard Orientation
Typical AC Current Performance
1,200 V Standard Orientation
450
20
400
12
94nF 2-Chip
8
140nF 3-Chip
200nF 4-Chip
AC Voltage (Vrms)
AC Current (Arms)
16
4
350
300
250
94nF 2-Chip
200
140nF 3-Chip
150
200nF 4-Chip
100
50
0
0
100
200
300
400
500
600
700
800
900
0
1000
0
100
200
300
Frequency (kHz)
400
500
600
700
800
900
1000
Frequency (kHz)
Typical AC Voltage Performance
1,000 V Standard Orientation
Typical AC Current Performance
1,000 V Standard Orientation
450
20
400
12
110nF 2-Chip
8
170nF 3-Chip
220nF 4-Chip
4
AC Voltage (Vrms)
AC Current (Arms)
16
350
300
250
110nF 2-Chip
200
170nF 3-Chip
150
220nF 4-Chip
100
50
0
0
100
200
300
400
500
600
700
800
900
0
1000
0
100
200
300
Frequency (kHz)
16
200
12
300nF 2-Chip
8
450nF 3-Chip
600nF 4-Chip
4
200
300
400
500
600
700
800
900
AC Voltage (Vrms)
AC Current (Arms)
250
100
450nF 3-Chip
600nF 4-Chip
0
100
200
300
660nF 3-Chip
880nF 4-Chip
4
600
700
800
900
1000
AC Voltage (Vrms)
AC Current (Arms)
440nF 2-Chip
500
500
600
700
800
900
1000
Typical AC Voltage Performance
500 V Standard Orientation
8
400
400
Frequency (kHz)
12
300
1000
50
0
16
200
900
300nF 2-Chip
1000
20
100
800
100
Typical AC Current Performance
500 V Standard Orientation
0
700
150
Frequency (kHz)
0
600
Typical AC Voltage Performance
650 V Standard Orientation
20
0
500
Frequency (kHz)
Typical AC Current Performance
650 V Standard Orientation
0
400
200
180
160
140
120
100
80
60
40
20
0
Frequency (kHz)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
440nF 2-Chip
660nF 3-Chip
880nF 4-Chip
0
100
200
300
400
500
600
700
800
900
1000
Frequency (kHz)
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Typical Performance cont.
Low Loss Orientation
Typical AC Voltage Performance
1700V Low Loss Orientation
30
700
25
600
20
15
66nF 3-Chip Low Loss
10
88nF 4-Chip Low Loss
AC Voltage (Vrms)
AC Current (Arms)
Typical AC Current Performance
1700V Low Loss Orientation
5
0
500
400
300
66nF 3-Chip Low Loss
88nF 4-Chip Low Loss
200
100
0
100
200
300
400
500
600
700
800
900
0
1000
0
100
200
300
400
Frequency (kHz)
20
15
140nF 3-Chip Low Loss
200nF 4-Chip Low Loss
10
AC Voltage (Vrms)
AC Current (Arms)
25
5
1000
300
250
200
140nF 3-Chip Low Loss
150
200nF 4-Chip Low Loss
100
50
0
100
200
300
400
500
600
700
800
900
0
1000
0
100
200
300
400
500
600
700
800
900
1000
Frequency (kHz)
Typical AC Voltage Performance
1000V Low Loss Orientation
Typical AC Current Performance
1000V Low Loss Orientation
450
30
400
20
15
170nF 3-Chip Low Loss
10
220nF 4-Chip Low Loss
AC Voltage (Vrms)
25
AC Current (Arms)
900
350
Frequency (kHz)
5
350
300
250
200
140nF 3-Chip Low Loss
150
200nF 4-Chip Low Loss
100
50
0
100
200
300
400
500
600
700
800
900
0
1000
0
100
200
300
400
Frequency (kHz)
200
20
15
450nF 3-Chip Low Loss
10
600nF 4-Chip Low Loss
AC Voltage (Vrms)
250
25
200
300
400
500
600
700
700
800
900
1000
150
800
900
450nF 3-Chip Low Loss
100
5
100
600
Typical AC Voltage Performance
650V Low Loss Orientation
30
0
500
Frequency (kHz)
Typical AC Current Performance
650V Low Loss Orientation
AC Current (Arms)
800
400
30
0
700
450
35
0
600
Typical AC Voltage Performance
1200V Low Loss Orientation
Typical AC Current Performance
1200V Low Loss Orientation
0
500
Frequency (kHz)
1000
Frequency (kHz)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
600nF 4-Chip Low Loss
50
0
0
100
200
300
400
500
600
700
800
900
1000
Frequency (kHz)
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Typical Performance cont.
