T502D106K025AG61107280 数据手册
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO2 230°C
Overview
The KEMET T502 is a high temperature product that offers
optimum performance characteristics in applications
with operating temperatures up to 230°C. The T502 is
classified as moisture sensitivity level (MSL) 1 under J
STD 020: unlimited floor life time at ≤ 30°C/85% RH.
Due to the potential use of high melting point solders, KEMET
has taken the initiative to package this product in moisture
barrier bags with desiccant and a humidity indicator card.
Benefits
• F-Tech and 100% SBDS (KEMET's patented Simulated
Breakdown Voltage Screening)
• 3 Sigma Screening for iL, DF, and ESR
• Qualified at 1,000 hours of life test at 230°C at 0.33 Vr
• Voltage derating of 67% at 230°C
• Unique high temperature material set
• Meets or exceeds EIA standard 535BAAC
• Standard gold-plated terminations
• RoHS compliant
• Operating temperature range of −55ºC to +230ºC
• Voltage derating applies
• Taped and reeled per EIA 481
• Meets MSL 1 requirements for Pb-free assembly according
to JEDEC J–STD–020
• Packaged in moisture barrier bags with desiccant and a
humidity indicator card
• Surge current options available
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Applications
Typical applications include decoupling and filtering for very high temperature environments such as measurement-whiledrilling (MWD) in down-hole applications.
K-SIM
For a detailed analysis of specific part numbers, please visit ksim.kemet.com to access KEMET’s K-SIM software. KEMET
K-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels.
One world. One KEMET
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
1
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Ordering Information
T
502
Capacitor
Class
Series
T=
Tantalum
High
temperature
230°C
D
685
M
Case Capacitance Capacitance
Size Code (pF)
Tolerance
B
C
D
First two digits
represent
significant
figures. Third
digit specifies
number of
zeros.
K = ±10%
M = ±20%
035
A
G
61
10
Rated
Voltage
(VDC)
Failure Rate/
Design
Termination
Finish
Performance
ESR
A = N/A
G = Gold-plated
61 = Surge none
62 = Surge at 25°C
63 = Surge −55°C and +85°C
10 =
Standard
ESR
016 = 16
020 = 20
025 = 25
035 = 35
Packaging
(C-Spec)
Blank = 7" reel
7280 = 13" reel
Performance Characteristics
Item
Performance Characteristics
Operating Temperature
Rated Capacitance Range
Capacitance Tolerance
Rated Voltage Range
−55°C to 230°C
4.7 – 10 µF at 120 Hz/25°C
K Tolerance (10%), M Tolerance (20%)
16 – 35 V
DF (120 Hz)
Refer to Part Number Electrical Specification Table
ESR (100 kHz)
Refer to Part Number Electrical Specification Table
Leakage Current
≤ 0.01 CV (µA) at rated voltage after 5 minutes
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
2
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Qualification
Test
Condition
Characteristics
Δ C/C
Endurance
230°C at 1/3 rated voltage, 500 hours
Within 1.5 x initial limits
DCL
1 mAmp maximum
ESR
Within 2.0 x initial limits
Δ C/C
Storage Life
230°C at 0 volts, 1,000 hours
Temperature Stability
Mechanical Shock/
Vibration
85°C, 85% RH, 0 V, 500 hours
Extreme temperature exposure at a
succession of continuous steps at +25°C,
−55°C, +25°C, +85°C, +150°C, +25°C
Within ±10% of initial value
DF
Within 1.5 x initial limits
DCL
1 mAmp maximum
ESR
Within 2.0 x initial limits
Δ C/C
Humidity
Within ±10% of initial value
DF
Within ±10% of initial value
DF
Within initial limits
DCL
Within initial limits
ESR
