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T495X475K050AH4095

T495X475K050AH4095

  • 厂商:

    KEMET(基美)

  • 封装:

    X7343-43

  • 描述:

    钽电容 X7343-43 4.7µF ±10% 50V 300mΩ 7.30 x 4.30mm 4.30mm

  • 数据手册
  • 价格&库存
T495X475K050AH4095 数据手册
Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Overview The low ESR, surge-robust High Reliability Series (HRA) T495 is designed for demanding applications that require high surge current and high ripple current capability. This T495 is approved for DLA Drawing 95158, incorporating an intensive testing and screening protocol that is customizable depending on specific customer requirements. This series offers several advantages such as low ESR, high ripple current capability, excellent capacitance stability, and improved resistance to high in-rush currents. These benefits are achieved through a combination of proprietary design, materials, and process parameters, as well as high-stress, low impedance electrical conditioning performed prior to screening. Benefits • Approved for DLA Drawing 95158 • Meets or exceeds EIA standard 535BAAC • Taped and reeled per EIA 481 • High surge current capability • Optional gold-plated terminations • High ripple current capability • 100% surge current test • 100% steady-state accelerated aging Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Applications Typical applications include decoupling and filtering in defense applications, such as DC/DC converters, portable electronics, telecommunications, and control units requiring high ripple current capability. K-SIM For a detailed analysis of specific part numbers, please visit ksim.kemet.com to access KEMET’s K-SIM software. KEMET K-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels. One world. One KEMET © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 1 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Ordering Information T 495 X Capacitor Class Series Case Size T= Tantalum Surge robust low ESR C D X 107 M 010 A H 4095 Capacitance Code (pF) Capacitance Tolerance Rated Voltage (VDC) Failure Rate/ Design Termination Finish Customer Specification Packaging (C-Spec) First two digits represent significant figures. Third digit specifies number of zeros. K = ±10% M = ±20% 006 = 6.3 010 = 10 016 = 16 020 = 20 025 = 25 035 = 35 050 = 50 A= N/A H = Standard soldercoated (SnPb 5% Pb minimum) B = Gold-plated N = Non-magnetic 100% tin (Sn) M = Non-magnetic (SnPb) Tested to meet the Established Reliability Blank = 7" reel 7280 = 13" reel 7610 = Bulk bag 7640 = Bulk plastic box WAFL = Waffle pack Ordering Information – DLA Drawing 95158 95158- 07 M H Drawing Number Dash Number Capacitance Tolerance Termination Finish Capacitor, Fixed, Tantalum Chip, Low ESR See Part Number List K = ±10% M = ±20% H = Solder plated B= Gold-plated Performance Characteristics Item Performance Characteristics Operating Temperature Rated Capacitance Range Capacitance Tolerance Rated Voltage Range −55°C to 125°C 4.7 – 220 μF at 120 Hz/25° C K tolerance (10%), M tolerance (20%) 6 – 50 V DF (120 Hz) Refer to Part Number Electrical Specification Table ESR (100 kHz) Refer to Part Number Electrical Specification Table Leakage Current Refer to Part Number Electrical Specification Table © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 2 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Qualification Test Condition Characteristics Δ C/C Endurance 85°C at rated voltage, 2,000 hours 125°C at 2/3 rated voltage, 2,000 hours Within initial limits DCL Within 1.25 x initial limit ESR Within initial limits Δ C/C Moisture Resistance 65°C to −10°C, 100% RH, 20 cycles, no load Temperature Stability MIL–STD–202, Method 107, Condition B, mounted, −55°C to 125°C, 1,000 cycles Extreme temperature exposure at a succession of continuous steps at +25°C, −55°C, +25°C, +85°C, +125°C, +25°C Within 150 x initial limit DCL Within 200 x initial limit Within initial limits DCL Within 1.25 x