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L1GN50B563KA02

L1GN50B563KA02

  • 厂商:

    KEMET(基美)

  • 封装:

    DIP6

  • 描述:

    贴片电容(MLCC) DIP6 56nF ±10% 630V C0G(NP0)

  • 数据手册
  • 价格&库存
L1GN50B563KA02 数据手册
KEMET Part Number: L1GN50B563KA02 KPS-MCC Indust C0G HT200C, Ceramic, 0.056 uF, 10%, 630 VDC, C0G General Information Series: KPS-MCC Indust C0G HT200C Style: Leaded Stacked Chip Low ESR, Stacked Ceramic Chips 200C, Low ESR, High Thermal Stability, Bulk Capacitance With Exemptions Description: Features: RoHS: REACH: SCIP Number: Termination: Lead: AEC-Q200: Dimensions D Notes: 6.35mm +/-0.635mm L 6.35mm MIN H 2.54mm NOM F 1.397mm +/-0.25mm A 5.3mm MAX B 7.078mm MAX C 6.35mm +/-0.635mm E 7.62mm MAX K 0.5mm NOM Packaging Quantity: Waffle, Box No Number of chips in this stack: 2. Capacitance: 0.056 uF Capacitance Tolerance: 10% Voltage DC: Dielectric Withstanding Voltage: Temperature Range: 630 VDC Dissipation Factor: Packaging: Straight Leads Specifications Temperature Coefficient: Packaging Specifications SVHC (Pb – CAS 7439-92-1) 297427bb-2a48-4853b594-641304a2cc24 Silver Aging Rate: Insulation Resistance: 819 VDC -55/+200°C C0G 0.1% 1 kHz 25C 0% Loss/Decade Hour 17.86 GOhms 50 Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Generated 11/01/2021 - b6110510-cc4d-4389-9824-80871b153cd4 © 2006 - 2021 KEMET
L1GN50B563KA02 价格&库存

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