Within initial limits
+25°C
−55°C
+85°C
+150°C
Δ C/C
IL*
±10%
±10%
±20%
DF
IL
IL
1.5 x IL
1.5 x IL
DCL
IL
N/A
10 x IL
12 x IL
MIL–STD–202, Method 213, Condition I, 100 G peak
MIL–STD–202, Method 204, 10 Hz to 2,000 Hz, 5G for
20 minutes, 12 cycles each of 3 orientations
Δ C/C
Within ±10 of initial value
DF
Within initial limits
DCL
Within initial limits
*IL = Initial limit
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
3
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Electrical Characteristics
Impedance & ESR vs. Frequency
1,000
502D685K035_IMP
502D685K035_ESR
502B106K016_IMP
Impedance, ESR (Ohms)
100
502B106K016_ESR
10
1
0.1
100
1,000
10,000
100,000
1,000,000
10,000,000
Frequency (Hz)
The measurements were taken at room temperature (25°C)
Capacitance vs. Frequency
100
502D685K035_CAP(µF)
502B106K016_CAP(µF)
Capacitance (µF)
10
1
0.1
100
1,000
10,000
100,000
1,000,000
10,000,000
Frequency (Hz)
The measurements were taken at room temperature (25°C)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
4
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Dimensions – Millimeters
CATHODE (-) END VIEW
SIDE VIEW
ANODE (+) END VIEW
BOTTOM VIEW
A
B
W
B
H
F
E
X
T
S
G
P
Termination cutout
at KEMET's option,
either end
S
Case Size
R
L
Component Dimensions
KEMET
EIA
L
W
H
F
S
B (Ref)
X (Ref)
B
3528-21
3.5 ±0.2
(0.138 ±0.008)
2.8 ±0.2
(0.110 ±0.008)
1.9 ±0.2
(0.075 ±0.008)
2.2 ±0.1
(0.087 ±0.004)
0.80 +0.1/-0.3
(0.032 +0.004/-0.011)
0.4 ±0.15
(0.016 ±0.006)
0.10 ±0.10
(0.004 ±0.004)
C
6032-28
6.0 ±0.3
(0.236 ±0.012)
3.2 ±0.3
(0.126 ±0.012)
2.5 ±0.3
(0.098 ±0.012)
2.2 ±0.1
(0.087±0.004)
1.3 (0.051)
±0.3 (0.012)
0.5 ±0.15
(0.020 ±0.006)
0.10 ±0.10
(0.004 ±0.004)
D
7343-31
7.3 ±0.3
(0.287 ±0.012)
4.3 ± 0.3
(0.169 ±0.012)
2.8 ± 0.3
(0.110 ±0.012)
2.4 ±0.1
(0.094 ±0.004)
1.3 ±0.3
(0.051 ±0.012)"
0.5 ±0.15
(0.020 ±0.006)
0.10 ± 0.10
(0.004 ±0.004)
Case Size
Component Dimensions
KEMET
EIA
P (Ref)
R (Ref)
T (Ref)
A (Minimum)
G (Ref)
E (Ref)
Typical Weight (mg)
B
3528-21
0.5 (0.020)
1.0 (0.039)
0.13 (0.005)
1.9
(0.075)
1.8 (0.071)
2.2 (0.087)
53.17
C
6032-28
0.9 (0.035)
1.0 (0.039)
0.13 (0.005)
2.9
(0.114)
2.8 (0.110)
2.4 (0.094)
98.30
D
7343-31
0.9 (0.035)
1.0 (0.039)
0.13 (0.005)
3.8
(0.150)
3.5 (0.138)
3.5 (0.138)
193.46
Notes: (Ref) – Dimensions provided for reference only.
These weights are provided as reference. If exact weights are needed, please contact your KEMET Sales Representative
Table 1 – Ratings & Part Number Reference
Rated
Voltage
Rated
Cap
Case Code/
Case Size
VDC at 85°C
µF
16
20
20
25
25
25
25
35
35
10
4.7
10
4.7
6.8
10
10
4.7
6.8
ESR
Maximum
Allowable
Ripple Current
(rms)
Maximum
Operating
Temp.
% at 25°C
120 Hz Max
Ω at 25°C
100 kHz Max
mA at +45°C 100 kHz
°C
6
6
6
6
6
6
6
6
6
2.8
2.0
1.5
2.0
1.9
1.5
1.8
2.0
1.8
174
235
271
235
271
271
289
235
289
230
230
230
230
230
230
230
230
230
KEMET Part Number
DC
Leakage
DF
KEMET/EIA
(See below for part options)
µA at 25°C Max/
5 Minutes
B/3528-21
C/6032-28
C/6032-28
C/6032-28
C/6032-28
C/6032-28
D/7343-31
C/6032-28
D/7343-31
T502B106(1)016AG(2)10
T502C475(1)020AG(2)10
T502C106(1)020AG(2)10
T502C475(1)025AG(2)10
T502C685(1)025AG(2)10
T502C106(1)025AG(2)10
T502D106(1)025AG(2)10
T502C475(1)035AG(2)10
T502D685(1)035AG(2)10
1.6
0.9
2.0
1.2
1.7
2.5
2.5
1.7
2.4
(1) To complete KEMET part number, insert M for ±20% or K for ±10%. Designates capacitance tolerance.
(2) To complete KEMET part number, insert 61 = None, 62 = 10 cycles +25°C, 63 = 10 cycles −55°C +85°C Designates surge current option.