initial limit ESR Within initial limits +25°C −55°C +85°C +125°C Δ C/C IL* ±10% ±10% ±20% DF IL IL 1.5 x IL 1.5 x IL DCL IL n/a 10 x IL 12 x IL MIL–STD–202, Method 210, 1 cycle Resistance to Solvents Mechanical Shock/ Vibration 25°C and 85°C, 1.32 x rated voltage 1,000 cycles (125°C, 1.2 x rated voltage) MIL–STD–202, Method 215, Aqueous wash chemical or equivalent MIL–STD–202, Method 213, Condition I, 100 G peak MIL–STD–202, Method 204, Condition D, 10 Hz to 2,000 Hz, 20 G peak Within ±5% of initial value DF Within initial limits DCL Within initial limits Δ C/C Surge Voltage Within ±5% of initial value DF Δ C/C Resistance to Solder Heat Within +/−15% of initial value DF Δ C/C Thermal Shock Within ±10% of initial value DF Within ±5% of initial value DF Within initial limits DCL Within initial limits ESR Within initial limits Δ C/C Within ±10 of initial value DF Within initial limits DCL Within initial limits Δ C/C Within ±10% of initial value DF Within initial limits DCL Within initial limits *IL = Initial limit Certification DLA Drawing 95158 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 3 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Dimensions – Millimeters (Inches) Metric will govern CATHODE (−) END VIEW SIDE VIEW ANODE (+) END VIEW BOTTOM VIEW A B W B H T X F E S G K Termination cutout at KEMET's option, either end S Case Code L Component K ±0.20 F ±0.1 S ±0.3 B ±0.15 X ± 0.10 ±(0.008) (Ref) ±(0.004) (Ref) ±(0.012) (Ref) ±(0.006) (Ref) ±(0.004)(Ref) KEMET L W H C 6.0±0.3 (0.236±0.012) 3.2±0.3 (0.126±0.012) 2.5±0.3 (0.098±0.012) 1.4 (0.055) 2.2 (0.087) 1.3 (0.051) 0.5 (0.020) 0.10 (0.004 ) D 7.3±0.3 (0.287±0.012) 4.3±0.3 (0.169±0.012) 2.8±0.3 (0.110±0.012) 1.5 (0.059) 2.4 (0.094) 1.3 (0.051) 0.5 (0.020) 0.10 (0.004 ) X 7.3±0.3 (0.287±0.012) 4.3±0.3 (0.169±0.012) 4.0±0.3 (0.157±0.012) 2.3 (0.091) 2.4 (0.094) 1.3 (0.051) 0.5 (0.020) 0.10 (0.004 ) T (Ref) A (Min) G (Ref) E (Ref) 0.13 (0.005) 0.13 (0.005) 0.13 (0.005) 3.1 (0.122) 3.8 (0.150) 3.8 (0.150) 2.8 (0.110) 3.5 (0.138) 3.5 (0.138) 2.4 (0.094) 3.5 (0.138) 3.5 (0.138) Weight Case Size Typical Weight (mg) C/6032 224.48 D/7343 446.84 X/7343 652.04 These weights are provided as reference. If exact weights are needed, please contact your KEMET Sales Representative © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 4 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Table 1 – Ratings & Part Number Reference Rated Voltage Rated Cap Case Code/ Case Size KEMET Part Number DLA (DSCC) 95158/1 DC Leakage VDC at 85°C µF KEMET/EIA (See below for part options) Drawing Number µA +25°C Max./5 Min. 6.3 6.3 6.3 6.3 10 10 10 10 10 10 10 16 16 16 20 20 20 20 25 25 25 25 35 35 35 35 35 35 50 68 150 220 220 47 68 100 100 150 150 220 33 47 100 15 22 47 68 15 15 22 33 4.7 6.8 10 10 15 22 4.7 D/7343-31 X/7343-43 X/7343-43 D/7343-31 D/7343-31 X/7343-43 D/7343-31 X/7343-43 X/7343-43 D/7343-31 X/7343-43 D/7343-31 D/7343-31 X/7343-43 D/7343-31 D/7343-31 X/7343-43 X/7343-43 D/7343-31 X/7343-43 X/7343-43 X/7343-43 C/6032-28 X/7343-43 D/7343-31 X/7343-43 X/7343-43 X/7343-43 X/7343-43 T495D686(1)006A(2)4095 T495X157(1)006A(2)4095 T495X227(1)006A(2)4095 T495D227(1)006A(2)4095 T495D476(1)010A(2)4095 T495X686(1)010A(2)4095 T495D107(1)010A(2)4095 T495X107(1)010A(2)4095 T495X157(1)010A(2)4095 T495D157(1)010A(2)4095 T495X227(1)010A(2)4095 T495D336(1)016A(2)4095 T495D476(1)016A(2)4095 T495X107(1)016A(2)4095 T495D156(1)020A(2)4095 T495D226(1)020A(2)4095 T495X476(1)020A(2)4095 T495X686(1)020A(2)4095 T495D156(1)025A(2)4095 T495X156(1)025A(2)4095 T495X226(1)025A(2)4095 T495X336(1)025A(2)4095 T495C475(1)035A(2)4095 T495X685(1)035A(2)4095 T495D106(1)035A(2)4095 T495X106(1)035A(2)4095 T495X156(1)035A(2)4095 T495X226(1)035A(2)4095 T495X475(1)050A(2)4095 95158-01(1)(2) 95158-02(1)(2) 95158-03(1)(2) 95158-25(1)(2) 95158-04(1)(2) 95158-05(1)(2) 95158-06(1)(2) 95158-07(1)(2) 95158-08(1)(2) 95158-26(1)(2) 95158-28(1)(2) 95158-09(1)(2) 95158-10(1)(2) 95158-11(1)(2) 