Low Loss Orientation
Typical AC Voltage Performance
500V Low Loss Orientation
30
250
25
200
20
15
660nF 3-Chip Low Loss
10
880nF 4-Chip Low Loss
AC Voltage (Vrms)
AC Current (Arms)
Typical AC Current Performance
500V Low Loss Orientation
150
5
0
0
100
200
300
400
500
600
700
800
900
660nF 3-Chip Low Loss
100
0
1000
880nF 4-Chip Low Loss
50
0
100
200
300
Frequency (kHz)
400
500
600
700
800
900
1000
Frequency (kHz)
Table 1A - Product Ordering Codes and Ratings
Case Size
Capacitance
30 nF
45 nF
60 nF
44 nF
66 nF
88 nF
94 nF
140 nF
200 nF
110 nF
170 nF
220 nF
300 nF
450 nF
600 nF
440 nF
660 nF
880 nF
Capacitance
Code
303
453
603
443
663
883
943
144
204
114
174
224
304
454
604
444
664
884
Number of
Chips
2
3
4
2
3
4
2
3
4
2
3
4
2
3
4
2
3
4
3640
Voltage Code
C
W
D
E
J
G
Rated Voltage (VDC)
Capacitance
Tolerance
500
650
1,000
1,200
1,700
2,000
Product Availability
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
These products are protected under one or more of the following Patents: US Pat. No. 9,472,342B2, EP Pat. No. 2923366B1, JP Pat. No. 06091639B2,
TW Pat. No. 579873B, US Pat. No. 10,068,707B2.
Table 1B – Chip Thickness/Tape & Reel Packaging Quantities
Case
Size
Number of
Chips
2
3640
3
4
Orientation
Standard
Standard
Low Loss
Standard
Low Loss
Plastic Quantity
7" Reel
13" Reel
125
75
50
50
50
575
375
275
225
225
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Table 2 – Performance & Reliability: Test Methods and Conditions
Test
Reference
Test Condition
Limits
Visual and
Mechanical
KEMET
Internal
No defects that may affect performance (10X)
Dimensions according KEMET Spec Sheet
Capacitance
(Cap)
KEMET
Internal
Dissipation
Factor (DF)
KEMET
Internal
Insulation
Resistance
(IR)
KEMET
Internal
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance
Capacitance measurements (including tolerance) are
indexed to a referee time of 1,000 hours
1 kHz ±50 Hz and 1.0 ±0.2 Vrms
500 VDC applied for 120±5 seconds at 25°C
Within Tolerance
Dissipation factor (DF) maximum limit
at 25°C = 0.1%
Within Specification
To obtain IR limit, divide MΩ-µF value by the
capacitance and compare to GΩ limit.
Select the lower of the two limits.
1,000 MΩ-µF or 100 GΩ
Temperature
Coefficient of
Capacitance
(TCC)
Dielectric
Withstanding
Voltage
(DWV)
Frequency: 1 kHz ±50 Hz
Capacitance change with reference to +25°C
and 0 VDC applied.
* See part number specification sheet for voltage
KEMET
Internal
KEMET
Internal
Step
Temperature (°C)
1
+25°C
2
−55°C
3
+25°C (Reference)
4
+150°C
Rated
DC Voltage
DWV Voltage
(% of Rated)
500 V
150%
650 V
130%
≥ 1,000 V
120%
±30 PPM / °C
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Withstand test voltage without insulation
breakdown or damage.
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Aging Rate
(Maximum %
Capacitance
Loss/Decade
Hour)
KEMET
Internal
Maximum % capacitance loss/decade hour
0% Loss/Decade Hour
Shear stress test per specific case size,
Time: 60±1 seconds
Terminal
Strength
Case Size
Force
3640
18N
Kemet
Internal
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
No evidence of mechanical damage
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Table 2 – Performance & Reliability: Test Methods and Conditions cont.
Test
Reference
Test Condition
Limits
Standard Termination system 3.0 mm
Test time: 60±5 seconds
Ramp time: 1 mm/seconds
Board Flex
AEC-Q200-005
Solderability
KEMET
Custom
Test
JESD22
Temperature
Method JA-104
Cycling
Biased
Humidity
MIL-STD-202
Method 103
No evidence of mechanical damage
1. Board shear – SAC305 solder.
Shear force of 1.8 kg (minimum)
2. Wetting balance – IEC 60068–2–69
1,000 cycles (−55°C to +150°C)
2-3 cycles per hour
Soak Time 1 or 5 minutes
Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC.
Add 100 K Ω resistor.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V.
Add 100 K Ω resistor.
Visual Inspection.
95% coverage on termination.
No leaching
Measurement at 24 hours ±4 hours
after test conclusion.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Measurement at 24 hours ±4 hours
after test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Moisture
Resistance
MIL-STD-202
Method 106
Number of cycles required 10, 24 hours per cycle.
Steps 7a and 7b not required
Measurement at 24 hours ±4 hours
after test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Thermal
Shock
MIL-STD-202
Method 107
Number of cycles required 5, (−55°C to 125°C)
Dwell time 15 minutes.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
High
Temperature
Life
1,000 hours at 150°C with 1.0 X rated voltage applied.
MIL-STD-202
Method 108
Storage Life
1,000 hours at 150°C, Unpowered
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Vibration
MIL-STD-202
Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations.
Test from 10 – 2,000 Hz
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Mechanical
Shock
MIL-STD-202
Method 213
1,500 g’s 0.5ms Half-sine, Velocity Change 15.4 ft/second
(Condition F)
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Add Aqueous wash chemical OKEMCLEAN
(A 6% concentrated Oakite cleaner) or equivalent.