Refer to Ordering Information for additional detail.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
5
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Recommended Voltage Derating Guidelines
60%
% Rated Voltage
50%
40%
33%
30%
Recommended Temperature
Voltage Derating Guideline
20%
10%
0%
−55
25
85
125
175
200
215
230
Temperature (°C)
Working Voltage
Rated
Voltage
25°C
85°C
125°C
200°C
215°C
230°C
16
20
25
35
16
20
25
35
16
20
25
35
13.1
16.4
20.5
28.7
7.5
9.4
11.8
16.5
6.4
8.0
10
14
5.3
6.6
8.3
11.6
Note: Additional reliability can be obtained through the derating of voltage
Ripple Current/Ripple Voltage
Permissible AC ripple voltage and current are related to
equivalent series resistance (ESR) and the power dissipation
capabilities of the device. Permissible AC ripple voltage
which may be applied is limited by two criteria:
1. The positive peak AC voltage plus the DC bias voltage,
if any, must not exceed the DC voltage rating of the
capacitor.
2. The negative peak AC voltage in combination with
bias voltage, if any, must not exceed the allowable limits
specified for reverse voltage. See the Reverse Voltage
section for allowable limits.
The maximum power dissipation by case size can be
determined using the table at right. The maximum power
dissipation rating stated in the table must be reduced with
increasing environmental operating temperatures. Refer to
the table below for temperature compensation requirements.
Temperature Compensation Multipliers
for Maximum Ripple Current
T ≤ 200°C
1.00
200 ≥ 220°C
0.70
220 ≥ 230°C
0.30
KEMET
Case Code
EIA
Case Code
Maximum Power
Dissipation (Pmax)
mWatts at 25°C
with +20°C Rise
B
C
D
3528–21
6032–28
7343–31
85
110
150
The maximum power dissipation rating must be reduced with increasing
environmental operating temperatures. Refer to the Temperature
Compensation Multiplier table for details.
Using the P max of the device, the maximum allowable rms
ripple current or voltage may be determined.
I(max) = √P max/R
E(max) = Z √P max/R
I = rms ripple current (amperes)
E = rms ripple voltage (volts)
P max = maximum power dissipation (watts)
R = ESR at specified frequency (ohms)
Z = Impedance at specified frequency (ohms)
T = Environmental temperature
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
6
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong
polarity. The positive terminal is identified on the capacitor body by a stripe, plus in some cases a beveled edge. A small
degree of transient reverse voltage is permissible for short periods per the below table. The capacitors should not be
operated continuously in reverse mode, even within these limits.
Temperature
Permissible Transient Reverse Voltage
25°C
85°C
125°C
15% of Rated Voltage
5% of Rated Voltage
1% of Rated Voltage
Table 2 – Land Dimensions/Courtyard
KEMET
Metric
Size
Code
Density Level A:
Maximum (Most) Land
Protrusion (mm)
Density Level B:
Median (Nominal) Land
Protrusion (mm)
Density Level C:
Minimum (Least) Land
Protrusion (mm)
Case
EIA
W
L
S
V1
V2
W
L
S
V1
V2
W
L
S
V1
V2
B
3528–21
2.35
2.21
0.92
6.32
4.00
2.23
1.80
1.12
5.22
3.50
2.13
1.42
1.28
4.36
3.24
C
6032-28
2.35
2.77
2.37
8.92
4.50
2.23
2.37
2.57
7.82
4.00
2.13
1.99
2.73
6.96
3.74
D
7343–31
2.55
2.77
3.67
10.22
5.60
2.43
2.37
3.87
9.12
5.10
2.33
1.99
4.03
8.26
4.84
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351).
1
Height of these chips may create problems in wave soldering.
2
Land pattern geometry is too small for silkscreen outline.
V1
L
L
W
W
V2
S
Grid Placement Courtyard
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
7
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Soldering Process
Please note that although the X/7343–43 case size can
withstand wave soldering, the tall profile (4.3 mm maximum)
dictates care in wave process development.
Hand soldering should be performed with care due to the
difficulty in process control. If performed, care should be
taken to avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder pad,
applying solder between the pad and the termination, until
reflow occurs. Once reflow occurs, the iron should be
removed immediately. “Wiping” the edges of a chip and
heating the top surface is not recommended.
During typical reflow operations, a slight darkening of the
gold-colored epoxy may be observed. This slight darkening is
normal and not harmful to the product. Marking permanency
is not affected by this change.
Profile Feature
SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (TSmax)
150°C
200°C
Time (t s) from Tsmin to Tsmax)
60 – 120 seconds
60 – 120 seconds
3°C/second maximum
Ramp-up Rate (TL to TP)
3°C/second maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (t L)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
220°C*
235°C**
250°C*
260°C**
Time within 5°C of Maximum
Peak Temperature (t P)
20 seconds maximum
30 seconds maximum
Ramp-down Rate (TP to TL)
6°C/second maximum
6°C/second maximum
Time 25°C to Peak Temperature
6 minutes maximum
8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* For Case Size height > 2.5 mm
** For Case Size height ≤ 2.5 mm
TP
TL
Temperature
The KEMET families of surface mount capacitors are
compatible with wave (single or dual), convection, IR,
or vapor phase reflow techniques. Preheating of these
components is recommended to avoid extreme thermal
stress. KEMET's recommended profile conditions for
convection and IR reflow reflect the profile conditions of the
IPC/J–STD–020D standard for moisture sensitivity testing.
