Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations, the user should perform
qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351).
1
Height of these chips may create problems in wave soldering.
V1
L
L
W
W
S
Grid Placement Courtyard
V2
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* For Case Size height > 2.5 mm
** For Case Size height ≤ 2.5 mm
TP
Temperature
TL
tL
Tsmax
Tsmin
25
tP
Maximum Ramp Up Rate = 3°C/second
Maximum Ramp Down Rate = 6°C/second
ts
25°C to Peak
Time
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2
Polarity Stripe (+)
Molded Epoxy
Case
Detailed Cross Section
Silver Paint
(Fourth Layer)
Polarity
Bevel (+)
Tantalum Wire
Leadframe
(fl Cathode)
Washer
Tantalum Wire
Weld
(to attach wire)
Carbon
(Third Layer)
Silver Adhesive
Leadframe
(+ Anode)
Molded Epoxy
Case
KEMET
Industrial
Grade MnO2
Polarity
Indicator (+)
Picofarad
Code
KEMET
ID
Rated
Voltage
Date
Code*
* 301 = 1st week of 2023
MnO2
(Second Layer)
Washer
Ta2O5 Dielectric
(First Layer)
Tantalum
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2
EIA Standard 481
Right hand
orientation
only
(+)
Embossed carrier
(fl)
Embossment
Top tape thickness
0.10 mm (0.004”)
maximum thickness
8 mm (0.315”) or
12 mm (0.472”)
* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging.
180 mm (7.0”) or
330 mm (13.”)
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2
P2
T
T2
ØD0
P0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
E1
F
K0
B1
B0
S1
E2
W
P1
T1
Center Lines of Cavity
Cover Tape
B1 is for tape feeder reference only,
including draft concentric about B0.
ØD1
Embossment
For cavity size,
see Note 1, Table 4
User Direction of Unreeling
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape, with or without components, shall pass around R without damage (see Figure 4).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3).
(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2
Refer to EIA
Standards 556 and 624
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Width (mm)
8, 12
Bo
Maximum
Rotation (
20
°
T)
Typical Component Centerline
°
s
Tape
Maximum
Width (mm) Rotation (
8, 12
20
°
S)
Ao
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
Embossed
Carrier
Punched
Carrier
R
Bending
Radius
R
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2
Full Radius,
See Note
Access Hole at
Slot Location
(Ø 40 mm minimum)
W3
(Includes
flange distortion
at outer edge)
W2
A
D
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
(Measured at hub)
W1
(Measured at hub)
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum Leader
400 mm minimum
Top Cover Tape
Elongated Sprocket Holes
(32 mm & wider tapes)
1 mm maximum, either direction
Straight Edge
250 mm
Carrier Tape
Round Sprocket Holes
Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2
KEMET is a registered trademark of KEMET Electronics Corporation.
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