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L0806C3R3MDMIT

L0806C3R3MDMIT

  • 厂商:

    KEMET(基美)

  • 封装:

    0806

  • 描述:

    固定电感器 0806 3.3µH ±20% 1.1A 160mΩ

  • 数据手册
  • 价格&库存
L0806C3R3MDMIT 数据手册
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Overview Applications KEMET L-DMI ferrite-based Multilayer Chip Power Inductors are ideal for use in DC to DC switching power supplies. The small size of this chip inductor makes it suitable for mobile equipement that requires tight space both in dimension and in height. The internal printed coil structure creates a closed magnetic circuit, which acts as a magnetic shield eliminating crosstalk, thus permitting higher mounting densities. The multilayer block structure yields higher reliability. In addition, the inductor shows excellent low DC power dissipation, due to low Rdc with a high aspect ratio internal conductor that stands on unique green sheet and printing technologies. • Switching DC-DC power supplies • Wearables • Smartphone • Tablet device • Digital still camera • HDD Benefits • Unique green sheet and printing technologies • High reliability • High current • Low DCR • Inductance value from 0.47 – 4.7 µH • Rated current range from 0.65 – 1.8 A • Operating temperature range from –40°C to +85°C • Low profile 1.2 mm maximum Part Number System L 0603 C 1R0 M DMI T Inductor EIA Case Size (L" x W") Specification Inductance Value (µH) Inductance Tolerance Series Packaging 0603 (1608 in mm) 0805 (2012 in mm) 0806 (2016 in mm) 1008 (2520 in mm) C = Commercial L = 0.8 mm maximum height S = High saturation type Q = 1.2 mm maximum height DMI = High current multilayer chip type T = Tape & Reel R = decimal point Examples: R47 = 0.47 µH 1R0 = 1.0 µH M = ±20% One world. One KEMET © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com L9014_L-DMI • 7/7/2020 1 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Dimensions – Millimeters (Inches) Dimensions - Millimeters (Inches) W Land Pattern - Millimeters Land Pattern L Chip Inductor B T Solder−resist C B A B EIA Size Code Metric Size Code L Length W Width T Thickness B Bandwidth A B C 0603 1608 1.60 (0.063) ±0.15 (0.006) 0.80 (0.031) ±0.15 (0.006) 0.95 (0.037) Maximum 0.30 (0.012) ±0.20 (0.008) 0.8 ~ 1.0 0.6 ~ 0.8 0.6 ~ 0.8 0805 2012 0.50 (0.020) ±0.30 (0.012) 0.50 (0.020) ±0.30 (0.012) 0.9 ~ 1.6 0.8 ~ 1.2 0.8 ~ 1.2 1.2 ~ 2.0 1008 2520 2.50 (0.098) ±0.20 (0.008) 2.00 (0.079) ±0.20 (0.008) 1.00 (0.039) Maximum 1.00 (0.039) Maximum 0.80 (0.031) Maximum 1.00 (0.039) Maximum 1.20 (0.047) Maximum 0.8 ~ 1.2 2016 1.25 (0.049) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008) 0.8 ~ 1.2 0806 2.00 (0.079) ±0.20 (0.008) 2.00 (0.079) ±0.20 (0.008) 1.0 ~ 1.4 0.6 ~ 1.0 1.8 ~ 2.2 0.50 (0.020) ±0.30 (0.012) Performance Characteristics Item Operating Temperature Range Rated Inductance Range Inductance Tolerance Inductance Measurement Condition Rated Current Range Rated DC Resistance Range Typical Rated DC Resistance Range Maximum Performance Characteristics –40°C to +85°C 0.47 – 4.7 µH ±20% 1 MHz 0.65 – 1.8 A 0.04 – 0.27 Ω 0.05 – 0.3 Ω © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com L9014_L-DMI • 7/7/2020 2 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Environmental Compliance All KEMET Chip Inductors are RoHS and REACH Compliant. Table 1 – Ratings & Part Number Reference 1  Part