95158-12(1)(2) 95158-13(1)(2) 95158-14(1)(2) 95158-15(1)(2) 95158-16(1)(2) 95158-17(1)(2) 95158-18(1)(2) 95158-19(1)(2) 95158-29(1)(2) 95158-20(1)(2) 95158-27(1)(2) 95158-21(1)(2) 95158-22(1)(2) 95158-23(1)(2) 95158-24(1)(2) VDC at 85°C µF KEMET/EIA (See below for part options) Drawing Number Rated Voltage Rated Cap Case Code/ Case Size KEMET Part Number DLA (DSCC) 95158/1 DF ESR % at +25°C mΩ at 25°C 120 Hz 100 kHz Max. Max. 3.3 4.0 175 7.2 6.0 125 13.2 8.0 100 13.2 8.0 100 3.8 4.0 200 5.4 4.0 150 10.0 8.0 100 8.0 6.0 100 15.0 8.0 100 15.0 8.0 100 15.0 8.0 100 4.2 4.0 250 7.5 6.0 200 16.0 8.0 125 2.4 4.0 275 3.5 4.0 275 7.5 4.0 150 13.6 6.0 150 3.8 6.0 275 3.0 4.0 200 4.4 4.0 225 6.6 4.0 175 1.7 6.0 600 1.9 4.0 300 3.5 4.0 300 2.8 4.0 250 5.3 6.0 225 7.7 6.0 300 1.9 4.0 300 % at +25°C mΩ at 25°C µA +25°C 120 Hz 100 kHz Max./5 Min. Max. Max. DC Leakage DF ESR Maximum Allowable Ripple Current (rms) mA at +25°C 100 kHz 926 1149 1285 1225 866 1049 1225 1285 1285 1225 1285 775 866 1149 739 739 1049 1049 739 908 856 971 428 742 707 812 856 742 742 mA at +25°C 100 kHz mA at +85°C 100 kHz 833 1034 1157 1103 779 944 1103 1157 1157 1103 1157 698 779 1034 665 665 944 944 665 817 770 874 385 668 636 731 770 668 668 mA at +85°C 100 kHz mA at +125°C 100 kHz 370 460 514 490 346 420 490 514 514 490 514 310 346 460 296 296 420 420 296 363 342 388 171 297 283 325 342 297 297 mA at +125°C 100 kHz Maximum Allowable Ripple Current (rms) Maximum Operating Temp. °C 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 °C Maximum Operating Temp. MSL Reflow Temp ≤ 260°C 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Reflow Temp. ≤ 260°C MSL (1) To complete KEMET part number, insert M for ±20% or K for ±10%. Designates Capacitance tolerance. (2) To complete KEMET part number, insert B = Gold-plated, H = Standard Solder coated (SnPb 5% Pb minimum), N = Non-Magnetic 100% Tin (Sn) or M = Non-Magnetic (SnPb). Designates Termination Finish. Refer to Ordering Information for additional detail. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 5 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Recommended Voltage Derating Guidelines 85°C to 125°C VR 67% of VR 50% of VR 33% of VR 120% 100% % Working Voltage % Change in working DC voltage with temperature Recommended maximum application voltage −55°C to 85°C 80% % Change in Working DC Voltage with Temperature 67% 60% 40% 20% 0% −55 Recommended Maximum Application Voltage (As % of Rated Voltage) 25 33% 85 Temperature (ºC) 125 Ripple Current/Ripple Voltage Permissible AC ripple voltage and current are related to equivalent series resistance (ESR) and the power dissipation capabilities of the device. Permissible AC ripple voltage which may be applied is limited by two criteria: 1. The positive peak AC voltage plus the DC bias voltage, if any, must not exceed the DC voltage rating of the capacitor. 2. The negative peak AC voltage in combination with bias voltage, if any, must not exceed the allowable limits specified for reverse voltage. See the Reverse Voltage section for allowable limits. The maximum power dissipation by case size can be determined using the table at right. The maximum power dissipation rating stated in the table must be reduced with increasing environmental operating temperatures. Refer to the table below for temperature compensation requirements. KEMET Case Code EIA Case Code Maximum Power Dissipation (Pmax) mWatts at 25°C with +20°C Rise C D X 6032–28 7343–31 7343–43 110 150 165 Using the Pmax of the device, the maximum allowable rms ripple current or voltage may be determined. I(max) = √Pmax/R E(max) = Z √Pmax/R I = rms ripple current (amperes) E = rms ripple voltage (volts) Pmax = maximum power dissipation (watts) R = ESR at specified frequency (ohms) Z = Impedance at specified frequency (ohms) Temperature Compensation Multipliers for Maximum Ripple Current T ≤ 25°C 1.00 T ≤ 85°C 0.90 T ≤ 125°C 0.40 T= Environmental Temperature The maximum power dissipation rating must be reduced with increasing environmental operating temperatures. Refer to the Temperature Compensation Multiplier table for details. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 6 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Reverse Voltage Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The positive terminal is identified on the capacitor body by a stripe plus in some cases a beveled edge. A small degree of transient reverse voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within these limits. Temperature Permissible Transient Reverse Voltage 25°C 85°C 125°C 15% of Rated Voltage 5% of Rated Voltage 1% of Rated Voltage Table 2 – Land Dimensions/Courtyard KEMET Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) Case EIA W L S V1 V2 W L S V1 V2 W L S V1 V2 C 6032–28 2.35 2.77 2.37 8.92 4.50 2.23 2.37 2.57 7.82 4.00 2.13 1.99 2.73 6.96 3.74 D 7343–31 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 X1 7343–43 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351). 1 Height of these chips may create problems in wave soldering. V1 L L W W V2 S Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 7 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Soldering Process The KEMET families of surface mount capacitors are compatible with wave (single or dual), convection, IR, or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J–STD–020D standard for moisture sensitivity testing. The devices can safely withstand a maximum of three reflow passes at these conditions. Please note that although the X/7343–43 case size can withstand wave soldering, the tall profile (4.3 mm maximum) dictates care in wave process development. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (TSmin) 100°C 150°C Temperature Maximum (TSmax) 150°C 200°C Time (ts) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds Ramp-up Rate (TL to TP) 3°C/second maximum 3°C/second maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 220°C* 235°C** 60 – 150 seconds 250°C* 260°C** 20 seconds maximum 30 seconds maximum 6°C/second maximum 6°C/second maximum 6 minutes maximum 8 minutes maximum Peak Temperature (TP) Time within 5°C of Maximum Peak Temperature (tP) Ramp-down Rate (TP to TL) Time 25°C to Peak Temperature Note: All temperatures refer to the center of the package, measured on the During typical reflow operations, a slight darkening of the gold-colored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change. Temperature Hand soldering should be performed with care due to the package body surface that is facing up during assembly reflow. difficulty in process control. If performed, care should be * For Case Size height > 2.5 mm ** For Case Size height ≤ 2.5 mm taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflow TP tP Maximum Ramp-up Rate = 3°C/second occurs. Once reflow occurs, the iron should be removed Maximum Ramp-down Rate = 6°C/second TL immediately. “Wiping” the edges of a chip and heating the top tL surface is not recommended. Tsmax Tsmin 25 ts 25°C to Peak Time Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably within three years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 8 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Construction Polarity Stripe (+) Molded Epoxy Case Detailed Cross Section Silver Paint (Fourth Layer) Polarity Bevel (+) Tantalum Wire Leadframe (− Cathode) Washer Tantalum Wire Weld (to attach wire) Carbon (Third Layer) Silver Adhesive Leadframe (+ Anode) Molded Epoxy Case MnO2 (Second Layer) Washer Ta2O5 Dielectric (First Layer) Tantalum Capacitor Marking Date Code * Polarity Indicator (+) 1 digit = last number of year 5 = 2015 6 = 2016 7 = 2017 8 = 2018 9 = 2019 2nd and 3rd digit = week of the year 01 = 1st week of the year to 52 = 52nd week of the year st Picofarad Code KEMET ID Rated Voltage Date Code* * 908 = 8th week of 2019 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 9 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Tape & Reel Packaging Information KEMET’s molded chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in accordance with EIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system is compatible with all tape-fed automatic pick-and-place systems. Right hand orientation only (+) Embossed carrier (−) Embossment Top tape thickness 0.10 mm (0.004”) maximum thickness 180 mm (7.0”) or 330 mm (13.”) 