Do not use banned solvents
Visual Inspection 10X
Readable marking, no decoloration or stains.
No physical damage.
Resistance to MIL-STD-202
Solvents
Method 215
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Table 3 – KONNEKT Land Pattern Design Recommendations per IPC-7351 (mm)
Chip
Number
Orientation
EIA SIZE
CODE
Median (Nominal) Land
Protrusion
METRIC
SIZE CODE
C
2
3
4
Y
X
V1
V2
Standard
4.35
1.5
10.6
10.7
11.1
Standard
4.35
1.5
10.6
10.7
11.1
Low Loss
4.35
1.5
8.3
10.7
8.8
Standard
3640
9210
4.35
1.5
10.6
10.7
11.1
Low Loss
4.35
1.5
10.7
10.7
11.2
KONNEKT 3640 2-Chip
Standard
Low Loss
(Land Pattern Design Recommendations per IPC-7351, top view)
Not available in Low Loss
KONNEKT 3640 3-Chip
Standard
Low Loss
(Land Pattern Design Recommendations per IPC-7351, top view)
KONNEKT 3640 4-Chip
Standard
Low Loss
(Land Pattern Design Recommendations per IPC-7351, top view)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Soldering Process
Recommended Reflow Soldering Profile
KEMET's KONNEKT family of high density surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with
convection and IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress.
KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020
standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these
conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Termination Finish
TP
100% matte Sn
150°C
200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second maximum
Liquidous Temperature (TL)
217°C
Time Above Liquidous (tL)
60 – 150 seconds
Peak Temperature (TP)
260°C
Time Within 5°C of Maximum Peak
Temperature (tP)
30 seconds maximum
Ramp-Down Rate (TP to TL)
6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Hand Soldering and Removal of KONNEKT Capacitors
The preferred method of attachment for KEMET’s KONNEKT Capacitors is IR or convection reflow where temperature, time
and air flow are well controlled.
However, it is understood that the manual attachment of KONNEKT capacitors is necessary for prototype and lab testing. In
these instances, care must be taken not to introduce excessive temperature gradients in the KONNEKT part type that may
lead to cracking in the ceramic or separation of the TLPS material.
Please see KEMET's KONNEKT Soldering Guidelines here.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid
condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability chip stock should be used promptly, preferably within 1.5 years upon receipt.
Construction
Dielectric Material
(CaZrO3)
Bonding Material
(See Image Below)
Detailed Cross Section
Dielectric Material
(CaZrO3)
Termination Finish
(100% matte Sn)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% matte Sn)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
Bonding Material
MLCC
CuSn TLPS
MLCC
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance
with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table
1B for details on reeling quantities for commercial chips.
KONNEKT
Low loss
orientation
in pocket
KONNEKT
Standard
orientation
in pocket
Bar code label
Anti-static reel
®
ET
KEM
Embossed
plastic carrier
Embossed
plastic carrier
Sprocket
holes
Embossment
cavity
16 mm carrier tape
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
180 mm (7.00")
or
330 mm (13.00")
Table 4 – Carrier Tape Configuration, Embossed Plastic (mm)
EIA Case Size
Chip
Number
Tape Size
(W)*
2
KONNEKT 3640
3
4
24
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)2
20
20
20
20
24
24
1. Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
2. Refer to Tables 4 and 5 for tolerance specifications.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
P0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
E1
F
K0
B1
S1
W
E2
B0
P1
T1
Center Lines of Cavity
ØD1
Cover Tape
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 5 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape
Size
D0
D1 Minimum
Note 1
E1
P0
P2
R Reference
Note 2
24 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.5
(0.059)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
30
(1.181)
S1 Minimum
T
T1
Note 3
Maximum Maximum
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Number
of Chips
2,3
4
Tape
Size
24 mm
Pitch
20mm
24mm
B1 Maximum
Note 4
E2
Minimum
F
P1
T2
Maximum
W
Maximum
A0,B0 & K0
12.1
(0.476)
22.25
(0.875)
11.5+/−0.10
(0.452±0.004)
20.0±0.10
(0.787±0.004)
24.0±0.10
(0.944±0.004)
11.2
(0.441)
24.3
(0.957)
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4)
(e) For KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
24 mm
0.1 to 1.6 newton (10 to 160 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Typical Component Centerline
Ao
Figure 3 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
Maximum
Rotation (
20
10
5
°
S)
Figure 4 – Bending Radius
Embossed
Carrier
16 mm Tape
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Bending
Radius
R
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Figure 5 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
24 mm
178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059)
13.0+0.5/−0.2
(0.521+0.02/−0.008)
20.2
(0.795)
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
See Note 2, Tables 2-3
W1
W2 Maximum
W3
24 mm
50
(1.969)
25+1.0/−0.0
(0.984+0.039/−0.0)
27.4+1.0/−1.0
(1.078+0.039/−0.039)
Shall accommodate tape
width without interference
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
Figure 6 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 7 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Efficiency, High-Density Power Applications (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1105_KONNEKT_KC-Link_C0G • 10/14/2020
19
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