Number Inductance (µH) at 1 MHz Inductance Tolerance DC Resistance (Ω) Typical DC Resistance (Ω) Maximum L0603CR50MDMIT 0.5 L0603C1R0MDMIT 1.0 Rated Current (A) Maximum1 ±20% 0.12 0.15 0.9 ±20% 0.17 0.2 0.75 L0603C2R2MDMIT 2.2 ±20% 0.27 0.3 0.65 L0805CR47MDMIT 0.47 ±20% 0.06 0.08 1.2 L0805C1R0MDMIT 1.0 ±20% 0.11 0.14 1 L0805C1R5MDMIT 1.5 ±20% 0.15 0.2 0.8 L0805C2R2MDMIT 2.2 ±20% 0.15 0.2 0.8 L0805C3R3MDMIT 3.3 ±20% 0.2 0.24 0.7 L0805C4R7MDMIT 4.7 ±20% 0.23 0.28 0.7 L0806CR47MDMIT 0.47 ±20% 0.06 0.075 1.6 L0806C1R0MDMIT 1.0 ±20% 0.09 0.12 1.3 L0806C1R5MDMIT 1.5 ±20% 0.1 0.13 1.2 L0806C2R2MDMIT 2.2 ±20% 0.11 0.14 1.2 L0806C3R3MDMIT 3.3 ±20% 0.13 0.16 1.1 L0806C4R7MDMIT 4.7 ±20% 0.16 0.2 0.9 L1008CR47MDMIT 0.47 ±20% 0.04 0.05 1.8 L1008C1R0MDMIT 1.0 ±20% 0.07 0.08 1.4 L1008C1R5MDMIT 1.5 ±20% 0.08 0.09 1.3 L1008C2R2MDMIT 2.2 ±20% 0.08 0.09 1.3 L1008C3R3MDMIT 3.3 ±20% 0.09 0.12 1.2 L1008C4R7MDMIT 4.7 ±20% 0.12 0.15 1.1 L1008L1R5MDMIT 1.5 ±20% 0.08 0.09 1.3 L1008L2R2MDMIT 2.2 ±20% 0.08 0.1 1.2 L1008S1R0MDMIT 1.0 ±20% 0.09 0.115 1.2 L1008S2R2MDMIT 2.2 ±20% 0.09 0.115 1.2 L1008S4R7MDMIT 4.7 ±20% 0.14 0.16 1.1 1.2 L1008Q1R0MDMIT 1.0 ±20% 0.09 0.12 L1008Q2R2MDMIT 2.2 ±20% 0.12 0.15 1.1 L1008Q3R3MDMIT 3.3 ±20% 0.11 0.15 1.1 L1008Q4R7MDMIT 4.7 ±20% 0.14 0.16 1.1 Part Number Inductance (µH) at 1 MHz Inductance Tolerance DC Resistance (Ω) Typical DC Resistance (Ω) Maximum Rated Current (A) Maximum1 T = 40 K rise at rated current at 20°C © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com L9014_L-DMI • 7/7/2020 3 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI DC-Superposed Characteristics L0603CR50MDMIT Inductance (µH) Inductance (µH) L0603C1R0MDMIT Idc (A) Idc (A) Inductance (µH) L0805CR47MDMIT Inductance (µH) L0603C2R2MDMIT Idc (A) Inductance (µH) L0805C1R5MDMIT Inductance (µH) L0805C1R0MDMIT Idc (A) Idc (A) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Idc (A) L9014_L-DMI • 7/7/2020 4 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI DC-Superposed Characteristics cont. Inductance (µH) L0805C3R3MDMIT Inductance (µH) L0805C2R2MDMIT Idc (A) Inductance (µH) L0806CR47MDMIT Inductance (µH) L0805C4R7MDMIT Idc (A) Idc (A) Inductance (µH) L0806C1R5MDMIT Inductance (µH) L0806C1R0MDMIT Idc (A) Idc (A) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Idc (A) L9014_L-DMI • 7/7/2020 5 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI DC-Superposed Characteristics cont. L0806C3R3MDMIT Inductance (µH) Inductance (µH) L0806C2R2MDMIT Idc (A) Idc (A) Inductance (µH) L1008CR47MDMIT Inductance (µH) L0806C4R7MDMIT Idc (A) Inductance (µH) L1008C1R5MDMIT Inductance (µH) L1008C1R0MDMIT Idc (A) Idc (A) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Idc (A) L9014_L-DMI • 7/7/2020 6 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI DC-Superposed Characteristics cont. L1008C3R3MDMIT Inductance (µH) Inductance (µH) L1008C2R2MDMIT Idc (A) Idc (A) Inductance (µH) L1008L1R5MDMIT Inductance (µH) L1008C4R7MDMIT Idc (A) Inductance (µH) L1008S1R0MDMIT Inductance (µH) L1008L2R2MDMIT Idc (A) Idc (A) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Idc (A) L9014_L-DMI • 7/7/2020 7 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI DC-Superposed Characteristics cont. Inductance (µH) L1008S4R7MDMIT Inductance (µH) L1008S2R2MDMIT Idc (A) Inductance (µH) L1008Q2R2MDMIT Inductance (µH) L1008Q1R0MDMIT Idc (A) Idc (A) Inductance (µH) L1008Q4R7MDMIT Inductance (µH) L1008Q3R3MDMIT Idc (A) Idc (A) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Idc (A) L9014_L-DMI • 7/7/2020 8 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Taping Specifications - Millimeters (Inches) 0603 Paper Tape 8mm Width A B T 8.0±0.3 (0.315±0.012) 1.75±0.1 (0.069±0.004) 3.5±0.05 (0.138±0.002) Ø1.5±0.1/−0 (Ø0.059±0.004/−0) Sprocket Hole P 2.0±0.05 (0.079±0.002) 4.0±0.1 (0.157±0.004) EIA Case Size Metric Case Size Height Reel Quantity 0603 1608 0.8 4,000   Cavity Pitch Thickness A B P T Nominal 1.0 1.8 4.0 1.1 Tolerance ±0.2 ±0.2 ±0.1 Maximum © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com L9014_L-DMI • 7/7/2020 9 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Taping Specifications - Millimeters (Inches) cont. 0805, 0806, 1008 Embossed (Plastic) Tape 8mm Width 1.75±0.1 (0.069±0.004) A B T 8.0±0.3 (0.315±0.012) 3.5±0.05 (0.138±0.002) Ø1.5±0.1/−0 (Ø0.059±0.004/−0) Sprocket Hole K P 2.0±0.05 (0.079±0.002) EIA Metric Case Size Case Size 4.0±0.1 (0.157±0.004) Height Reel Quantity   Cavity Pitch A B P Nominal 1.55 2.30 4.00 Tolerance ±0.2 ±0.2 ±0.1 Nominal 1.80 2.20 4.00 Tolerance ±0.1 ±0.1 ±0.1 0805 2012 0.9 3,000 0806 2016 0.9 3,000 0.7 3,000 Nominal 2.3 2.8 4 0.9 3,000 Tolerance ±0.1 ±0.1 ±0.1 1.1 2,000 Nominal 2.30 2.80 4.00 Tolerance ±0.1 ±0.1 ±0.1 1008 2520 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Thickness T K 0.30 1.3 0.25 1.3 0.30 1.4 0.30 1.7 L9014_L-DMI • 7/7/2020 10 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Reel Specifications - Millimeters t E C B D R A W Dimensions - Millimeters Series L-DMI A B C D E R t W Nominal ø178.0 ø60.0 ø13.0 ø21.0 2.0 1.0 2.5 10.0 Tolerance ±2.0 Minimum ±0.2 ±0.8 ±0.5 Maximum ±1.5 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com L9014_L-DMI • 7/7/2020 11 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Recommended Reflow Soldering Profile Temperature 300°C Peak 260°C maximum 10 seconds maximum 200°C Heating above 230°C 40 seconds maximum 100°C Preheating 150°C 60 seconds minimum 0°C Time Handling Precautions Inductors should be stored in normal working environments. While the inductors themselves are quite robust in other environments, exposure to high temperatures, high humidity, corrosive atmospheres, and long-term storage degrades solderability. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. Atmospheres should be free of chlorine-bearing and sulfur-bearing compounds. Temperature fluctuations should be minimized to avoid condensation on the parts. For optimized solderability, inductor stock should be used promptly, preferably within six months of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com L9014_L-DMI • 7/7/2020 12 Chip Inductors High Current Multilayer Chip Power Inductor L-DMI KEMET Electronics Corporation Sales Offices For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. When providing KEMET products and technologies contained herein to other countries, the customer must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the International Traffi c in Arms Regulations (ITAR), the US Export Administration Regulations (EAR) and the Japan Foreign Exchange and Foreign Trade Act. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com L9014_L-DMI • 7/7/2020 13
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