8 mm (0.315”) or 12 mm (0.472”) Table 3 – Packaging Quantity Case Code KEMET S T M U L W Z V A B C D Q Y X E/T428P H O EIA 3216-12 3528-12 3528-15 6032-15 6032-19 7343-15 7343-17 7343-20 3216-18 3528-21 6032-28 7343-31 7343-12 7343-40 7343-43 7360-38 7360-20 7360-43 Tape Width (mm) 7" Reel* 13" Reel* 8 8 8 12 12 12 12 12 8 8 12 12 12 12 12 12 12 12 2,500 3,000 2,500 1,000 1,000 1,000 1,000 1,000 2,000 2,000 500 500 1,000 500 500 500 1,000 250 10,000 10,000 8,000 5,000 3,000 3,000 3,000 3,000 9,000 8,000 3,000 2,500 3,000 2,000 2,000 2,000 2,500 1,000 * No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 10 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1, Table 4 ØD1 Cover Tape User Direction of Unreeling Table 4 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm D1 Minimum Note 1 D0 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 1.0 (0.039) 1.5 (0.059) E1 P0 R Reference S1 Minimum T1 T Maximum Note 2 Note 3 Maximum P2 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 25.0 (0.984) 30 (1.181) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch B1 Maximum Note 4 8 mm Single (4 mm) 4.35 (0.171) 6.25 (0.246) 12 mm Single (4 mm) and Double (8 mm) 8.2 (0.323) 10.25 (0.404) E2 Minimum F P1 3.5 ±0.05 2.0 ±0.05 or 4.0 ±0.10 (0.138 ±0.002) (0.079 ±0.002 or 0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) or 5.5 ±0.05 4.0 ±0.10 (0.157 ±0.004) or (0.217 ±0.002) 8.0 ±0.10 (0.315 ±0.004) T2 Maximum W Maximum A0, B0 & K0 2.5 (0.098) 8.3 (0.327) 4.6 (0.181) 12.3 (0.484) Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape, with or without components, shall pass around R without damage (see Figure 4). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3). (e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 11 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Packaging Information Performance Notes 1. Cover tape break force: 1.0 kg minimum. 2. Cover tape peel strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8, 12 Bo Maximum Rotation ( 20 ° T) ° s Tape Maximum Width (mm) Rotation ( 8, 12 20 Typical Component Centerline ° S) Ao Figure 3 – Maximum Lateral Movement Figure 4 – Bending Radius 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum Embossed Carrier Punched Carrier R © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R T2071_T495_HRA • 12/13/2019 12 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Figure 5 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 5 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 (0.521 +0.02/−0.008) 20.2 (0.795) 12 mm Variable Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/−0.0 (0.331 +0.059/−0.0) 12.4 +2.0/−0.0 (0.488 +0.078/−0.0) 14.4 (0.567) 18.4 (0.724) Shall accommodate tape width without interference © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 13 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum Leader 400 mm minimum Top Cover Tape Figure 7 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 14 Tantalum Surface Mount Capacitors – High Reliability T495 High Reliability Alternative Surge Robust, Low ESR MnO2 DLA Drawing 95158 KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com T2071_T495_HRA • 12/13/2019 15
T495X475K050AH4095 价格&库存

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T495X475K050AH4095
  •  国内价格 香港价格
  • 500+48.18724500+5.97887
  • 1000+44.682741000+5.54405

库存:135

T495X475K050AH4095
  •  国内价格 香港价格
  • 1+78.878741+9.78695
  • 10+68.3358710+8.47883
  • 50+61.3289050+7.60944
  • 100+53.26879100+6.60937

库存:135