The devices can safely withstand a maximum of three reflow
passes at these conditions.
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensation
on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability, chip
stock should be used promptly, preferably within three years of receipt.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
8
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Construction
Polarity Stripe (+)
Molded Epoxy
Case
Detailed Cross Section
Nickel Plating
(Fourth Layer)
Polarity
Bevel (+)
Tantalum Wire
Leadframe
(− Cathode)
Washer
Tantalum Wire
Weld
(to attach wire)
Carbon
(Third Layer)
TLPS
Leadframe
(+ Anode)
Molded Epoxy
Case
MnO2
(Second Layer)
Washer
Ta2O5 Dielectric
(First Layer)
Tantalum
Capacitor Marking
Date Code *
KEMET High
Temperature
MnO2
Polarity
Indicator (+)
Picofarad
Code
KEMET
ID
Rated
Voltage
1 digit = Last number of Year
5 = 2015
6 = 2016
7 = 2017
8 = 2018
9 = 2019
2nd and 3rd digit = Week of the
Year
01 = 1st week of the Year to
52 = 52nd week of the Year
st
Date
Code*
* 908 = 8th week of 2019
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
9
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Tape & Reel Packaging Information
KEMET’s molded chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in accordance with
EIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system
is compatible with all tape-fed automatic pick-and-place systems.
Right hand
orientation
only
(+)
Embossed carrier
(−)
Embossment
Top tape thickness
0.10 mm (0.004”)
maximum thickness
180 mm (7.0”) or
330 mm (13.”)
8 mm (0.315”) or
12 mm (0.472”)
Table 3 – Packaging Quantity
Case Code
KEMET
S
T
M
U
W
V
A
B
C
D
X
E/T428P
EIA
3216-12
3528-12
3528-15
6032-15
7343-15
7343-20
3216-18
3528-21
6032-28
7343-31
7343-43
7360-38
Tape Width
(mm)
7" Reel*
13" Reel*
8
8
8
12
12
12
8
8
12
12
12
12
2,500
3,000
2,500
1,000
1,000
1,000
2,000
2,000
500
500
500
500
10,000
10,000
8,000
5,000
3,000
3,000
9,000
8,000
3,000
2,500
2,000
2,000
* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
10
Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
P0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1, Table 4
ØD1
Cover Tape
User Direction of Unreeling
Table 4 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
D1 Minimum
Note 1
D0
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.0
(0.039)
1.5
(0.059)
E1
P0
R Reference S1 Minimum
T1
T Maximum
Note 2
Note 3
Maximum
P2
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
25.0
(0.984)
30
(1.181)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
B1 Maximum
Note 4
8 mm
Single (4 mm)
4.35
(0.171)
6.25
(0.246)
12 mm
Single (4 mm)
and Double
(8 mm)
8.2
(0.323)
10.25
(0.404)
E2 Minimum
F
P1
3.5 ±0.05
2.0 ±0.05 or 4.0 ±0.10
(0.138 ±0.002) (0.079 ±0.002 or 0.157 ±0.004)
2.0 ±0.05 (0.079 ±0.002) or
5.5 ±0.05
4.0 ±0.10 (0.157 ±0.004) or
(0.217 ±0.002)
8.0 ±0.10 (0.315 ±0.004)
T2 Maximum W Maximum A0, B0 & K0
2.5
(0.098)
8.3
(0.327)
4.6
(0.181)
12.3
(0.484)
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape, with or without components, shall pass around R without damage (see Figure 4).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3).
(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
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Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Packaging Information Performance Notes
1. Cover tape break force: 1.0 kg minimum.
2. Cover tape peel strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 newton (10 to 100 gf)
12 mm
0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Width (mm)
8, 12
Bo
Maximum
Rotation (
20
°
T)
°
s
Tape
Maximum
Width (mm) Rotation (
8, 12
20
Typical Component Centerline
°
S)
Ao
Figure 3 – Maximum Lateral Movement
Figure 4 – Bending Radius
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
Embossed
Carrier
Punched
Carrier
R
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Bending
Radius
R
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Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Figure 5 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 5 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
12 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
12.4 +2.0/−0.0
(0.488 +0.078/−0.0)
14.4
(0.567)
18.4
(0.724)
Shall accommodate tape
width without interference
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
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Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
Figure 6 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum Leader
400 mm minimum
Top Cover Tape
Figure 7 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T2075_T502 • 2/14/2020
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Tantalum Surface Mount Capacitors – High Temperature
T502 MnO 2 230°C
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
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